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公开(公告)号：US20050104608A1
公开(公告)日：2005-05-19
申请号：US10714215
申请日：2003-11-13
CPC分类号： G01R31/2886
摘要： A system and method for utilizing a multi-probe tester to test an electrical device having a plurality of contact pads. Multi-probe tester test probes and electrical device contact pads are arrayed in a common distribution pitch, and a means for masking test probes masks at least one test probe, thereby preventing the at least one test probe from returning a test result to the testing apparatus. In one embodiment the means for masking test probes is a mask membrane physically preventing at least one test probe from making contact with the electrical device. In another embodiment, the means for masking is at least one software command configured to cause an input from at least one test probe to be disregarded during a test routine. Another embodiment features both mask membrane and software command probe masking.
摘要翻译： 一种利用多探针测试仪测试具有多个接触垫的电气设备的系统和方法。 多探头测试器测试探针和电气设备接触垫以公共分配间距排列，并且用于掩蔽测试探针的装置掩蔽至少一个测试探针，从而防止至少一个测试探针将测试结果返回到测试装置 。 在一个实施例中，用于掩蔽测试探针的装置是物理上防止至少一个测试探针与电气装置接触的掩模膜。 在另一个实施例中，用于屏蔽的装置是至少一个软件命令，配置成在测试例程期间使来自至少一个测试探针的输入被忽略。 另一个实施例具有掩膜膜和软件命令探针掩蔽。
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公开(公告)号：US07118385B1
公开(公告)日：2006-10-10
申请号：US11162779
申请日：2005-09-22
IPC分类号： H01R12/00
CPC分类号： H05K7/1061
摘要： A self-aligning socket for an integrated circuit package includes an outer frame and an array of contacts configured for alignment with corresponding conductive pads on the bottom of the integrated circuit package. The outer frame further includes a first plurality of alignment ball bearings configured thereon, the ball bearings mounted on cantilevered spring rods.
摘要翻译： 用于集成电路封装的自对准插座包括外框架和触头阵列，其被配置为与集成电路封装的底部上的对应导电焊盘对准。 外框架还包括构造在其上的第一多个对准球轴承，球轴承安装在悬臂弹簧杆上。
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公开(公告)号：US20070054514A1
公开(公告)日：2007-03-08
申请号：US11162173
申请日：2005-08-31
申请人： David Long , Paul Bodenweber , Jason Miller , Yuet-Ying Yu
发明人： David Long , Paul Bodenweber , Jason Miller , Yuet-Ying Yu
IPC分类号： H01R12/00
CPC分类号： G01R1/0433 , G01R3/00 , G01R35/00 , H01R12/52 , H01R12/7005 , H01R12/7076 , H01R12/714 , H05K7/1061
摘要： An apparatus and method to determine the amount of misalignment between a chip carrier and socket by the use of an inspection master. The inspection master is tailored to the perimeter size of the chip carrier and contains alignment marks on the same array as the electrical contact pads of the chip carrier. The inspection master allows bad sockets to be screened out prior to use on a chip carrier and also provides a quantified characterization of the socket array positional error which can be used to adjust the socket fabrication process.
摘要翻译： 一种通过使用检验母版来确定芯片载体和插座之间的未对准量的装置和方法。 检测主机适合于芯片载体的周长尺寸，并且在与芯片载体的电接触焊盘相同的阵列上包含对准标记。 检查主机允许在使用芯片载体之前将坏插槽进行屏蔽，并且还提供可用于调整插座制造工艺的插座阵列位置误差的量化特征。
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