公开(公告)号：US08648617B2

公开(公告)日：2014-02-11

申请号：US13022174

申请日：2011-02-07

申请人： Yuji Maruyama ,  Tatsuhiro Mizumasa ,  Takayuki Nakashiro ,  Shigeru Gotoh ,  Takayuki Yano ,  Susumu Koshinuma ,  Shunsuke Taniguchi ,  Yuki Yanagisako

发明人： Yuji Maruyama ,  Tatsuhiro Mizumasa ,  Takayuki Nakashiro ,  Shigeru Gotoh ,  Takayuki Yano ,  Susumu Koshinuma ,  Shunsuke Taniguchi ,  Yuki Yanagisako

IPC分类号： G01R31/26

CPC分类号： G01R31/2884 ,  H01L22/32 ,  H01L2224/02166 ,  H01L2224/05554 ,  H01L2924/13091 ,  H01L2924/00

摘要： According to the following disclosure, disclosed is a semiconductor device including: an internal circuit configured to receive and output a signal current; a current mirror unit outputting a copied current corresponding to the signal current; and a test pad from which the copied current is taken out.

摘要翻译： 根据以下公开，公开了一种半导体器件，包括：内部电路，被配置为接收和输出信号电流; 输出与信号电流对应的复制电流的电流镜单元; 以及从其中取出复制的电流的测试垫。

公开(公告)号：US20110221466A1

公开(公告)日：2011-09-15

申请号：US13022174

申请日：2011-02-07

申请人： Yuji MARUYAMA ,  Tatsuhiro Mizumasa ,  Takayuki Nakashiro ,  Shigeru Gotoh ,  Takayuki Yano ,  Susumu Koshinuma ,  Shunsuke Taniguchi ,  Yuki Yanagisako

发明人： Yuji MARUYAMA ,  Tatsuhiro Mizumasa ,  Takayuki Nakashiro ,  Shigeru Gotoh ,  Takayuki Yano ,  Susumu Koshinuma ,  Shunsuke Taniguchi ,  Yuki Yanagisako

IPC分类号： G01R31/26 ,  H01L23/58

CPC分类号： G01R31/2884 ,  H01L22/32 ,  H01L2224/02166 ,  H01L2224/05554 ,  H01L2924/13091 ,  H01L2924/00

摘要： According to the following disclosure, disclosed is a semiconductor device including: an internal circuit configured to receive and output a signal current; a current mirror unit outputting a copied current corresponding to the signal current; and a test pad from which the copied current is taken out.

摘要翻译： 根据以下公开，公开了一种半导体器件，包括：内部电路，被配置为接收和输出信号电流; 输出与信号电流对应的复制电流的电流镜单元; 以及从其中取出复制的电流的测试垫。

公开(公告)号：US08159250B2

公开(公告)日：2012-04-17

申请号：US12500895

申请日：2009-07-10

申请人： Yuji Maruyama ,  Kazuhiro Tashiro ,  Kazuhiko Shimabayashi ,  Shigeru Goto ,  Takayuki Nakashiro ,  Susumu Koshinuma ,  Masayoshi Shirakawa

发明人： Yuji Maruyama ,  Kazuhiro Tashiro ,  Kazuhiko Shimabayashi ,  Shigeru Goto ,  Takayuki Nakashiro ,  Susumu Koshinuma ,  Masayoshi Shirakawa

IPC分类号： G01R31/00

CPC分类号： G01R1/07314 ,  G01R1/07371

摘要： A testing device of a semiconductor device includes a first board having a plurality of openings; a frame body provided in the openings, the frame body having a frame in which a plurality of probe needles is provided; and a plurality of second boards provided perpendicular to the first board in the periphery of the openings, the second boards being connected to the first board; wherein the probe needles pierce the frame so as to be connected to the second boards from the periphery of the frame body via the openings.

摘要翻译： 半导体器件的测试装置包括具有多个开口的第一板; 设置在所述开口中的框体，所述框体具有框架，所述框架设置有多个探针; 以及在所述开口周边垂直于所述第一基板设置的多个第二板，所述第二板连接到所述第一板; 其特征在于，所述探针针穿过所述框架，从所述框体的周缘经由所述开口与所述第二基板连接。

公开(公告)号：US20090267630A1

公开(公告)日：2009-10-29

申请号：US12500895

申请日：2009-07-10

申请人： Yuji Maruyama ,  Kazuhiro Tashiro ,  Kazuhiko Shimabayashi ,  Shigeru Goto ,  Takayuki Nakashiro ,  Susumu Koshinuma ,  Masayoshi Shirakawa

发明人： Yuji Maruyama ,  Kazuhiro Tashiro ,  Kazuhiko Shimabayashi ,  Shigeru Goto ,  Takayuki Nakashiro ,  Susumu Koshinuma ,  Masayoshi Shirakawa

IPC分类号： G01R31/02 ,  G01R31/26

CPC分类号： G01R1/07314 ,  G01R1/07371

摘要： A testing device of a semiconductor device includes a first board having a plurality of openings; a frame body provided in the openings, the frame body having a frame in which a plurality of probe needles is provided; and a plurality of second boards provided perpendicular to the first board in the periphery of the openings, the second boards being connected to the first board; wherein the probe needles pierce the frame so as to be connected to the second boards from the periphery of the frame body via the openings.

摘要翻译： 半导体器件的测试装置包括具有多个开口的第一板; 设置在所述开口中的框体，所述框体具有框架，所述框架设置有多个探针; 以及在所述开口周边垂直于所述第一基板设置的多个第二板，所述第二板连接到所述第一板; 其特征在于，所述探针针穿过所述框架，从所述框体的周缘经由所述开口与所述第二基板连接。