公开(公告)号：US06794260B2

公开(公告)日：2004-09-21

申请号：US10415946

申请日：2003-10-08

申请人： Tatsuo Fujii ,  Makoto Nakano ,  Yuji Mido ,  Katsumasa Miki ,  Suzushi Kimura

发明人： Tatsuo Fujii ,  Makoto Nakano ,  Yuji Mido ,  Katsumasa Miki ,  Suzushi Kimura

IPC分类号： H01L2120

CPC分类号： H01G9/012 ,  H01G9/15 ,  Y10T29/417

摘要： A method of manufacturing solid electrolytic capacitors that can be directly connected to semiconductor components and have a faster response to a high frequency as well as a larger capacitance includes: a dielectric forming stage where a valve metal sheet (2) is made porous and a dielectric coating (7) is provided on the porous face (3); an element forming stage where a solid electrolytic layer (8) and a collector layer (10) are formed on the dielectric coating (7); and a terminal forming stage where a connecting terminal (16) for connecting to an external electrode is formed. The element forming stage includes the steps of forming the solid electrolytic layer (8); a forming through-hole electrode (9) in a through-hole (5) that is prepared on the valve metal sheet (2); and forming the collector (10) on the solid electrolytic layer (8).

摘要翻译： 可以直接连接到半导体部件并且对高频率的响应更快的固体电解电容器的制造方法以及更大的电容包括：电介质形成阶段，其中阀金属片（2）制成多孔的，并且电介质 在多孔面（3）上设置涂层（7） 在电介质涂层（7）上形成固体电解质层（8）和集电极层（10）的元件形成阶段; 以及形成用于连接到外部电极的连接端子（16）的端子形成台。 元件形成阶段包括形成固体电解质层（8）的步骤。 在阀金属片（2）上制备的通孔（5）中形成通孔电极（9）; 以及在所述固体电解质层（8）上形成所述集电体（10）。

公开(公告)号：US06775125B2

公开(公告)日：2004-08-10

申请号：US10296258

申请日：2003-01-13

申请人： Suzushi Kimura ,  Katsumasa Miki ,  Yuji Mido ,  Tatsuo Fujii ,  Hideki Masumi

发明人： Suzushi Kimura ,  Katsumasa Miki ,  Yuji Mido ,  Tatsuo Fujii ,  Hideki Masumi

IPC分类号： H01G900

CPC分类号： H01G9/012 ,  H01G9/15 ,  Y10T29/417

摘要： A solid electrolytic capacitor having a high capacitance and excellent high frequency response including a valve metal sheet which is made porous, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer and an electrode exposure area formed on the solid electrolyte layer, and an insulating section electrically insulating the electrode exposure area from the collector layer, in which the electrode exposure area and the collector layer are formed on the same surface of the valve metal sheet.

摘要翻译： 一种具有高电容性和优异的高频响应的固体电解电容器，包括多孔的阀金属片，形成在多孔部分上的电介质层，形成在电介质层上的固体电解质层，集电层和电极曝光区域 形成在所述固体电解质层上的绝缘部，以及将所述电极曝光区域与所述集电体层电绝缘的绝缘部，所述电极曝光区域和所述集电体层形成在所述阀金属片的同一表面上。

公开(公告)号：US06917514B2

公开(公告)日：2005-07-12

申请号：US10618595

申请日：2003-07-15

申请人： Yuji Mido ,  Tatsuo Fujii ,  Katsumasa Miki ,  Suzushi Kimura

发明人： Yuji Mido ,  Tatsuo Fujii ,  Katsumasa Miki ,  Suzushi Kimura

IPC分类号： H01G9/26 ,  H01G9/00 ,  H01G9/004 ,  H01G9/012 ,  H01G9/04 ,  H01G9/14 ,  H01G9/28 ,  H01G4/228

CPC分类号： H01G9/012 ,  H01G4/33 ,  H01G9/04 ,  Y10T29/417

摘要： A solid electrolytic capacitor includes a valve metal sheet having a porous portion on one side of the sheet, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer formed on the solid electrolyte layer, a through-hole electrode connected to the collector layer and penetrating the valve metal sheet to be exposed to the other side of the sheet, and an electrode terminal insulated from the through-hole electrode and connected to the valve metal sheet. The capacitor further includes an insulating portion penetrating the valve metal sheet and a penetration electrode penetrating the insulating portion. The solid electrolytic capacitor has a large capacitance and an excellent radio frequency response, and can be easily mounted on a semiconductor device.

摘要翻译： 固体电解电容器包括在片材的一侧具有多孔部分的阀金属片，形成在多孔部分上的电介质层，形成在电介质层上的固体电解质层，形成在固体电解质层上的集电层， 连接到集电体层并穿透阀金属片以暴露于片材的另一侧的通孔电极以及与通孔电极绝缘并连接到阀金属片的电极端子。 电容器还包括穿透阀金属片的绝缘部分和穿透绝缘部分的穿透电极。 固体电解电容器具有大的电容和优异的射频响应，并且可以容易地安装在半导体器件上。

公开(公告)号：US20050047062A1

公开(公告)日：2005-03-03

申请号：US10618595

申请日：2003-07-15

申请人： Yuji Mido ,  Tatsuo Fujii ,  Katsumasa Miki ,  Suzushi Kimura

发明人： Yuji Mido ,  Tatsuo Fujii ,  Katsumasa Miki ,  Suzushi Kimura

IPC分类号： H01G9/26 ,  H01G9/00 ,  H01G9/004 ,  H01G9/012 ,  H01G9/04 ,  H01G9/14 ,  H01G9/28

CPC分类号： H01G9/012 ,  H01G4/33 ,  H01G9/04 ,  Y10T29/417

摘要： A solid electrolytic capacitor includes a valve metal sheet having a porous portion on one side of the sheet, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer formed on the solid electrolyte layer, a through-hole electrode connected to the collector layer and penetrating the valve metal sheet to be exposed to the other side of the sheet, and an electrode terminal insulated from the through-hole electrode and connected to the valve metal sheet. The capacitor further includes an insulating portion penetrating the valve metal sheet and a penetration electrode penetrating the insulating portion. The solid electrolytic capacitor has a large capacitance and an excellent radio frequency response, and can be easily mounted on a semiconductor device.

公开(公告)号：US06822849B2

公开(公告)日：2004-11-23

申请号：US10703462

申请日：2003-11-10

申请人： Katsumasa Miki ,  Tatsuo Fujii ,  Yuji Mido ,  Suzushi Kimura

发明人： Katsumasa Miki ,  Tatsuo Fujii ,  Yuji Mido ,  Suzushi Kimura

IPC分类号： H01G900

CPC分类号： H01G9/15 ,  H01G9/012 ,  H01G9/042 ,  Y10T29/417

摘要： A solid electrolytic capacitor includes a bulb-metal sheet of which first face has a porous section. A dielectric film, a solid electrolyte layer, and a current-collecting layer are formed in this order on the porous section. On top of the current-collecting layer, a reinforcing plate is bonded. A second face opposite to the first face of the sheet has a connecting terminal conductive to the current-collecting layer. This connecting terminal is coupled to a through-hole electrode which extends through the bulb-metal sheet for appearing outside the second face. The second face has another connecting terminal conductive to the bulb-metal sheet. This structure makes the capacitor thin, and allows the capacitor to increase its stress-resistance and be excellent in responsiveness to a high frequency as well as in mounting convenience.

摘要翻译： 固体电解电容器包括其第一面具有多孔部分的灯泡金属片。 在多孔部上依次形成电介质膜，固体电解质层和集电层。 在电流收集层的顶部，结合有加强板。 与片材的第一面相对的第二面具有与集电层导电的连接端子。 该连接端子连接到贯穿灯泡金属片的通孔电极，以露出第二面。 第二面具有与灯泡金属片导电的另一连接端子。 这种结构使得电容器变薄，并且允许电容器增加其耐应力，并且对高频响应性以及安装方便性优异。

公开(公告)号：US06775126B2

公开(公告)日：2004-08-10

申请号：US10691239

申请日：2003-10-22

申请人： Tatsuo Fujii ,  Katsumasa Miki ,  Yuji Mido ,  Suzushi Kimura

发明人： Tatsuo Fujii ,  Katsumasa Miki ,  Yuji Mido ,  Suzushi Kimura

IPC分类号： H01G904

CPC分类号： H01G9/042 ,  H01G9/0425 ,  H01G9/15 ,  Y10T29/417

摘要： A dielectric layer is formed on a surface of a porous portion formed at least on a surface of a valve metal sheet. A solid electrolyte layer is formed on the dielectric layer, and a collector layer is formed on the solid electrolyte layer. A first insulating portion is formed on an outer periphery of the dielectric layer, and a solid electrolyte layer is formed on a portion of the dielectric layer corresponding to an opening of the first insulating portion. A portion of the solid electrolyte layer is formed on the first insulating portion. A second insulating portion is formed on the first insulating portion and on the outer periphery of the solid electrolyte layer. A collector layer is formed on a surface of the solid electrolyte layer exposed through an opening of the second insulating portion, thus providing a solid electrolytic capacitor. The solid electrolytic capacitor has less current leakage and a high withstand voltage.

公开(公告)号：US06855177B2

公开(公告)日：2005-02-15

申请号：US10362227

申请日：2002-06-24

申请人： Tatsuo Fujii ,  Katsumasa Miki ,  Makoto Nakano ,  Suzushi Kimura ,  Yuji Mido

发明人： Tatsuo Fujii ,  Katsumasa Miki ,  Makoto Nakano ,  Suzushi Kimura ,  Yuji Mido

IPC分类号： H01G9/028 ,  H01G9/00 ,  H01G9/012 ,  H01G9/04 ,  H01G9/08 ,  H01G9/15 ,  H01G4/228

CPC分类号： H01G9/15 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/49128 ,  Y10T29/49165

摘要： A method for manufacturing large capacitance solid electrolytic capacitors that can be connected direct with semiconductor component, and offer a superior high frequency characteristic. An aluminum foil 3 is made porous in one of the surfaces, a dielectric layer 2 is formed on the porous portion, a through hole 4 is provided in the aluminum foil 3 at a certain specific location. An insulation layer 5 is formed to cover the other surface, viz. non-porous surface, of the aluminum foil 3 and the inner wall surface of through hole 4, a solid electrolytic layer 6 is provided on the dielectric layer 2, and a through hole electrode 7 is formed in the through hole 4, and then a collector layer 8 is formed on the solid electrolytic layer 6. The insulation layer 5 disposed on aluminum foil 3 is provided with an opening 9 at a certain specific location, and a connection terminal 10 is provided at the opening 9 of insulation layer 5 and the exposed surface of the through hole electrode 7, respectively.

摘要翻译： 一种可直接与半导体元件连接的大容量固体电解电容器的制造方法，具有优异的高频特性。 在其中一个表面上形成铝箔3多孔，在多孔部分上形成电介质层2，在铝箔3中的特定位置设置有通孔4。 形成绝缘层5以覆盖另一表面，即， 铝箔3的无孔表面和通孔4的内壁表面，在电介质层2上设置固体电解质层6，并且在通孔4中形成通孔电极7，然后将 集电体层8形成在固体电解质层6上。设置在铝箔3上的绝缘层5在特定位置设置有开口9，并且在绝缘层5的开口9处设置有连接端子10， 通孔电极7的暴露表面。

公开(公告)号：US06852137B2

公开(公告)日：2005-02-08

申请号：US10363132

申请日：2002-07-16

申请人： Katsumasa Miki ,  Yuji Mido ,  Tatsuo Fujii ,  Makoto Nakano ,  Suzushi Kimura

发明人： Katsumasa Miki ,  Yuji Mido ,  Tatsuo Fujii ,  Makoto Nakano ,  Suzushi Kimura

IPC分类号： H01G9/00 ,  H01G9/012 ,  H01G9/15 ,  H01G4/228 ,  H01G9/10

CPC分类号： H01G9/15 ,  H01G9/012 ,  Y10T29/417

摘要： A method for manufacturing solid electrolytic capacitor that can be mounted direct on a semiconductor component and offers a superior high frequency characteristic. An aluminum foil 20 is provided on one surface with a resist film 23 and then with a through hole 24. Next, an insulation film 25 is formed to cover the other surface of aluminum foil 20 and to fill the first through hole, and then the resist film 23 is removed; and then the surface of aluminum foil 20 is roughened to be provided with a dielectric layer 27 thereon. A second through hole 36 is formed in the insulation film 25, which is filling the first through hole 24. A through hole electrode 28 is formed in the second through hole; and then, on the surface of the dielectric layer 27, a solid electrolytic layer 29 and a collector layer 30 are formed. After an opening 37 is provided, a first connection terminal 31 is formed therein, and a second connection electrode 32 on the exposed surface of the through hole electrode 28.

摘要翻译： 一种制造固体电解电容器的方法，其可以直接安装在半导体部件上并提供优异的高频特性。 铝箔20在一个表面上设置有抗蚀剂膜23，然后用通孔24提供。接下来，形成绝缘膜25以覆盖铝箔20的另一个表面并填充第一通孔，然后 除去抗蚀剂膜23; 然后将铝箔20的表面粗糙化，在其上设置介电层27。 第二通孔36形成在填充第一通孔24的绝缘膜25中。在第二通孔中形成有通孔电极28， 然后在电介质层27的表面上形成固体电解质层29和集电体层30。 在提供开口37之后，在其中形成第一连接端子31，并且在通孔电极28的暴露表面上形成第二连接电极32。

公开(公告)号：US06785147B2

公开(公告)日：2004-08-31

申请号：US10381891

申请日：2003-06-23

申请人： Katsumasa Miki ,  Yuji Mido ,  Tetsuhiro Korechika ,  Suzushi Kimura

发明人： Katsumasa Miki ,  Yuji Mido ,  Tetsuhiro Korechika ,  Suzushi Kimura

IPC分类号： H05K702

CPC分类号： H05K1/185 ,  H01G4/40 ,  H01G9/15 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/162 ,  H05K2201/0187 ,  H05K2203/0315 ,  H01L2924/00

摘要： The present invention aims to provide a circuit module that includes a sheet-like solid electrolytic capacitor and reduces an area and volume required for mounting electronic components. In the sheet-like solid electrolytic capacitor, valve metal sheet 11 has dielectric layer 13 and current collector layer 12 formed on the surface thereof, and is packaged by insulators 14 and 15. The circuit module is structured to embed the sheet-like solid electrolytic capacitor in a circuit board.

摘要翻译： 本发明旨在提供一种电路模块，其包括片状固体电解电容器，并减少了安装电子部件所需的面积和体积。 在片状固体电解电容器中，阀金属片11具有形成在其表面上的电介质层13和集电体层12，并且由绝缘体14和15封装。电路模块被构造成将片状固体电解质 电容器在电路板上。

公开(公告)号：US06510045B2

公开(公告)日：2003-01-21

申请号：US10018134

申请日：2002-01-29

申请人： Yuji Mido ,  Tetsuhiro Korechika ,  Suzushi Kimura ,  Koichi Kojima ,  Hideki Masumi ,  Seiji Takagi

发明人： Yuji Mido ,  Tetsuhiro Korechika ,  Suzushi Kimura ,  Koichi Kojima ,  Hideki Masumi ,  Seiji Takagi

IPC分类号： H01G9042

CPC分类号： H01G9/15 ,  H01G4/40 ,  H01G11/48 ,  Y02E60/13

摘要： A solid electrolytic capacitor of the present invention includes a sheet of valve metal, of which a part constitutes an positive electrode, a dielectric layer formed on a surface of the valve metal, a solid electrolyte layer formed on the dielectric layer, a negative electrode formed on the solid electrolyte layer, and an insulating protective layer for protecting the positive electrode, the dielectric layer, the solid electrolyte layer and the negative electrode. It is further provided with a bump formed on the insulating protective layer and connected to at least one of the positive electrode and the negative electrode. The solid electrolytic capacitor of the present invention is useful to constitute a semiconductor device or a circuit having outstanding high frequency response.

摘要翻译： 本发明的固体电解电容器包括一个阀金属片，其中一部分构成正电极，形成在阀金属表面上的电介质层，形成在电介质层上的固体电解质层，形成的负电极 固体电解质层和用于保护正极，电介质层，固体电解质层和负极的绝缘保护层。 还设置有形成在绝缘保护层上并与正电极和负电极中的至少一个连接的凸块。 本发明的固体电解电容器可用于构成具有突出的高频响应的半导体器件或电路。