利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

93 条记录 (耗时 0.039 秒)

    3D ultrasound imaging system
    2.
    发明授权
    3D ultrasound imaging system 有权

    公开(公告)号：US11246568B2

    公开(公告)日：2022-02-15

    申请号：US16393976

    申请日：2019-04-25

    申请人： Ying Liu

    发明人： Ying Liu

    IPC分类号： B06B1/06 ,  H01L41/04 ,  A61B8/00 ,  A61B8/14 ,  B06B1/02 ,  B06B3/00 ,  G10K11/34 ,  G01S15/89 ,  H01H89/00 ,  H01G2/00 ,  H01G9/28 ,  H01L41/113

    摘要： A circuit for 3D ultrasound imaging systems includes multiple sensor units, multiple unit circuits and multiple row sharing circuits. The unit circuits are connected with the sensor units respectively. Each row of unit circuits share a row sharing circuit. Each unit circuit includes a first electrically controlled switch, a second electrically controlled switch and a control circuit. Each row sharing circuit includes a signal transmission bus, a signal receiving bus and a row main control circuit. The signal transmission bus and the signal receiving bus of each row sharing circuit extend through a corresponding row of unit circuits. The row main control circuit of each row is configured to transmit main control signals, transmission control signals and receiving control signals to a corresponding row of unit circuits so as to select the corresponding sensor units to transmit or receive ultrasound signals.

    Ripple current generating circuit
    4.
    发明授权
    Ripple current generating circuit 有权

    公开(公告)号：US10679797B2

    公开(公告)日：2020-06-09

    申请号：US16313011

    申请日：2017-06-13

    申请人： MORNSUN GUANGZHOU SCIENCE & TECHNOLOGY CO., LTD.

    发明人： Baojun Wang

    IPC分类号： G01R31/64 ,  H01G9/14 ,  G05F1/565 ,  G01R31/00 ,  H01G9/008 ,  H01G9/28

    摘要： Provided is a ripple current generating circuit, which comprises an indicating circuit based on an existing ripple current generating circuit. The indicating circuit comprises a resistor, a capacitor, a diode, and a light-emitting diode (LED). The indicating circuit is formed by connecting the LED and the diode that are reversely connected in parallel first to the resistor in parallel and then to the capacitor in series. The capacitor is low in capacity and serves to block direct current while allowing high frequency to pass. With increasing ESR of a tested capacitor, a high-frequency ripple voltage generated by a high-frequency exciting current across the ESR may rise accordingly. Since the capacitor is capable of allowing high frequency to pass, the LED will emit light when the high-frequency ripple voltage reaches a particular threshold that can be adjusted by adjusting the resistance of the resistor.

    MATRIX ARRANGEMENT STACKED-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    9.
    发明申请
    MATRIX ARRANGEMENT STACKED-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    矩阵布置堆叠型固体电解电容器封装结构及其制造方法

    公开(公告)号：US20160343512A1

    公开(公告)日：2016-11-24

    申请号：US14809312

    申请日：2015-07-27

    申请人： APAQ TECHNOLOGY CO., LTD.

    发明人： CHI-HAO CHIU ,  KUN-HUANG CHANG

    IPC分类号： H01G9/10 ,  H01G9/28 ,  H01G9/008 ,  H01G9/15 ,  H01G9/00

    CPC分类号： H01G9/10 ,  H01G9/0029 ,  H01G9/008 ,  H01G9/15 ,  H01G9/26

    摘要： A matrix arrangement stacked-type solid electrolytic capacitor package structure includes a lead frame component, a plurality of capacitor units, and a package unit. The lead frame component includes a plurality of conductive holders arranged in matrix arrangement and a connection frame connected to the conductive holders. Each conductive holder includes a first conductive terminal and a second conductive terminal. The capacitor units are respectively disposed on the conductive holders. Each capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another and electrically connected with each other. Each first stacked-type capacitor has a first positive portion electrically connected to the first conductive terminal of the corresponding conductive holder and a first negative portion electrically connected to the second conductive terminal of the corresponding conductive holder. The package unit includes a plurality of package resin bodies for respectively enclosing the capacitor units.

    摘要翻译： 矩阵排列堆叠式固体电解电容器封装结构包括引线框架部件，多个电容器单元和封装单元。 引线框架部件包括布置成矩阵布置的多个导电保持器和连接到导电保持器的连接框架。 每个导电保持器包括第一导电端子和第二导电端子。 电容器单元分别设置在导电保持器上。 每个电容器单元包括依次层叠在彼此的顶部并彼此电连接的多个第一层叠型电容器。 每个第一堆叠型电容器具有电连接到相应的导电保持器的第一导电端子的第一正极部分和与相应导电保持器的第二导电端子电连接的第一负极部分。 封装单元包括用于分别封装电容器单元的多个封装树脂体。