公开(公告)号：US06510045B2

公开(公告)日：2003-01-21

申请号：US10018134

申请日：2002-01-29

申请人： Yuji Mido ,  Tetsuhiro Korechika ,  Suzushi Kimura ,  Koichi Kojima ,  Hideki Masumi ,  Seiji Takagi

发明人： Yuji Mido ,  Tetsuhiro Korechika ,  Suzushi Kimura ,  Koichi Kojima ,  Hideki Masumi ,  Seiji Takagi

IPC分类号： H01G9042

CPC分类号： H01G9/15 ,  H01G4/40 ,  H01G11/48 ,  Y02E60/13

摘要： A solid electrolytic capacitor of the present invention includes a sheet of valve metal, of which a part constitutes an positive electrode, a dielectric layer formed on a surface of the valve metal, a solid electrolyte layer formed on the dielectric layer, a negative electrode formed on the solid electrolyte layer, and an insulating protective layer for protecting the positive electrode, the dielectric layer, the solid electrolyte layer and the negative electrode. It is further provided with a bump formed on the insulating protective layer and connected to at least one of the positive electrode and the negative electrode. The solid electrolytic capacitor of the present invention is useful to constitute a semiconductor device or a circuit having outstanding high frequency response.

摘要翻译： 本发明的固体电解电容器包括一个阀金属片，其中一部分构成正电极，形成在阀金属表面上的电介质层，形成在电介质层上的固体电解质层，形成的负电极 固体电解质层和用于保护正极，电介质层，固体电解质层和负极的绝缘保护层。 还设置有形成在绝缘保护层上并与正电极和负电极中的至少一个连接的凸块。 本发明的固体电解电容器可用于构成具有突出的高频响应的半导体器件或电路。

公开(公告)号：US06466430B2

公开(公告)日：2002-10-15

申请号：US10048011

申请日：2002-02-22

申请人： Yuji Mido ,  Tetsuhiro Korechika ,  Suzushi Kimura ,  Seiji Takagi ,  Koichi Kojima

发明人： Yuji Mido ,  Tetsuhiro Korechika ,  Suzushi Kimura ,  Seiji Takagi ,  Koichi Kojima

IPC分类号： H01G9042

CPC分类号： H01G9/15

摘要： A capacitor comprising a porous metal sheet, part of which forms an electrode section, an organic dielectrics formed on a metal surface, a solid electrolyte layer formed on the organic dielectrics, an electrode layer formed on the solid electrolyte layer, and an insulating protection layer provided for protecting said electrode section, dielectrics, solid electrolyte layer and electrode layer. The capacitor is provided with bumps, which are formed on the insulating protection layer and connected at least with the electrode section or the electrode layer. The capacitor of the present invention provides a semiconductor device or a circuit superior in the high frequency response.

公开(公告)号：US06741448B2

公开(公告)日：2004-05-25

申请号：US10258167

申请日：2003-02-10

申请人： Yuji Mido ,  Tetsuhiro Korechika ,  Seiji Takagi ,  Tatsuo Fujii ,  Hideki Masumi

发明人： Yuji Mido ,  Tetsuhiro Korechika ,  Seiji Takagi ,  Tatsuo Fujii ,  Hideki Masumi

IPC分类号： H01G435

CPC分类号： H01G9/15 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3011 ,  Y10T29/417

摘要： A dielectric coating, a solid electrolytic layer and a collector layer are provided to one face of a porous valve metal sheet. An insulating section covers this metal sheet including the layers discussed above. Conductive bodies, which are coupled with a first connecting terminal and a second connecting terminal, respectively, are surfaced on at least one face of the insulating section. Connecting bumps are formed on these conductive bodies, so that ICs and other parts are coupled with these bumps. This structure realizes a thin composite electronic component having an excellent high-frequency response.

摘要翻译： 在多孔阀金属片的一个面上设置电介质涂层，固体电解质层和集电体层。 绝缘部分覆盖包括上述层的金属片。 分别与第一连接端子和第二连接端子耦合的导电体表面在绝缘部分的至少一个面上。 在这些导电体上形成连接凸块，使得IC和其它部件与这些凸块相连。 该结构实现了具有优异的高频响应的薄复合电子部件。

公开(公告)号：US06785147B2

公开(公告)日：2004-08-31

申请号：US10381891

申请日：2003-06-23

申请人： Katsumasa Miki ,  Yuji Mido ,  Tetsuhiro Korechika ,  Suzushi Kimura

发明人： Katsumasa Miki ,  Yuji Mido ,  Tetsuhiro Korechika ,  Suzushi Kimura

IPC分类号： H05K702

CPC分类号： H05K1/185 ,  H01G4/40 ,  H01G9/15 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/162 ,  H05K2201/0187 ,  H05K2203/0315 ,  H01L2924/00

摘要： The present invention aims to provide a circuit module that includes a sheet-like solid electrolytic capacitor and reduces an area and volume required for mounting electronic components. In the sheet-like solid electrolytic capacitor, valve metal sheet 11 has dielectric layer 13 and current collector layer 12 formed on the surface thereof, and is packaged by insulators 14 and 15. The circuit module is structured to embed the sheet-like solid electrolytic capacitor in a circuit board.

摘要翻译： 本发明旨在提供一种电路模块，其包括片状固体电解电容器，并减少了安装电子部件所需的面积和体积。 在片状固体电解电容器中，阀金属片11具有形成在其表面上的电介质层13和集电体层12，并且由绝缘体14和15封装。电路模块被构造成将片状固体电解质 电容器在电路板上。

公开(公告)号：US06791822B2

公开(公告)日：2004-09-14

申请号：US10456403

申请日：2003-06-06

申请人： Ayumi Kochi ,  Seiji Takagi ,  Yuji Mido ,  Tetsuhiro Korechika

发明人： Ayumi Kochi ,  Seiji Takagi ,  Yuji Mido ,  Tetsuhiro Korechika

IPC分类号： H01G900

CPC分类号： H01G9/012 ,  H01G9/028 ,  H01G9/042 ,  H01G9/15 ,  H01G9/26 ,  Y10T29/417

摘要： A first capacitor element of a sheet form includes a porous valve metal film, a dielectric layer provided on the porous valve metal film, a solid electrolyte layer provided on the dielectric layer, and a collector layer provided on the solid electrolyte layer. A second capacitor element of a sheet form includes a valve metal film, a porous valve metal body provided on the valve metal film, a dielectric layer provided on the porous valve metal body, a solid electrolyte layer provided on the dielectric layer, and a collector layer provided on the electrolyte layer. The first and second capacitor elements are stacked. The porous valve metal film of the first capacitor element and the valve metal film of the second capacitor element are connected to one external electrode while the collector layers of the first and second capacitor elements are connected to another external electrode, thus providing a solid electrolytic capacitor. The solid electrolytic capacitor has a small size, a large capacitance, and a small ESR.

摘要翻译： 片状的第一电容器元件包括多孔阀金属膜，设置在多孔阀金属膜上的电介质层，设置在电介质层上的固体电解质层和设置在固体电解质层上的集电层。 片状的第二电容器元件包括阀金属膜，设置在阀金属膜上的多孔阀金属体，设置在多孔阀金属体上的电介质层，设置在电介质层上的固体电解质层和集电体 层设置在电解质层上。 堆叠第一和第二电容器元件。 第一电容器元件的多孔阀金属膜和第二电容器元件的阀金属膜连接到一个外部电极，而第一和第二电容器元件的集电极层连接到另一个外部电极，从而提供固体电解电容器 。 固体电解电容器尺寸小，电容大，ESR小。

公开(公告)号：US06775125B2

公开(公告)日：2004-08-10

申请号：US10296258

申请日：2003-01-13

申请人： Suzushi Kimura ,  Katsumasa Miki ,  Yuji Mido ,  Tatsuo Fujii ,  Hideki Masumi

发明人： Suzushi Kimura ,  Katsumasa Miki ,  Yuji Mido ,  Tatsuo Fujii ,  Hideki Masumi

IPC分类号： H01G900

CPC分类号： H01G9/012 ,  H01G9/15 ,  Y10T29/417

摘要： A solid electrolytic capacitor having a high capacitance and excellent high frequency response including a valve metal sheet which is made porous, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer and an electrode exposure area formed on the solid electrolyte layer, and an insulating section electrically insulating the electrode exposure area from the collector layer, in which the electrode exposure area and the collector layer are formed on the same surface of the valve metal sheet.

摘要翻译： 一种具有高电容性和优异的高频响应的固体电解电容器，包括多孔的阀金属片，形成在多孔部分上的电介质层，形成在电介质层上的固体电解质层，集电层和电极曝光区域 形成在所述固体电解质层上的绝缘部，以及将所述电极曝光区域与所述集电体层电绝缘的绝缘部，所述电极曝光区域和所述集电体层形成在所述阀金属片的同一表面上。

公开(公告)号：US06794260B2

公开(公告)日：2004-09-21

申请号：US10415946

申请日：2003-10-08

申请人： Tatsuo Fujii ,  Makoto Nakano ,  Yuji Mido ,  Katsumasa Miki ,  Suzushi Kimura

发明人： Tatsuo Fujii ,  Makoto Nakano ,  Yuji Mido ,  Katsumasa Miki ,  Suzushi Kimura

IPC分类号： H01L2120

CPC分类号： H01G9/012 ,  H01G9/15 ,  Y10T29/417

摘要： A method of manufacturing solid electrolytic capacitors that can be directly connected to semiconductor components and have a faster response to a high frequency as well as a larger capacitance includes: a dielectric forming stage where a valve metal sheet (2) is made porous and a dielectric coating (7) is provided on the porous face (3); an element forming stage where a solid electrolytic layer (8) and a collector layer (10) are formed on the dielectric coating (7); and a terminal forming stage where a connecting terminal (16) for connecting to an external electrode is formed. The element forming stage includes the steps of forming the solid electrolytic layer (8); a forming through-hole electrode (9) in a through-hole (5) that is prepared on the valve metal sheet (2); and forming the collector (10) on the solid electrolytic layer (8).

摘要翻译： 可以直接连接到半导体部件并且对高频率的响应更快的固体电解电容器的制造方法以及更大的电容包括：电介质形成阶段，其中阀金属片（2）制成多孔的，并且电介质 在多孔面（3）上设置涂层（7） 在电介质涂层（7）上形成固体电解质层（8）和集电极层（10）的元件形成阶段; 以及形成用于连接到外部电极的连接端子（16）的端子形成台。 元件形成阶段包括形成固体电解质层（8）的步骤。 在阀金属片（2）上制备的通孔（5）中形成通孔电极（9）; 以及在所述固体电解质层（8）上形成所述集电体（10）。

公开(公告)号：US20050047062A1

公开(公告)日：2005-03-03

申请号：US10618595

申请日：2003-07-15

申请人： Yuji Mido ,  Tatsuo Fujii ,  Katsumasa Miki ,  Suzushi Kimura

发明人： Yuji Mido ,  Tatsuo Fujii ,  Katsumasa Miki ,  Suzushi Kimura

IPC分类号： H01G9/26 ,  H01G9/00 ,  H01G9/004 ,  H01G9/012 ,  H01G9/04 ,  H01G9/14 ,  H01G9/28

CPC分类号： H01G9/012 ,  H01G4/33 ,  H01G9/04 ,  Y10T29/417

摘要： A solid electrolytic capacitor includes a valve metal sheet having a porous portion on one side of the sheet, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer formed on the solid electrolyte layer, a through-hole electrode connected to the collector layer and penetrating the valve metal sheet to be exposed to the other side of the sheet, and an electrode terminal insulated from the through-hole electrode and connected to the valve metal sheet. The capacitor further includes an insulating portion penetrating the valve metal sheet and a penetration electrode penetrating the insulating portion. The solid electrolytic capacitor has a large capacitance and an excellent radio frequency response, and can be easily mounted on a semiconductor device.

公开(公告)号：US06822849B2

公开(公告)日：2004-11-23

申请号：US10703462

申请日：2003-11-10

申请人： Katsumasa Miki ,  Tatsuo Fujii ,  Yuji Mido ,  Suzushi Kimura

发明人： Katsumasa Miki ,  Tatsuo Fujii ,  Yuji Mido ,  Suzushi Kimura

IPC分类号： H01G900

CPC分类号： H01G9/15 ,  H01G9/012 ,  H01G9/042 ,  Y10T29/417

摘要： A solid electrolytic capacitor includes a bulb-metal sheet of which first face has a porous section. A dielectric film, a solid electrolyte layer, and a current-collecting layer are formed in this order on the porous section. On top of the current-collecting layer, a reinforcing plate is bonded. A second face opposite to the first face of the sheet has a connecting terminal conductive to the current-collecting layer. This connecting terminal is coupled to a through-hole electrode which extends through the bulb-metal sheet for appearing outside the second face. The second face has another connecting terminal conductive to the bulb-metal sheet. This structure makes the capacitor thin, and allows the capacitor to increase its stress-resistance and be excellent in responsiveness to a high frequency as well as in mounting convenience.

摘要翻译： 固体电解电容器包括其第一面具有多孔部分的灯泡金属片。 在多孔部上依次形成电介质膜，固体电解质层和集电层。 在电流收集层的顶部，结合有加强板。 与片材的第一面相对的第二面具有与集电层导电的连接端子。 该连接端子连接到贯穿灯泡金属片的通孔电极，以露出第二面。 第二面具有与灯泡金属片导电的另一连接端子。 这种结构使得电容器变薄，并且允许电容器增加其耐应力，并且对高频响应性以及安装方便性优异。

公开(公告)号：US06775126B2

公开(公告)日：2004-08-10

申请号：US10691239

申请日：2003-10-22

申请人： Tatsuo Fujii ,  Katsumasa Miki ,  Yuji Mido ,  Suzushi Kimura

发明人： Tatsuo Fujii ,  Katsumasa Miki ,  Yuji Mido ,  Suzushi Kimura

IPC分类号： H01G904

CPC分类号： H01G9/042 ,  H01G9/0425 ,  H01G9/15 ,  Y10T29/417

摘要： A dielectric layer is formed on a surface of a porous portion formed at least on a surface of a valve metal sheet. A solid electrolyte layer is formed on the dielectric layer, and a collector layer is formed on the solid electrolyte layer. A first insulating portion is formed on an outer periphery of the dielectric layer, and a solid electrolyte layer is formed on a portion of the dielectric layer corresponding to an opening of the first insulating portion. A portion of the solid electrolyte layer is formed on the first insulating portion. A second insulating portion is formed on the first insulating portion and on the outer periphery of the solid electrolyte layer. A collector layer is formed on a surface of the solid electrolyte layer exposed through an opening of the second insulating portion, thus providing a solid electrolytic capacitor. The solid electrolytic capacitor has less current leakage and a high withstand voltage.