公开(公告)号：US20050239380A1

公开(公告)日：2005-10-27

申请号：US11110728

申请日：2005-04-21

申请人： Yukio Hosaka ,  Yuuji Shimoyama ,  Hiroshi Shiho ,  Nobuo Kawahashi

发明人： Yukio Hosaka ,  Yuuji Shimoyama ,  Hiroshi Shiho ,  Nobuo Kawahashi

IPC分类号： B24B37/04 ,  B24B1/00

CPC分类号： B24B37/04 ,  B24B37/042

摘要： A chemical mechanical polishing pad having a polishing surface with an arithmetic mean roughness (Ra) of 0.1 to 15 μm, a 10-point height (Rz) of 40 to 150 μm, a core roughness depth (Rk) of 12 to 50 μm and a reduced peak height (Rpk) of 7 to 40 μm, a manufacturing process thereof and a chemical mechanical polishing method. Even when the chemical mechanical polishing of a large-diameter wafer as an object to be polished is carried out by this pad, a polished surface having excellent in-plane uniformity and flatness can be formed.

摘要翻译： 一种化学机械抛光垫，其抛光表面的算术平均粗糙度（Ra）为0.1〜15μm，10点高（Rz）为40〜150μm，芯粗糙度深度（Rk）为12〜50μm， 降低的峰值高度（Rpk）为7至40μm，其制造方法和化学机械抛光方法。 即使通过该垫进行作为被研磨物的大直径晶片的化学机械研磨，也可以形成具有优异的面内均匀性，平坦性的研磨面。

公开(公告)号：US07081917B2

公开(公告)日：2006-07-25

申请号：US10214457

申请日：2002-08-08

申请人： Yuuji Shimoyama ,  Kunitoshi Ogawa ,  Gen Kuriyama

发明人： Yuuji Shimoyama ,  Kunitoshi Ogawa ,  Gen Kuriyama

IPC分类号： H04N7/18 ,  H04N9/47

CPC分类号： G01C15/00

摘要： An automatic collimation surveying apparatus is provided with a collimation camera optical system (47) of a high magnification ratio; a wide-angle CCD camera optical system (89) having a wide field of view; a touch-panel display (64) for displaying an image picked up by both CCD camera optical systems; an image processing unit (60) for discriminating points of measurement from the above-described image; a touch-pen for pointing out points of measurement on the above-described image; and an automatic collimation unit (69) for automatically collimating the pointed-out points of measurement. In addition, illumination light from light source (80) is concurrently used as collimation light and is aligned so as to be emitted along the collimation axis (O) of a collimation camera optical system. The surveying apparatus can be remotely controlled from a measurement controller such as a peripheral personal computer. The surveying apparatus allows a number of point-of-measurement positions to be efficiently measured on a large-scaled structure by a single operator.

摘要翻译： 自动准直测量装置具有高倍率的准直照相机光学系统（47）; 具有宽视场的广角CCD摄像机光学系统（89）; 用于显示由CCD照相机光学系统拾取的图像的触摸面板显示器（64） 用于从上述图像中区分测量点的图像处理单元（60） 用于指示上述图像上的测量点的触摸笔; 以及用于自动准直所述指示的测量点的自动准直单元（69）。 此外，来自光源（80）的照明光同时用作准直光并且被排列成沿准直照相机光学系统的准直轴（O）发射。 测量装置可以由诸如外围个人计算机的测量控制器进行远程控制。 测量装置允许通过单个操作者在大规模结构上有效地测量多个测量点位置。

公开(公告)号：US20100221918A1

公开(公告)日：2010-09-02

申请号：US12676272

申请日：2008-08-12

申请人： Akihiro Takemura ,  Mitsuru Meno ,  Yuuji Shimoyama ,  Hirotaka Shida

发明人： Akihiro Takemura ,  Mitsuru Meno ,  Yuuji Shimoyama ,  Hirotaka Shida

IPC分类号： H01L21/304 ,  H01L21/306 ,  C09K13/00

CPC分类号： H01L21/3212 ,  C09G1/02 ,  C09K3/1463

摘要： A chemical mechanical polishing aqueous dispersion includes (A) a sulfonic acid group-containing water-soluble polymer, (B) an amino acid, (C) abrasive grains, and (D) an oxidizing agent.

摘要翻译： 化学机械研磨用水系分散体包含（A）含有磺酸基的水溶性聚合物，（B）氨基酸，（C）磨粒，（D）氧化剂。