摘要:
The invention includes superconducting titanium-containing compositions having less than 200 ppm, by weight, of a combined total of interstitial materials selected from the group consisting of nitrogen, oxygen, carbon and hydrogen. The invention also includes methods of forming superconducting titanium-containing superconducting compositions containing less than 100 ppm, by weight, of a combined total of interstitial materials selected from the group consisting of nitrogen, oxygen, carbon and hydrogen.
摘要:
The invention includes superconducting titanium-containing compositions having less than 200 ppm, by weight, of a combined total of interstitial materials selected from the group consisting of nitrogen, oxygen, carbon and hydrogen. The invention also includes methods of forming superconducting titanium-containing superconducting compositions containing less than 100 ppm, by weight, of a combined total of interstitial materials selected from the group consisting of nitrogen, oxygen, carbon and hydrogen.
摘要:
The invention includes an alloy containing equivalent amounts of nickel and titanium. The alloy has shape memory and a metallic purity of at least about 99.995%, and comprises less than about 200 ppm of gases. The invention also includes an alloy comprising titanium and nickel where the titanium and nickel amounts are non-equivalent. The alloy has shape memory and has a metallic purity of at least 99.995%, and contains less than about 200 ppm of gases. The invention further includes a method of producing a shape memory alloy. Titanium is provided having a metallic purity of at least 99.999% and nickel is provided having a metallic purity of at least 99.99%. The titanium and nickel are combined utilizing at least one melting event independently selected from e-beam melting, vacuum arc melting, vacuum induction melting, induction skull melting and plasma melting.
摘要:
The invention includes sputtering components, such as sputtering targets, comprising high-purity Ni—V. The sputtering components can have a fine average grain size throughout, with an exemplary fine average grain size being a grain size less than or equal to 40 microns. The invention also includes methods of making high-purity Ni—V structures.