摘要:
A semiconductor memory device comprises a memory cell array, at least one redundant cell control, a sense amplifier, and at least one redundant cell. The memory cell array receives and outputs data through data I/O line groups. The redundant cell control stores a defective cell address, generates a redundant cell enable control signal when the defective cell address is equal to an input cell address, generates a redundant cell read control signal during a read operation in response to the redundant cell enable control signal, and generates a redundant cell write control signal during a write operation in response to the redundant cell enable control signal. The sense amplifier is connected to an I/O line group commonly connected to the data I/O line groups, amplifies and outputs data outputted from the memory cell array during the read operation, and is disabled in response to the redundant cell read control signal. The redundant cell stores input data transferred to the I/O line group in response to the redundant cell write control signal and outputs stored data in response to the redundant cell read control signal.
摘要:
A layout of a bit line sensing control circuit for a semiconductor memory device includes two bit line pairs extending in a first direction. A power contact is arranged between the two bit line pairs. A power gate is arranged around the power contact. A plurality of sense transistors respectively have a plurality of sense transistor gates. The plurality of sense transistor gates are arranged around the power gate. A pair of control line contacts is arranged in a second direction at an adjacent location outside the two bit line pairs. A control line extends in the second direction and is connected to the power gate through the pair of control line contacts. A power line extends in the second direction adjacent to the control line and is connected to an active area surrounded by the power gate through the power contact.
摘要:
A process for fabricating a high-speed CMOS TTL semiconductor device, wherein the operational speed of a semiconductor device is controlled by adjusting the capacitance of its field region. The capacitance of the field region is adjusted by the thickness thereof, which is determined by the control of diffusion heating cycles in the fabrication sequence according to the invention.