摘要:
A radiological imaging apparatus including a bed which supports an object to be examined and an imaging apparatus, wherein the imaging apparatus has a unit substrate including a first substrate including a radiation detector and a second substrate including a signal processing apparatus to which detection signals of the radiation detector are inputted and the first substrate is connected through a connector, and is provided with a heat insulating member of separating mutually a first area where the radiation detector is disposed from a second area where the signal processing apparatus is disposed, both of which are formed inside the imaging apparatus.
摘要:
A radiological imaging apparatus including a bed which supports an object to be examined and an imaging apparatus, wherein the imaging apparatus has a unit substrate including a first substrate including a radiation detector and a second substrate including a signal processing apparatus to which detection signals of the radiation detector are inputted and the first substrate is connected through a connector, and is provided with a heat insulating member of separating mutually a first area where the radiation detector is disposed from a second area where the signal processing apparatus is disposed, both of which are formed inside the imaging apparatus.
摘要:
A radiological imaging apparatus allowing semiconductor radiation detectors to be easily replaced with new ones and densely arranged. Terminals (31cjk) and (33cjk) are provided on a bottom surface of a detector aggregate (40mn) including a plurality of semiconductor radiation detectors (1); the terminals is connected to electrodes (3 and 4) of the detectors (1). A plurality of zero insertion force connectors (56) are provided on a connecting device (33jk) installed on a support substrate (32h). The terminals (31cjk and 33cjk) are detachably attached to the zero insertion force connectors (56) to mount the detector aggregates (40mn) that are the semiconductor radiation detectors (1), on the support substrate (32h). When the detector aggregates (40mn) are attached to the zero insertion force connectors (56), since no frictional force acts on the terminals, the size of the gap between the detector aggregates (40mn) is reduced.
摘要:
The semiconductor radiological detector 1 minimizes a dead space resulting from the draw-out of a signal line from an electrode and which allows a number of semiconductor devices to be densely arranged to improve sensitivity and spatial resolution. The semiconductor radiological detector 1 comprises a semiconductor device 2, an anode 3 attached to one surface of the semiconductor device 2, and a cathode 4 attached to the other surface of the semiconductor device 2. A signal line 5 is provided on the anode 3; the signal line 5 extends straight from the anode 3 and is connected to an X axis wire 12. Another signal line 13 is provided on the cathode 4; the signal line 13 extends straight from the cathode 4 and is connected to a Y axis wire 14.
摘要:
A γ-ray signal processing section 60′ determines a detection time of a γ ray based on a α-ray detection signal outputted from a semiconductor radiation detector for detecting the γ ray, and determines the energy of the γ ray. Then, a time correction circuit 70 obtains, based on the energy of the γ ray, a detection value of the detection time that corresponds to the energy of the γ ray from a time correction table indicating the relationship between the energy of the γ ray and the correction value of the detection time of the γ ray, and corrects the detection time according to the obtained correction value of the detection time. Coincidence counting is performed on the γ ray in a coincidence counting circuit 80 based on the corrected detection time.
摘要:
A radiological imaging apparatus allowing semiconductor radiation detectors to be easily replaced with new ones and densely arranged. Terminals (31cjk) and (33cjk) are provided on a bottom surface of a detector aggregate (40mn) including a plurality of semiconductor radiation detectors (1); the terminals is connected to electrodes (3 and 4) of the detectors (1). A plurality of zero insertion force connectors (56) are provided on a connecting device (33jk) installed on a support substrate (32h). The terminals (31cjk and 33cjk) are detachably attached to the zero insertion force connectors (56) to mount the detector aggregates (40mn) that are the semiconductor radiation detectors (1), on the support substrate (32h). When the detector aggregates (40mn) are attached to the zero insertion force connectors (56), since no frictional force acts on the terminals, the size of the gap between the detector aggregates (40mn) is reduced.
摘要:
The semiconductor radiological detector 1 minimizes a dead space resulting from the draw-out of a signal line from an electrode and which allows a number of semiconductor devices to be densely arranged to improve sensitivity and spatial resolution. The semiconductor radiological detector 1 comprises a semiconductor device 2, an anode 3 attached to one surface of the semiconductor device 2, and a cathode 4 attached to the other surface of the semiconductor device 2. A signal line 5 is provided on the anode 3; the signal line 5 extends straight from the anode 3 and is connected to an X axis wire 12. Another signal line 13 is provided on the cathode 4; the signal line 13 extends straight from the cathode 4 and is connected to a Y axis wire 14.
摘要:
A radiation imaging apparatus with high spatial resolution including semiconductor radiation detectors arranged on a wiring board capable of detecting γ-rays by separating their positions in the direction of incidence of γ-rays is provided. A semiconductor radiation detector is constructed by including five semiconductor devices made up of, for example, CdTe rectangular parallelepiped plates, a cathode electrode on one side of the semiconductor device, an anode electrode on the other side of the semiconductor device and an insulator for coating five semiconductor detection devices from the outside. The semiconductor radiation detector is mounted on a wiring board using an anode pin and a cathode pin.
摘要:
A γ-ray signal processing section 60′ determines a detection time of a γ ray based on a γ-ray detection signal outputted from a semiconductor radiation detector for detecting the γ ray, and determines the energy of the γ ray. Then, a time correction circuit 70 obtains, based on the energy of the γ ray, a detection value of the detection time that corresponds to the energy of the γ ray from a time correction table indicating the relationship between the energy of the γ ray and the correction value of the detection time of the γ ray, and corrects the detection time according to the obtained correction value of the detection time. Coincidence counting is performed on the γ ray in a coincidence counting circuit 80 based on the corrected detection time.
摘要:
A radiological imaging apparatus allowing semiconductor radiation detectors to be easily replaced with new ones and densely arranged. Terminals (31cjk) and (33cjk) are provided on a bottom surface of a detector aggregate (40mn) including a plurality of semiconductor radiation detectors (1); the terminals is connected to electrodes (3 and 4) of the detectors (1). A plurality of zero insertion force connectors (56) are provided on a connecting device (33jk) installed on a support substrate (32h). The terminals (31cjk and 33cjk) are detachably attached to the zero insertion force connectors (56) to mount the detector aggregates (40mn) that are the semiconductor radiation detectors (1), on the support substrate (32h). When the detector aggregates (40mn) are attached to the zero insertion force connectors (56), since no frictional force acts on the terminals, the size of the gap between the detector aggregates (40mn) is reduced.