公开(公告)号：USRE35063E

公开(公告)日：1995-10-17

申请号：US188448

申请日：1994-01-21

申请人： Yutaka Sadano ,  Yuuji Nakashima ,  Takashi Tanaka ,  Takatoshi Kawasaki ,  Shinji Shibata ,  Hikaru Aoyagi ,  Yoshio Nishizawa ,  Akihiko Kasahara

发明人： Yutaka Sadano ,  Yuuji Nakashima ,  Takashi Tanaka ,  Takatoshi Kawasaki ,  Shinji Shibata ,  Hikaru Aoyagi ,  Yoshio Nishizawa ,  Akihiko Kasahara

IPC分类号： B23K1/00 ,  B23P13/00

CPC分类号： B23K1/0014

摘要： When soldering a honeycomb body formed by alternately piling flat foils (plates) and corrugated foils (plates), a binder liquid is sucked up from the end face of tile honeycomb body to form a binder streak in a space defined by contacting portions of the flat foil (plate) and corrugated foil (plate), a solder is scattered and applied onto the binder streak, and the honeycomb body is then dried and heated to effect a soldering of the honeycomb body. According to this method, soldering can be accomplished only in the vicinity of the contacting portions of the flat foil (plate) and corrugated foil (plate), with a desired soldering structure.

摘要翻译： 当焊接通过交替打桩扁平箔（板）和波纹箔（板）形成的蜂窝体时，粘合剂液体从瓷砖蜂窝体的端面被吸起，以在平坦部分接触限定的空间中形成粘合剂条纹 箔（板）和波纹箔（板），焊料被散射并施加到粘合剂条纹上，然后将蜂窝体干燥并加热以实现蜂窝体的焊接。 根据该方法，只能在平板（板）和波纹箔（板）的接触部分附近具有期望的焊接结构。

公开(公告)号：US5971255A

公开(公告)日：1999-10-26

申请号：US789772

申请日：1997-01-28

申请人： Yukihiro Yamamoto ,  Takuzou Kako ,  Kazuo Yoshida ,  Yuuji Nakashima ,  Kouji Yoshizaki ,  Takaaki Itou

发明人： Yukihiro Yamamoto ,  Takuzou Kako ,  Kazuo Yoshida ,  Yuuji Nakashima ,  Kouji Yoshizaki ,  Takaaki Itou

IPC分类号： B01J35/02 ,  B01D53/86 ,  B01J35/04 ,  B23K1/00 ,  F01N3/20 ,  F01N3/28 ,  B23K31/00 ,  B01J32/00

CPC分类号： B23K1/0014 ,  F01N3/2026 ,  F01N3/281 ,  Y02T10/26

摘要： In the production of a metallic honeycomb body for use as a metallic carrier, for supporting a catalyst, in the purification of an exhaust gas from automobiles or the like, a desired joint site for each layer constituting the metallic honeycomb body is preset, and, when a portion of contact between a metallic corrugated foil and a metallic flat foil for forming the metallic honeycomb body has reached the joint site, a brazing foil which has been cut into a predetermined length is inserted and enfolded in the contact portion.

摘要翻译： 在用作金属载体的金属蜂窝体的制造中，用于支撑催化剂，在从汽车等排气净化中，预先构成构成金属蜂窝体的各层的期望的接合部位， 当金属波纹箔片和用于形成金属蜂窝体的金属扁平箔片之间的接触部分已经到达接合部位时，已经切割成预定长度的钎焊箔被插入和折叠在接触部分中。

公开(公告)号：US5902557A

公开(公告)日：1999-05-11

申请号：US776679

申请日：1997-04-15

申请人： Kouki Yotsuya ,  Takuzou Kako ,  Shogo Konya ,  Yuuji Nakashima ,  Kouji Yoshizaki ,  Kazuhiro Sakurai ,  Masahiko Ogai

发明人： Kouki Yotsuya ,  Takuzou Kako ,  Shogo Konya ,  Yuuji Nakashima ,  Kouji Yoshizaki ,  Kazuhiro Sakurai ,  Masahiko Ogai

IPC分类号： B01J35/00 ,  B01J35/04 ,  F01N3/20 ,  F01N3/28 ,  F01N13/02 ,  F01N3/10

CPC分类号： F01N3/2842 ,  B01J35/0033 ,  B01J35/04 ,  F01N13/0097 ,  F01N3/2026 ,  F01N3/281 ,  F01N2260/18 ,  F01N2330/04 ,  F01N2330/06 ,  Y02T10/26

摘要： In an electrically heated catalyst support, when necessary, reinforcing layers are formed on the inner circumference and the outer circumference of a honeycomb body. On an end surface of the honeycomb body on the downstream side of exhaust gas, there are provided a plurality of insulating ceramic bars on the outer circumferential layer and/or the inner circumferential layer in such a manner that the insulating ceramic bars cross a non-reinforcing layer of the honeycomb body. End portions of the ceramic bars are held on the reinforcing layer by pins or a ring-shaped holding member joined to an external metallic cylinder. Due to the foregoing arrangement, telescoping of the honeycomb body in the direction of gas flow and damage of the metallic foil can be prevented without obstructing the generation of heat when electricity is supplied. Accordingly, durability of the catalyst support can be remarkably enhanced.

摘要翻译： PCT No.PCT / JP96 / 01474 Sec。 371日期1997年04月15日 102（e）日期1997年4月15日PCT提交1996年5月30日PCT公布。 出版物WO96 / 38657 日期1996年5月12日在电加热催化剂载体中，必要时在蜂窝体的内周和外周形成增强层。 在废气下游侧的蜂窝体的端面上，在外周层和/或内周层上设置有多个绝缘陶瓷棒，绝缘陶瓷棒与非绝缘陶瓷棒交叉， 蜂窝体的增强层。 陶瓷棒的端部通过销或连接到外部金属圆筒的环形保持构件保持在加强层上。 由于上述的布置，可以防止蜂窝体在气流方向的伸缩和金属箔的损坏，而不会在供电时阻碍产生热量。 因此，可显着提高催化剂载体的耐久性。

公开(公告)号：US06445056B1

公开(公告)日：2002-09-03

申请号：US09755862

申请日：2001-01-05

申请人： Yuuji Nakashima

发明人： Yuuji Nakashima

IPC分类号： H01L2900

摘要： A semiconductor device comprising: a first interconnect layer 1 comprising a first electrode 10 and a second electrode 20 with a plurality of a tooth-shaped teeth 11, 21 and a connection portion 12, 22 for connecting the plurality of teeth, the first electrode 10 and the second electrode 20 being disposed in a mutually staggered fashion from opposite directions; a second interconnect layer 2 comprising a third electrode 30 and a fourth electrode 40 with a plurality of tooth-shaped teeth 31, 41 and a connection portion 32, 42 for connecting the plurality of teeth, the third electrode 30 and the fourth electrode 40 being disposed in mutually staggered fashion from opposite directions; wherein the teeth 11 of the first electrode 10 overlap with either teeth 31 of the third electrode 30 or teeth 41 of the fourth electrode 40, and the electrodes are connected so that potentials on the overlapping teeth are different.

公开(公告)号：US5082167A

公开(公告)日：1992-01-21

申请号：US583331

申请日：1990-09-17

申请人： Yutaka Sadano ,  Yuuji Nakashima ,  Takashi Tanaka ,  Takatoshi Kawasaki ,  Shinji Shibata ,  Hikaru Aoyagi ,  Yoshio Nishizawa ,  Akihiko Kasahara

发明人： Yutaka Sadano ,  Yuuji Nakashima ,  Takashi Tanaka ,  Takatoshi Kawasaki ,  Shinji Shibata ,  Hikaru Aoyagi ,  Yoshio Nishizawa ,  Akihiko Kasahara

IPC分类号： B23K1/00

CPC分类号： B23K1/0014

摘要： When soldering a honeycomb body formed by alternately piling flat foils (plates) and corrugated foils (plates), a binder liquid is sucked up from the end face of the honeycomb body to form a binder streak in a space defined by contacting portions of the flat foil (plate) and corrugated foil (plate), a solder is scattered and applied onto the binder streak, and the honeycomb body is then dried and heated to effect a soldering of the honeycomb body. According to this method, soldering can be accomplished only in the vicinity of the contacting portions of the flat foil (plate) and corrugated foil (plate), with a desired soldering structure.

摘要翻译： 当焊接通过交替打桩扁平箔（板）和波纹箔（板）形成的蜂窝体时，粘合剂液体从蜂窝体的端面被吸出，以在由平坦部分接触的部分限定的空间中形成粘合剂条纹 箔（板）和波纹箔（板），焊料被散射并施加到粘合剂条纹上，然后将蜂窝体干燥并加热以实现蜂窝体的焊接。 根据该方法，只能在平板（板）和波纹箔（板）的接触部分附近具有期望的焊接结构。