公开(公告)号：US20240393053A1

公开(公告)日：2024-11-28

申请号：US18693398

申请日：2022-03-14

Applicant: ZTE CORPORATION

Inventor： Kaiwen DUAN ,  Shuai LI ,  Xin LIU ,  Fan LIU ,  Zhidong NIE ,  Yan WANG ,  Mingming ZHAO

IPC: F28D1/03 ,  F28D21/00

Abstract: A heat dissipation assembly and a heat dissipator are disclosed. The heat dissipation assembly may include: a base plate bottom; a base plate cover connected to the base plate bottom and forming a heat collection cavity for concentrating heat; a turbulation component provided in the heat collection cavity, the turbulation component comprising at least one turbulation piece; and a plurality of heat dissipation components connected to the base plate cover, wherein the heat dissipation components are provided with at least one heat dissipation pipeline, the heat dissipation pipeline is provided in communication with the heat collection cavity.