公开(公告)号：US20160299544A1

公开(公告)日：2016-10-13

申请号：US15033075

申请日：2014-05-29

Applicant: ZTE CORPORATION

Inventor： Qiong WU ,  Baiheng JING ,  Biaohua WANG ,  Shuai LI

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  F28D15/0266 ,  F28F1/022 ,  F28F2260/02 ,  H05K7/20136 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20336 ,  H05K7/206

Abstract: The embodiments of disclosure disclose a thermal control system for a closed electronic platform, which includes two mutually independent heat exchange cavities; each heat exchange cavity is provided with an air inlet and an air outlet; one heat exchanger is arranged in each of the two heat exchange cavities; the two heat exchangers are interconnected with each other through guide pipes to form a working medium circulating loop; each of tow heat exchangers includes a plurality of microchannel thermo-capillaries and two runoff gathering pits; the plurality of microchannel thermo-capillaries are arranged between the two runoff gathering pits in a parallel connection manner; the runoff gathering pits of the two heat exchangers are connected through the guide pipes, wherein each of the plurality of microchannels which is arranged in parallel are formed in each microchannel thermo-capillary. Thus improving a heat dissipation efficiency of the thermal control system.

Abstract translation: 本公开的实施例公开了一种用于封闭电子平台的热控制系统，其包括两个相互独立的热交换腔; 每个热交换空腔设有空气入口和出气口; 在两个热交换腔中的每一个中设置一个热交换器; 两个热交换器通过导管相互连接，形成工作介质循环回路; 每个丝束式热交换器包括多个微通道热毛细管和两个径流聚集凹坑; 多个微通道热毛细管以并联的方式布置在两个径流收集坑之间; 两个热交换器的径流收集坑通过导管连接，其中平行布置的多个微通道中的每一个形成在每个微通道热毛细管中。 从而提高热控制系统的散热效率。

公开(公告)号：US20250133696A1

公开(公告)日：2025-04-24

申请号：US18685617

申请日：2022-03-31

Applicant: ZTE Corporation

Inventor： Zhen SUN ,  Biying LI ,  Shuai LI ,  Qingsong XU

IPC: H05K7/20

Abstract: The present disclosure relates to the field of heat dissipation technologies, and provides a Vapor Chamber (VC) and an electronic device. The VC includes a first housing and a second housing that are disposed opposite to each other. The first housing and the second housing form a closed chamber. The first housing includes a bottom wall for making contact with a heat source. The second housing has a top wall facing the bottom wall. A first capillary structure is disposed on the bottom wall. The first capillary structure comprises a heat source region capillary structure and a non-heat source region capillary structure. The heat source region capillary structure includes a plurality of convex capillary structures and/or a plurality of first concave capillary structures.

公开(公告)号：US20240276678A1

公开(公告)日：2024-08-15

申请号：US18567574

申请日：2022-03-14

Applicant: ZTE CORPORATION ,  INSTITUTE OF SPACECRAFT SYSTEM ENGINEERING

Inventor： Cheng TAO ,  Yalong WANG ,  Fan LIU ,  Shuai LI ,  Xiaodong ZHOU ,  Xingang YU

IPC: H05K7/20

CPC classification number: H05K7/20381 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327

Abstract: A pump-driven two-phase liquid cooling system, and a liquid supplementation control method for a pump-driven two-phase liquid cooling system are disclosed. The pump-driven two-phase liquid cooling system may include a pump-driven two-phase liquid circulation loop, where a pump, an evaporator, and a condenser are sequentially arranged in the pump-driven two-phase liquid circulation loop; a first liquid storage tank arranged at a front end of the pump; and a second liquid storage tank in fluid communication with the first liquid storage tank through a first connecting pipeline; where the second liquid storage tank is provided with a first liquid filling port, and the first connecting pipeline is provided with a first valve configured to isolate the second liquid storage tank from the first liquid storage tank.

公开(公告)号：US20240377284A1

公开(公告)日：2024-11-14

申请号：US18688011

申请日：2022-03-02

Applicant: ZTE CORPORATION ,  INSTITUTE OF SPACECRAFT SYSTEM ENGINEERING

Inventor： Cheng TAO ,  Yalong WANG ,  Fan LIU ,  Xiaodong ZHOU ,  Shuai LI ,  Xingang YU

IPC: G01M99/00 ,  H05K7/20

Abstract: A system and method for testing two-phase liquid cooling are disclosed. The system may include, a liquid storage tank; a power pump having an inlet in communication with an outlet of the liquid storage tank; a regenerator having a first loop and a second loop and a first regulating valve; a preheater and a second regulating valve; a liquid outlet port and a liquid outlet valve; a liquid inlet port and a liquid inlet valve; and a condenser having an inlet in communication with an outlet of the second loop.

公开(公告)号：US20240393053A1

公开(公告)日：2024-11-28

申请号：US18693398

申请日：2022-03-14

Applicant: ZTE CORPORATION

Inventor： Kaiwen DUAN ,  Shuai LI ,  Xin LIU ,  Fan LIU ,  Zhidong NIE ,  Yan WANG ,  Mingming ZHAO

IPC: F28D1/03 ,  F28D21/00

Abstract: A heat dissipation assembly and a heat dissipator are disclosed. The heat dissipation assembly may include: a base plate bottom; a base plate cover connected to the base plate bottom and forming a heat collection cavity for concentrating heat; a turbulation component provided in the heat collection cavity, the turbulation component comprising at least one turbulation piece; and a plurality of heat dissipation components connected to the base plate cover, wherein the heat dissipation components are provided with at least one heat dissipation pipeline, the heat dissipation pipeline is provided in communication with the heat collection cavity.