公开(公告)号：US10428238B2

公开(公告)日：2019-10-01

申请号：US15689166

申请日：2017-08-29

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Ming-Jaan Ho ,  Mao-Feng Hsu ,  Shou-Jui Hsiang ,  Nan-Kun Huang ,  Yu-Wen Kao ,  Chia-Yin Teng ,  Ching-Hsuan Lin

IPC: C09D179/08 ,  C08L63/00 ,  C08G73/10

Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar′ represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A polyimide film and a method for manufacturing the polyimide film using the resin composition are also provided.

公开(公告)号：US10822522B2

公开(公告)日：2020-11-03

申请号：US16533932

申请日：2019-08-07

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Ming-Jaan Ho ,  Mao-Feng Hsu ,  Shou-Jui Hsiang ,  Nan-Kun Huang ,  Yu-Wen Kao ,  Chia-Yin Teng ,  Ching-Hsuan Lin

IPC: C09D179/08 ,  C08L63/00 ,  C08G73/10

Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar′ represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula of hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the modified polyimide compound has a degree of polymerization n of about 1 to about 50, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A modified polyimide compound and a polyimide film are also provided.