公开(公告)号：US07677874B2

公开(公告)日：2010-03-16

申请号：US11670691

申请日：2007-02-02

申请人： Zheng Yu Gao ,  Shu Chuen Ho

发明人： Zheng Yu Gao ,  Shu Chuen Ho

IPC分类号： H01L21/56 ,  B29C45/14

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  Y10S425/812 ,  H01L2924/00

摘要： A molding apparatus is provided for molding a leadframe, the molding apparatus comprising a mold having a leadframe-receiving area on its surface that is configured to receive and clamp the leadframe in the leadframe-receiving area. At least one molding cavity and a plurality of vacuum suction holes formed adjacent to the molding cavity are located within the leadframe-receiving area. The vacuum suction holes are operative to evacuate air from the mold surface, especially the molding cavity, through air vents connecting the vacuum suction holes to the molding cavity.

摘要翻译： 提供了一种用于模制引线框架的模制设备，该模制设备包括其表面上具有引线框接收区域的模具，该引线框架接收区域被构造成在引线框接收区域中接收和夹紧引线框架。 至少一个模制腔和邻近模制腔形成的多个真空吸附孔位于引导框接收区域内。 真空吸孔可操作以通过将真空抽吸孔连接到模制腔的通风口从模具表面，特别是模制腔排出空气。

公开(公告)号：US07695269B2

公开(公告)日：2010-04-13

申请号：US11753917

申请日：2007-05-25

申请人： See Yap Ong ,  Si Liang Lu ,  Zheng Yu Gao ,  Swee Huat Lee

发明人： See Yap Ong ,  Si Liang Lu ,  Zheng Yu Gao ,  Swee Huat Lee

IPC分类号： B29C45/38

CPC分类号： B29C45/38 ,  B29C45/02 ,  B29C45/14655

摘要： An apparatus and method for degating is provided for separating excess molding material from encapsulated electronic packages while the electronic packages are located in a molding system. At least one holding device is coupled to a mold of the molding system, which is located such that excess molding material is molded onto at least a portion of the holding device during molding. A locking feature on the portion of the holding device locks the excess molding material such that the holding device may hold the excess molding material molded onto it to forcibly separate the excess molding material from the encapsulated electronic packages after molding.

摘要翻译： 提供了用于脱胶的装置和方法，用于在电子封装位于模制系统中时将多余的模制材料与封装的电子封装分离。 至少一个保持装置联接到模制系统的模具，其被定位成使得在模制期间将多余的模制材料模制到保持装置的至少一部分上。 保持装置的部分上的锁定特征锁定多余的模制材料，使得保持装置可以保持模制在其上的多余的模制材料，以在模制之后强制地将多余的模制材料与封装的电子封装分开。