公开(公告)号：US09656358B2

公开(公告)日：2017-05-23

申请号：US13862786

申请日：2013-04-15

申请人： Zimmer, Inc.

发明人： Steven Charlebois ,  Leslie N. Gilbertson ,  Michael E Hawkins ,  Dana Medlin ,  H. Ravindranath Shetty ,  Steven Zawadzki

IPC分类号： B23K31/00 ,  B23P23/00 ,  A61F2/30 ,  A61L27/04 ,  A61L27/30 ,  A61L27/56 ,  B22F7/00 ,  B22F7/06 ,  C23C26/00 ,  A61F2/38 ,  A61F2/34

CPC分类号： B23P23/00 ,  A61F2/30767 ,  A61F2/30907 ,  A61F2/3094 ,  A61F2/3859 ,  A61F2002/30787 ,  A61F2002/30967 ,  A61F2002/30968 ,  A61F2002/30978 ,  A61F2002/3401 ,  A61F2310/00023 ,  A61F2310/00029 ,  A61F2310/00407 ,  A61F2310/00544 ,  A61L27/04 ,  A61L27/30 ,  A61L27/56 ,  B22F7/004 ,  B22F7/064 ,  C23C26/00 ,  Y10T29/49861

摘要： A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous structure and the substrate; and removing mass from the substrate after the porous structure is bonded to the substrate, thereby finish processing the assembly.

公开(公告)号：US20130219685A1

公开(公告)日：2013-08-29

申请号：US13862786

申请日：2013-04-15

申请人： Zimmer, Inc.

发明人： Steven Charlebois ,  Leslie N. Gilbertson ,  Michael E. Hawkins ,  Dana Medlin ,  H. Ravindranath Shetty ,  Steven Zawadzki

IPC分类号： B23P23/00

CPC分类号： B23P23/00 ,  A61F2/30767 ,  A61F2/30907 ,  A61F2/3094 ,  A61F2/3859 ,  A61F2002/30787 ,  A61F2002/30967 ,  A61F2002/30968 ,  A61F2002/30978 ,  A61F2002/3401 ,  A61F2310/00023 ,  A61F2310/00029 ,  A61F2310/00407 ,  A61F2310/00544 ,  A61L27/04 ,  A61L27/30 ,  A61L27/56 ,  B22F7/004 ,  B22F7/064 ,  C23C26/00 ,  Y10T29/49861

摘要： A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous structure and the substrate; and removing mass from the substrate after the porous structure is bonded to the substrate, thereby finish processing the assembly.

摘要翻译： 一种将多孔金属层附着到致密金属基底上的方法，其中该方法特别可用于形成诸如股骨膝盖部件，股骨髋部件和/或髋臼杯之类的矫形植入物。 该方法在其一个实施方案中包括提供固体金属基底; 提供多孔金属结构; 轮廓化多孔金属结构的表面; 将所述多孔结构放置在所述基底上，使得所述多孔金属结构的轮廓表面抵靠所述基底设置，由此形成组件; 将热和压力结合基片的热膨胀施加到组件，以便冶金地结合多孔结构和基底; 并且在将多孔结构结合到基板上之后从基板去除质量，从而完成组装。