公开(公告)号：US20190061068A1

公开(公告)日：2019-02-28

申请号：US16173256

申请日：2018-10-29

申请人： Baker Hughes, a GE company, LLC

发明人： Wei Chen ,  Marc W. Bird ,  John H. Stevens

IPC分类号： B23K35/30 ,  E21B10/00 ,  C22C26/00 ,  B23K1/00 ,  B23K1/19 ,  B23K35/02 ,  C22C18/00 ,  C22C5/08 ,  C22C5/06 ,  B23K35/36 ,  B23K35/24 ,  C22C1/04 ,  B22F1/00 ,  B22F7/06 ,  B23K101/00

CPC分类号： B23K35/3006 ,  B22F1/0003 ,  B22F1/0059 ,  B22F7/064 ,  B23K1/0008 ,  B23K1/19 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/24 ,  B23K35/30 ,  B23K35/36 ,  B23K2101/002 ,  C22C1/0466 ,  C22C1/0491 ,  C22C5/06 ,  C22C5/08 ,  C22C18/00 ,  C22C26/00 ,  E21B10/00

摘要： A method includes disposing a braze material adjacent a first body and a second body; heating the braze material and forming a transient liquid phase; and transforming the transient liquid phase to a solid phase and forming a bond between the first body and the second body. The braze material includes copper, silver, zinc, magnesium, and at least one material selected from the group consisting of nickel, tin, cobalt, iron, phosphorous, indium, lead, antimony, cadmium, and bismuth.

公开(公告)号：US20180147673A1

公开(公告)日：2018-05-31

申请号：US15580750

申请日：2016-08-02

申请人： Heraeus Deutschland GmbH & Co. KG

发明人： Wolfgang Schmitt ,  Thomas Krebs ,  Michail Schäfer ,  Susnne K. Duch ,  Jens Nanchreiner

IPC分类号： B23K35/02 ,  B23K35/30 ,  B23K35/365 ,  B22F1/00 ,  B22F7/06 ,  H01L23/00

CPC分类号： B23K35/025 ,  B22F1/0003 ,  B22F1/0055 ,  B22F1/0062 ,  B22F1/0074 ,  B22F1/025 ,  B22F7/064 ,  B22F2301/255 ,  B23K35/3006 ,  B23K35/34 ,  B23K35/3618 ,  B23K35/365 ,  B23K2101/36 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29239 ,  H01L2224/29247 ,  H01L2224/29255 ,  H01L2224/2928 ,  H01L2224/8384

摘要： The invention relates to a metal paste, containing (A) 75 to 90% by weight of copper and/or silver particles that are provided with a coating containing at least one organic compound, (B) 5 to 20% by weight of an organic solvent, and (C) 2 to 20% by weight of at least one type of metal particles different from the particles of (A) and having an average particle size (d50) in the range of 0.2 to 10 μm. The metal particles of component (C) are selected from the group consisting of molybdenum particles and nickel core-silver shell particles with a silver content of 10 to 90% by weight.

公开(公告)号：US20170368645A1

公开(公告)日：2017-12-28

申请号：US15544996

申请日：2015-12-11

申请人： SEED TECHNOLOGIES CORP., LTD.

发明人： Cankun CHEN ,  Yuehua XU ,  Zhihua CAO

IPC分类号： B23K35/30 ,  C22C29/08 ,  C22C19/03 ,  B23K11/11 ,  B23K10/02 ,  C22C29/16 ,  B22F5/00

CPC分类号： B23K35/3033 ,  B22F5/006 ,  B22F7/064 ,  B23K10/02 ,  B23K11/11 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/30 ,  B23K35/327 ,  C22C19/03 ,  C22C29/08 ,  C22C29/16

摘要： A composite hard-surface material preparation method and a composite hard-surface material prepared thereby, the preparation method comprising: dispersedly fixing a plurality of cemented carbide sheets (2) to a surface of a metal substrate (1); and surfacing the cemented carbide sheets (2) and the metal substrate (1) with a solder (3) to obtain a composite hard-surface material, the solder (3) comprising nickel-based alloy powder, tungsten carbide particles and boron nitride powder. The solder (3) used in the preparation of the composite hard-surface material comprises nickel-based alloy powder, tungsten carbide particles and boron nitride powder, wherein the nickel-based alloy powder can increase fluidity and corrosion resistance, the tungsten carbide particle can improve hardness, and the boron nitride powder can effectively reduce friction coefficient. The present solder has good fluidity, high hardness and good solderability, using said solder, the obtained composite hard-surface material may enjoy good wear resistance.

公开(公告)号：US20170290150A1

公开(公告)日：2017-10-05

申请号：US15505619

申请日：2015-09-08

申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

发明人： Takashi KASUGA ,  Yoshio OKA ,  Shigeaki UEMURA ,  Shigeyoshi NAKAYAMA ,  Jinjoo PARK ,  Sumito UEHARA ,  Hiroshi UEDA ,  Kousuke MIURA

IPC分类号： H05K1/09 ,  C23C18/30 ,  H05K3/10 ,  H05K3/46 ,  H05K3/02 ,  C23C18/18 ,  C23C18/31

CPC分类号： H05K1/092 ,  B22F1/0018 ,  B22F1/0059 ,  B22F3/16 ,  B22F7/064 ,  B22F2998/10 ,  B22F2999/00 ,  C09D11/037 ,  C09D11/10 ,  C09D11/52 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/1879 ,  C23C18/2033 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/31 ,  C23C18/32 ,  C23C18/405 ,  C23C18/42 ,  H05K1/097 ,  H05K3/02 ,  H05K3/022 ,  H05K3/108 ,  H05K3/18 ,  H05K3/381 ,  H05K3/4661 ,  H05K2201/032 ,  H05K2203/0703 ,  H05K2203/1105 ,  C22C1/0425 ,  B22F7/08 ,  B22F1/0074 ,  C23C18/00 ,  B22F2003/248 ,  C25D7/00

摘要： The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

公开(公告)号：US20170268297A1

公开(公告)日：2017-09-21

申请号：US15462249

申请日：2017-03-17

申请人： Baker Hughes Incorporated

发明人： Aaron J. Dick

IPC分类号： E21B10/567 ,  E21B10/54 ,  B32B37/06 ,  B32B37/10 ,  B32B5/16

CPC分类号： E21B10/567 ,  B22F7/064 ,  B22F2005/001 ,  B22F2998/10 ,  B32B5/16 ,  B32B37/06 ,  B32B37/10 ,  B32B2307/58 ,  B32B2439/00 ,  B32B2479/00 ,  C04B35/528 ,  C04B35/5831 ,  C04B35/62802 ,  C04B35/6303 ,  C04B37/021 ,  C04B2235/3201 ,  C04B2235/3203 ,  C04B2235/442 ,  C04B2235/80 ,  C04B2237/363 ,  C04B2237/401 ,  C22C29/067 ,  C22C29/08 ,  E21B10/54 ,  B22F1/025 ,  B22F3/02 ,  B22F7/02 ,  B22F3/10

摘要： A method of forming a cutting element comprises forming a first material comprising discrete coated particles within a container. The first material is pressed to form a first green structure comprising interbonded coated particles. A second material comprising additional discrete coated particles is formed over the first green structure within the container. The second material is pressed to form a second green structure comprising additional interbonded coated particles. The first green structure and the second green structure are sintered to form a multi-layered cutting table. Additional methods of forming a cutting element, a cutting element, and an earth-boring tool are also described.

公开(公告)号：US09731384B2

公开(公告)日：2017-08-15

申请号：US14584663

申请日：2014-12-29

申请人： Baker Hughes Incorporated

发明人： Wei Chen ,  Marc W. Bird ,  John H. Stevens

IPC分类号： B23K31/02 ,  B23K35/30 ,  B23K1/00 ,  C22C5/08 ,  C22C26/00 ,  E21B10/00 ,  C22C5/06 ,  C22C18/00 ,  B23K35/36 ,  B23K35/02 ,  B23K35/24 ,  B23K1/19 ,  B22F1/00 ,  B22F7/06 ,  C22C1/04 ,  B23K101/00

CPC分类号： B23K35/3006 ,  B22F1/0003 ,  B22F1/0059 ,  B22F7/064 ,  B23K1/0008 ,  B23K1/19 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/24 ,  B23K35/30 ,  B23K35/36 ,  B23K2101/002 ,  C22C1/0466 ,  C22C1/0491 ,  C22C5/06 ,  C22C5/08 ,  C22C18/00 ,  C22C26/00 ,  E21B10/00

摘要： A method includes disposing a braze material adjacent a first body and a second body; heating the braze material and forming a transient liquid phase; and transforming the transient liquid phase to a solid phase and forming a bond between the first body and the second body. The braze material includes copper, silver, zinc, magnesium, and at least one material selected from the group consisting of nickel, tin, cobalt, iron, phosphorous, indium, lead, antimony, cadmium, and bismuth.

公开(公告)号：US20170173739A1

公开(公告)日：2017-06-22

申请号：US15447360

申请日：2017-03-02

申请人： Murata Manufacturing Co., Ltd.

发明人： Yoshihiro Kawaguchi

IPC分类号： B23K35/02 ,  B23K35/36 ,  B23K35/26

CPC分类号： B23K35/025 ,  B22F1/0059 ,  B22F2998/10 ,  B22F2999/00 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3613 ,  B23K35/3618 ,  C22C1/0425 ,  C22F1/08 ,  C22F1/16 ,  B22F7/064 ,  B22F3/1035 ,  B22F1/0011

摘要： A metal composition that includes a metal component and a flux. The metal component is composed of a first metal powder of a Sn-based metal, and a second metal powder of a Cu-based metal that has a higher melting point than the Sn-based metal. The flux includes a rosin, a solvent, a thixotropic agent, an activator, and the like. When the metal composition is heated to a temperature equal to or higher than the melting point of the first metal powder, the first metal powder is melted. The melted Sn and the CuNi alloy powder produce an intermetallic compound phase of a CuNiSn alloy through a TLP reaction.

公开(公告)号：US20170092560A1

公开(公告)日：2017-03-30

申请号：US15311268

申请日：2015-05-26

申请人： DENKA COMPANY LIMITED

发明人： Takeshi MIYAKAWA ,  Motonori KINO ,  Yosuke ISHIHARA

IPC分类号： H01L23/373 ,  B23K35/30 ,  H01L21/48 ,  B22F1/02 ,  B22F1/00 ,  H01L23/367 ,  B23K1/00 ,  B23K35/36

CPC分类号： H01L23/3737 ,  B22F1/0011 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/02 ,  B22F7/064 ,  B22F2301/255 ,  B22F2302/25 ,  B23K1/0016 ,  B23K35/3006 ,  B23K35/3602 ,  C22C5/06 ,  C22C5/08 ,  C22C26/00 ,  C22C30/02 ,  C22C30/06 ,  H01L21/4882 ,  H01L23/047 ,  H01L23/10 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/40 ,  H01L2924/16195

摘要： A semiconductor package having, stacked in the following order, a heat dissipating member, a joining layer and an insulation member, wherein the heat dissipating member has an aluminum-diamond composite containing diamond grains and a metal containing aluminum; and the joining layer that joins the heat dissipating member and the insulation member is formed using a composite material having silver oxide fine particles or organic-coated silver fine particles having an average particle size of at least 1 nm and at most 100 μm.

公开(公告)号：US09463507B2

公开(公告)日：2016-10-11

申请号：US14081415

申请日：2013-11-15

申请人： KABUSHIKI KAISHA MIYANAGA

发明人： Masaaki Miyanaga

IPC分类号： B22F7/06 ,  B22F7/02 ,  C22C29/08 ,  B22F5/00

CPC分类号： B22F7/02 ,  B22F7/06 ,  B22F7/064 ,  B22F2005/001 ,  B22F2999/00 ,  C22C29/08 ,  Y10T408/78 ,  B22F2207/03

摘要： The object of the invention is to provide a hard tip where the nose side has wear resistance and the bonding side has toughness. The chemical composition of sintered hard alloy constituting the hard tip is such that a compounding ratio of WC to Co is substantially the same from the nose side to the bonding side, and a first bonding metal or a second bonding metal has a gradient chemical composition wherein the content of the first bonding metal or the second bonding metal is increased from the nose side to the bonding side, the first bonding metal does not form the eutectic texture with WC, and the second bonding metal has the eutectic temperature with WC over the eutectic temperature of WC—Co sintered hard alloy and the melting point over the liquid phase sintering temperature of WC—Co sintered hard alloy.

摘要翻译： 本发明的目的是提供一种硬尖端，其中鼻侧具有耐磨性，并且粘结侧具有韧性。 构成硬尖端的烧结硬质合金的化学组​​成使得WC与Co的配合比从鼻侧到接合侧基本相同，并且第一接合金属或第二接合金属具有梯度化学组成，其中 第一接合金属或第二接合金属的内容物从鼻侧增加到接合侧，第一接合金属不与WC形成共晶组织，并且第二接合金属具有超过共晶的WC的共晶温度 WC-Co烧结硬质合金的温度和WC-Co烧结硬质合金的液相烧结温度的熔点。

公开(公告)号：US20160196962A1

公开(公告)日：2016-07-07

申请号：US15067652

申请日：2016-03-11

申请人： H.C. Starck, Inc.

发明人： Gary Alan Rozak ,  Mark E. Gaydos ,  Christopher Michaluk

IPC分类号： H01J37/34 ,  B22F3/24 ,  B22F3/15 ,  C22C27/04 ,  B22F1/00

CPC分类号： H01J37/3429 ,  B22F1/0003 ,  B22F3/15 ,  B22F3/24 ,  B22F7/064 ,  B22F2003/153 ,  B22F2003/247 ,  B22F2301/20 ,  B22F2998/10 ,  C22C1/045 ,  C22C27/04 ,  C23C14/3407 ,  C23C14/3414 ,  C23C24/04

摘要： A sputtering target that includes at least two consolidated blocks, each block including an alloy including a first metal (e.g., a refractory metal such as molybdenum in an amount greater than about 30 percent by weight) and at least one additional alloying ingredient; and a joint between the at least two consolidated blocks, the joint being prepared free of any microstructure derived from a diffusion bond of an added loose powder. A process for making the target includes hot isostatically pressing (e.g., below a temperature of 1080° C.), consolidated preform blocks that, prior to pressing, have interposed between the consolidated powder metal blocks at least one continuous solid interface portion. The at least one continuous solid interface portion may include a cold spray body, which may be a mass of cold spray deposited powders on a surface a block, a sintered preform, a compacted powder body (e.g., a tile), or any combination thereof.