公开(公告)号：US07977258B2

公开(公告)日：2011-07-12

申请号：US11784503

申请日：2007-04-06

申请人： Zsolt Nenyei ,  Paul J. Timans ,  Wilfried Lerch ,  Jüergen Niess ,  Manfred Falter ,  Patrick Schmid ,  Conor Patrick O'Carroll ,  Rudy Cardema ,  Igor Fidelman ,  Sing-Pin Tay ,  Yao Zhi Hu ,  Daniel J. Devine

发明人： Zsolt Nenyei ,  Paul J. Timans ,  Wilfried Lerch ,  Jüergen Niess ,  Manfred Falter ,  Patrick Schmid ,  Conor Patrick O'Carroll ,  Rudy Cardema ,  Igor Fidelman ,  Sing-Pin Tay ,  Yao Zhi Hu ,  Daniel J. Devine

IPC分类号： H01L21/00 ,  F27B9/14

CPC分类号： H01L21/67115

摘要： Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.

摘要翻译： 公开了用于处理诸如半导体晶片的晶片状物体的工艺和系统。 根据本公开，在热处理室中处理两个晶片的倍数。 热处理室与用于加热晶片的至少一个加热装置连通。 将晶片以面对面配置或背对背配置放置在热处理室中。