公开(公告)号：US20210373132A1

公开(公告)日：2021-12-02

申请号：US17272718

申请日：2019-09-02

Applicant: ams AG

Inventor： Harald ETSCHMAIER ,  Klaus SCHMIDEGG ,  James EILERTSEN

IPC: G01S7/481 ,  G01S17/08 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/173 ,  H01L31/18

Abstract: A method of manufacturing an optical sensor arrangement including the steps of providing a substrate having a surface and providing an integrated circuit comprising an optical detector arranged for detecting light of a desired wavelength range. The integrated circuit and a light emitter are mounted onto the surface, wherein the light emitter is arranged for emitting light in the desired wavelength range. The integrated circuit and the light emitter are electrically connected to each other and to the substrate. A light barrier is formed between the optical detector and the light emitter by dispensing a first optically opaque material along a profile of the integrated circuit. A mold layer is formed by at least partly encapsulating the substrate, the integrated circuit and the light emitter with an optically transparent material. A casing, made from a second optically opaque material, is mounted on the light barrier and thereby encloses a hollow space between the casing and the mold layer.