公开(公告)号：US20240405507A1

公开(公告)日：2024-12-05

申请号：US18710405

申请日：2022-11-17

Applicant: ams-OSRAM International GmbH

Inventor： Joerg Erich SORG ,  Jan SEIDENFADEN ,  Markus HORN ,  Christoph WALTER ,  Herbert BRUNNER

IPC: H01S5/0232 ,  H01S5/02255 ,  H01S5/02355 ,  H01S5/024

Abstract: The invention relates to an optoelectronic component including an electrically conductive first contact layer located on a carrier substrate, an electrically conductive platform that is located on the first contact layer and is formed integrally therewith, at least one laser diode that is located on the platform and is electrically connected thereto, and an electrically conductive second contact layer which is electrically coupled to the at least one laser diode. The height of the platform is such that the laser facet of the at least one laser diode is at such a vertical distance from the carrier substrate that a light cone emitted by the laser diode through the laser facet does not strike the carrier substrate within a predefined horizontal distance from the laser facet.

公开(公告)号：US20250047058A1

公开(公告)日：2025-02-06

申请号：US18717306

申请日：2022-11-16

Applicant: ams-OSRAM International GmbH

Inventor： Stephan BERGHOFER ,  Jan SEIDENFADEN ,  Markus RICHTER ,  Nicole BERNER

IPC: H01S5/02251 ,  H01S5/02

Abstract: The invention relates to an optoelectronic semiconductor component having a frame body, which is radiolucent at least in regions, and at least one first semiconductor chip which is designed to emit a first electromagnetic radiation. The frame body has a recess. At least a first waveguide is formed in the frame body. A first coupling surface of the first waveguide is formed on a side surface of the recess facing the first semiconductor chip. A decoupling surface is formed on an outer surface of the frame body. The first semiconductor chip is arranged in the recess in such a way that at least a part of the first electromagnetic radiation enters into the first waveguide. The invention also relates to method for producing a plurality of optoelectronic semiconductor components.

公开(公告)号：US20230253754A1

公开(公告)日：2023-08-10

申请号：US18004498

申请日：2021-07-07

Applicant: ams-OSRAM International GmbH

Inventor： Jörg Erich SORG ,  Markus Reinhard HORN ,  Jan SEIDENFADEN ,  Harald KÖNIG

IPC: H01S5/02235

CPC classification number: H01S5/02235 ,  H01S5/02255

Abstract: The invention relates to a laser device which includes at least one laser diode having an emission surface via which the laser diode can emit laser light during operation, and a screening element having an entry surface facing the emission surface.