公开(公告)号：US11990838B2

公开(公告)日：2024-05-21

申请号：US17560385

申请日：2021-12-23

Applicant: ams-OSRAM International GmbH

Inventor： Ann Russell ,  Joseph Gasiewicz ,  Syedhossein Mousavian ,  Somayeh Abnavi ,  Hubert Halbritter ,  Steffen Strauss

IPC: G01S7/484 ,  H01S5/042 ,  H01S5/40 ,  H02M3/158

CPC classification number: H02M3/158 ,  G01S7/484 ,  H01S5/0428 ,  H01S5/4025

Abstract: A driver circuit may include a first inductor with a first terminal coupled to a first voltage terminal and a first switch with a first and a second terminal. The first terminal of the first switch is coupled to a second terminal of the first inductor via a first node and the second terminal of the first switch is coupled to a second voltage terminal. Moreover, the driver circuit may include a diode with a first terminal coupled to the first node, an output terminal, and a first capacitor with a first electrode coupled to a second terminal of the diode and a second electrode coupled to the output terminal.

公开(公告)号：US20240363367A1

公开(公告)日：2024-10-31

申请号：US18571923

申请日：2022-06-13

Applicant: ams-OSRAM International GmbH

Inventor： Johann Ramchen ,  Jörg Erich Sorg ,  Klaus Müller ,  Jan Marfeld ,  Steffen Strauss ,  Johann Walter

IPC: H01L21/50 ,  H01L23/08 ,  H01L23/10 ,  H01L23/498

CPC classification number: H01L21/50 ,  H01L23/10 ,  H01L23/08 ,  H01L23/498

Abstract: In an embodiment a method includes providing a connecting element having a first main surface, applying a first frame-shaped metallization to or over a carrier and applying a first frame-shaped solder reservoir over the first main surface of the connecting element or applying the first frame-shaped metallization over the first main surface of the connecting element and applying the first frame-shaped solder reservoir over or to the carrier, wherein a width of the first frame-shaped solder reservoir is smaller than a width of the first frame-shaped metallization and liquefying a solder of the first frame-shaped solder reservoir so that a first frame-shaped solder layer is formed which mechanically connects the carrier and the connecting element to one another, the first frame-shaped solder layer having a seam which is formed during liquefying the solder of the first frame-shaped solder reservoir and surrounds the first frame-shaped solder layer.