Semiconductor laser and fabrication method therefor

    公开(公告)号:US12107383B2

    公开(公告)日:2024-10-01

    申请号:US17296140

    申请日:2019-10-16

    CPC classification number: H01S5/0202 H01S5/02469 H01S5/028 H01S5/4025

    Abstract: A semiconductor laser and a fabrication method therefor. The method comprises: providing a heat sink motherboard, and cutting the heat sink motherboard to form a plurality of heat sink substrates (300) (S11); providing an epitaxial wafer (200) (S12); bonding the plurality of heat sink substrates (300) to the epitaxial wafer (200) in an array to form a plurality of gaps parallel to the direction of resonant cavities (210) and perpendicular to the direction of the resonant cavities (210) (S13); dividing the epitaxial wafer (200) along the gaps to obtain a plurality of laser chips (S14); and stacking the plurality of laser chips, and coating the plurality of stacked laser chips to form a plurality of semiconductor lasers (S15).

    Enhanced eye-safe laser based lighting

    公开(公告)号:US12100932B2

    公开(公告)日:2024-09-24

    申请号:US15580900

    申请日:2016-06-07

    Applicant: Jabil Inc.

    Inventor: Tony Gijbels

    Abstract: A laser-based light source (10), comprising: at least one first arrangement (100), for generating light (500), comprising: a laser device (200) for generating laser light (510) of a predetermined laser wavelength and emitting this laser light as a laser beam; and a light-conversion device (210) for converting at least part of the laser light into converted light (520); a second arrangement (110)), for generating at least a first signal (300) and a second signal (310), representative for a different part of the spectrum of said light, from direct measurements on a portion of said light (500); and a controller (120) for receiving the first signal and the second signal, for determining a safe-to-operate parameter, based on the first signal and the second signal, and for controlling the operation of the laser-device based on a comparison between the safe-to-operate parameter and at least one predefined threshold.

    LASER, FABRICATION METHOD THEREFOR, AND LASER DEVICE

    公开(公告)号:US20240266806A1

    公开(公告)日:2024-08-08

    申请号:US18599033

    申请日:2024-03-07

    CPC classification number: H01S5/4025 H01S5/0425 H01S5/1032

    Abstract: A laser capable of reducing the difficulty of a wavelength tuning process, a fabrication method therefor, and a laser device. The laser comprises: an active light-emitting structure used for emitting light; a silicon-based structure which is bonded to the active light-emitting structure, and which comprises a silicon-based waveguide and at least two composite gratings, wherein the composite gratings are opposite to the active light-emitting structure and are formed in the silicon-based waveguide. Each composite grating comprises one primary grating and a plurality of secondary gratings, the secondary gratings are periodically arranged to form the primary grating, and the primary gratings in at least a portion of the composite gratings have different grating periods from that of the primary gratings in other composite gratings. The silicon-based structure and the active light-emitting structure form at least two laser units, and each laser unit corresponds to one composite grating.

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