公开(公告)号：US20140076611A1

公开(公告)日：2014-03-20

申请号：US14022821

申请日：2013-09-10

Applicant: c/o SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Won CHOI ,  Yon Ho YOU

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0298 ,  H05K3/00 ,  H05K3/4046 ,  H05K3/4647 ,  H05K2201/10234

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including: preparing a base substrate; disposing a mask having through-holes formed therein on one surface of the base substrate; inserting metal core balls into the through-holes of the mask, performing reflow treatment on the metal core balls, and removing the mask; and laminating an insulating layer on one surface of the base substrate.

Abstract translation: 本文公开了一种制造印刷电路板的方法，包括：制备基底; 在基底基板的一个表面上设置具有形成在其中的通孔的掩模; 将金属芯球插入到掩模的通孔中，对金属芯球进行回流处理，并除去掩模; 并且在基底基板的一个表面上层叠绝缘层。