公开(公告)号：US20170288647A1

公开(公告)日：2017-10-05

申请号：US15087250

申请日：2016-03-31

申请人： Intel Corporation

发明人： Sameer Shekhar ,  Amit K. Jain ,  Pooja Nukala

IPC分类号： H03K3/011 ,  H01L25/065 ,  H05K1/18 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L25/0655 ,  H01L23/49838 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2924/1304 ,  H01L2924/13091 ,  H01L2924/1432 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19043 ,  H01L2924/19101 ,  H03K19/0005 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10378

摘要： Some embodiments include apparatus and methods using a package substrate and a die coupled to the package substrate. The package substrate includes conductive contacts, conductive paths coupled to the conductive contacts, and a resistor embedded in the package substrate. The die includes buffer circuits and a calibration module coupled to the buffer circuits and the resistor. The buffer circuits include output nodes coupled to the conductive contacts through the conductive paths. The calibration module is configured to perform a calibration operation to adjust resistances of the buffer circuits based on a value of a voltage at a terminal of the resistor during the calibration operation.

公开(公告)号：US20170164473A1

公开(公告)日：2017-06-08

申请号：US15351814

申请日：2016-11-15

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Tatsuaki DENDA ,  Osamu HOSHINO

IPC分类号： H05K1/11 ,  H05K1/18

CPC分类号： H05K1/113 ,  H01L23/49534 ,  H05K1/181 ,  H05K3/005 ,  H05K3/244 ,  H05K3/3431 ,  H05K3/427 ,  H05K3/428 ,  H05K2201/09563 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10234 ,  H05K2201/10545 ,  H05K2203/0733

摘要： A wiring substrate includes an insulating layer, a first wiring layer and a second wiring layer on opposite sides of the insulating layer, and a via piercing through the first wiring layer and the insulating layer to electrically connect to the second wiring layer. The via includes an end portion projecting from a first surface of the first wiring layer facing away from the insulating layer. A surface of the end portion facing in the same direction as the first surface of the first wiring layer is depressed to be deeper in the center than in the periphery.

公开(公告)号：US09401239B2

公开(公告)日：2016-07-26

申请号：US14687040

申请日：2015-04-15

申请人： Electroninks Writeables, Inc.

发明人： Michael A. Bell ,  Analisa Russo

IPC分类号： H01F7/02 ,  H05K1/18 ,  H05K1/11

CPC分类号： H01F7/0252 ,  H05K1/0386 ,  H05K1/11 ,  H05K1/181 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/08 ,  H05K2201/10234 ,  H05K2201/10265 ,  H05K2203/104

摘要： An electrical component for attachment to paper and other substrates comprises, according to one embodiment, a functional electronic part including one or more support pillars on an underside thereof. Each of the support pillars comprises: a channel extending therethrough from a top opening to a bottom opening, where the top opening of the channel is adjacent to the functional electronic part; and a magnet moveably positioned in the channel in electrical contact with the functional electronic part, where the bottom opening of the channel has a width smaller than a maximum lateral dimension of the magnet.

摘要翻译： 根据一个实施例，用于附接到纸和其它基底的电气部件包括在其下侧上包括一个或多个支撑柱的功能电子部件。 每个支撑柱包括：从顶部开口延伸到底部开口的通道，其中通道的顶部开口与功能电子部件相邻; 以及可移动地定位在所述通道中的与所述功能电子部件电接触的磁体，其中所述通道的底部开口具有小于所述磁体的最大横向尺寸的宽度。

公开(公告)号：US20150191012A1

公开(公告)日：2015-07-09

申请号：US14590832

申请日：2015-01-06

申请人： SEIKO EPSON CORPORATION

发明人： Masashi YOSHIIKE

IPC分类号： B41J2/14 ,  B41J2/16 ,  H05K3/02 ,  H05K1/18 ,  H05K1/02

CPC分类号： B41J2/14 ,  B41J2/14233 ,  B41J2/164 ,  B41J2002/14491 ,  H01L2224/16225 ,  H05K1/0284 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/181 ,  H05K3/02 ,  H05K3/4688 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10234 ,  H05K2201/10446 ,  H05K2203/1173 ,  Y02P70/611

摘要： A wiring substrate includes a device substrate having a first surface, a sealing plate having a second surface superimposed on the first surface via an adhesive film and crossing the first surface, and wires set along the surfaces of the first surface, the adhesive film, and the second surface. The wiring substrate includes, between the wires adjacent to each other, a recessed section forming a recess with respect to a first bonding surface of the adhesive which is in contact with the first wire and a second bonding surface of the adhesive which is in contact with the second wire.

摘要翻译： 布线基板包括具有第一表面的装置基板，具有经由粘合膜叠置在第一表面上并与第一表面交叉的第二表面的密封板，以及沿着第一表面，粘合膜和 第二个表面。 布线基板在彼此相邻的线之间包括相对于与第一线接触的粘合剂的第一接合表面形成凹部的凹部和与第一线接触的粘合剂的第二接合表面 第二根线。

公开(公告)号：US20150156864A1

公开(公告)日：2015-06-04

申请号：US14547498

申请日：2014-11-19

申请人： Shinko Electric Industries Co., Ltd.

发明人： Tomoki KOBAYASHI

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K1/09 ,  H05K1/11

CPC分类号： H05K3/284 ,  H05K1/0218 ,  H05K1/186 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/0715 ,  H05K2201/086 ,  H05K2201/10234

摘要： An electronic device includes wiring substrates stacked upon one another with a connection member arranged between adjacent wiring substrates, in which the connection member electrically connects the adjacent wiring substrates, and each wiring substrate includes a solder resist layer as a lowermost layer, electronic components mounted on the wiring substrates so that at least one of the electronic components is mounted on each wiring substrate, a first magnetic thin film covering a lower surface of the solder resist layer of an upper one of the adjacent wiring substrates, a first encapsulation resin formed on an upper surface of the uppermost wiring substrate and encapsulates the electronic component mounted on the uppermost wiring substrate, and a second magnetic thin film that entirely covers an upper surface of the first encapsulation resin and covers a lower surface of the solder resist layer on the lowermost wiring substrates.

摘要翻译： 一种电子设备，包括：布置在相邻的布线基板之间的连接构件彼此堆叠的布线基板，其中连接构件电连接相邻布线基板，并且每个布线基板包括作为最下层的阻焊层，安装在 所述布线基板使得至少一个所述电子部件安装在每个布线基板上，覆盖所述相邻布线基板的上部的阻焊层的下表面的第一磁性薄膜，形成在所述布线基板上的第一封装树脂 最上面的布线基板的上表面，封装安装在最上面的布线基板上的电子部件和完全覆盖第一封装树脂的上表面的第二磁性薄膜，并且覆盖最下面布线上的阻焊层的下表面 底物。

公开(公告)号：US08959758B2

公开(公告)日：2015-02-24

申请号：US13426874

申请日：2012-03-22

申请人： Kazuya Arai ,  Shinpei Ikegami ,  Hitoshi Suzuki ,  Kei Fukui

发明人： Kazuya Arai ,  Shinpei Ikegami ,  Hitoshi Suzuki ,  Kei Fukui

IPC分类号： H05K3/00 ,  H01L21/48 ,  H05K3/46 ,  H01L23/498 ,  H01L23/00 ,  H05K1/11

CPC分类号： H05K1/181 ,  H01L21/4857 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/0326 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2201/10234 ,  H05K2203/0156 ,  H05K2203/1536 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.

摘要翻译： 一种制造电路板的方法包括在支撑基板上形成第一电极，用第一绝缘层覆盖支撑基板和第一电极，抛光第一绝缘层以露出第一电极的第一表面，形成第一布线 在暴露第一电极的第一表面之后的第一绝缘层上，第一布线连接到第一电极，并且在形成第一布线之后移除支撑基板以暴露第一电极的第二表面。

公开(公告)号：US20140362542A1

公开(公告)日：2014-12-11

申请号：US14202333

申请日：2014-03-10

申请人： BOE Technology Group Co., LTD. ,  Hefei BOE Optoelectronics Technology Co., LTD.

发明人： Juncai Ma

IPC分类号： H05K1/02

CPC分类号： H05K1/111 ,  G02F1/13452 ,  G02F1/13454 ,  G02F1/13458 ,  H05K1/181 ,  H05K2201/094 ,  H05K2201/09436 ,  H05K2201/09709 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2201/10234 ,  Y02P70/611

摘要： The present invention relates to an array substrate assembly and a display device. The array substrate assembly comprises a substrate; a first metal line formed at one side of the substrate; an insulating layer formed on the first metal line; a second metal line formed on the insulating layer, wherein one end of the second metal line connected with a driving circuit is formed with a second terminal, wherein in a thickness direction of the substrate, a distance between a surface of the second terminal away from the one side of the substrate and the substrate is less than a distance between a surface of the second metal line away from the one side of the substrate and the substrate. The display device includes the array substrate assembly. With the solution of the present invention, when the array substrate assembly is connected to IC or COF, deformation difference between a conducting gold ball at a gate line terminal and a conducting gold ball at a date line is small, thus impedances at the two terminals are close to each other, and therefore image quality of the display device is improved.

摘要翻译： 本发明涉及阵列基板组件和显示装置。 阵列基板组件包括基板; 形成在所述基板一侧的第一金属线; 形成在所述第一金属线上的绝缘层; 形成在绝缘层上的第二金属线，其中与驱动电路连接的第二金属线的一端形成有第二端子，其中在基板的厚度方向上，第二端子的表面之间的距离远离 基板和基板的一侧小于离开基板的一侧的第二金属线的表面与基板之间的距离。 显示装置包括阵列基板组件。 利用本发明的解决方案，当阵列基板组件连接到IC或COF时，栅极线端子处的导电金球与日期线处的导电金球之间的变形差小，因此两个端子处的阻抗 彼此接近，因此改善了显示装置的图像质量。

公开(公告)号：US20140140031A1

公开(公告)日：2014-05-22

申请号：US14131847

申请日：2012-12-06

申请人： Panasonic Corporation

发明人： Suguru Fujita ,  Ryosuke Shiozaki ,  Toshiaki Nakamura ,  Jun'ichi Kimura

IPC分类号： H05K1/18

CPC分类号： H05K1/18 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49833 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2924/15153 ,  H01L2924/15321 ,  H01L2924/3511 ,  H01Q1/2283 ,  H01Q9/0407 ,  H01Q21/065 ,  H05K1/144 ,  H05K1/186 ,  H05K2201/042 ,  H05K2201/10098 ,  H05K2201/10234 ,  H05K2201/10674

摘要： A wireless module, in which a first board (11) and a second board (12) are laminated, includes connecting members (18) which are connected to at least one of the first board (11) and the second board (12), and form a gap allowing mounting of mounting components including a semiconductor device (14) between the first board (11) and the second board (12). The connecting members (18) are arranged such that a plurality of connecting members (18A, 18B) are arranged uniformly in a planar direction of the boards of the wireless module.

摘要翻译： 其中层叠有第一板（11）和第二板（12）的无线模块包括连接到第一板（11）和第二板（12）中的至少一个的连接构件（18） 并且形成允许在第一板（11）和第二板（12）之间安装包括半导体器件（14）的安装部件的间隙。 连接构件（18）被布置成使得多个连接构件（18A，18B）在无线模块的板的平面方向上均匀地布置。

公开(公告)号：US08472142B2

公开(公告)日：2013-06-25

申请号：US11902253

申请日：2007-09-20

申请人： MingGao Yao ,  YiRu Xie

发明人： MingGao Yao ,  YiRu Xie

IPC分类号： G11B5/60

CPC分类号： G11B5/4853 ,  G11B5/483 ,  H05K3/328 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/10234

摘要： The present bonded structure uses metal ball to bond or weld the respective bonding surfaces of electrical pads which are arranged to face the same direction. The structure can be controlled visually and thus enables a high connection quality of no short circuit. In addition, the bonding operation of the bonded structure is carried out without using pressure, thus it will not damage surroundings of the electrical components. Accordingly, the manufacture yield is significantly improved and the cost is prominently reduced. The present invention also discloses a bonding method and a head gimbal assembly and a head stack assembly and a drive unit using the bonded structure.

摘要翻译： 本发明的接合结构使用金属球来接合或焊接被设置为面向相同方向的电焊盘的各个接合表面。 该结构可以视觉控制，从而实现无短路的高连接质量。 此外，接合结构的接合操作在不使用压力的情况下进行，因此不会损坏电气部件的周围环境。 因此，制造成品率显着提高，成本显着降低。 本发明还公开了一种接合方法和头部万向节组件以及使用该结合结构的磁头组合组件和驱动单元。

公开(公告)号：US08247701B2

公开(公告)日：2012-08-21

申请号：US12226670

申请日：2007-04-26

申请人： Taketoshi Usui ,  Hitoshi Shimada

发明人： Taketoshi Usui ,  Hitoshi Shimada

IPC分类号： H05K1/16

CPC分类号： H05K3/323 ,  C08K7/18 ,  C09J7/22 ,  C09J7/30 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/106 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K2201/10234 ,  H05K2201/10378 ,  Y10T156/10 ,  Y10T428/2495 ,  H01L2924/00

摘要： This invention provides an electroconductive particle placement sheet comprising electroconductive particles and an insulating resin sheet. The thickness of the insulating resin sheet is smaller than the average particle diameter of the electroconductive particles. Electroconductive particles are protruded from the reference plane (P1) on at least one side of the insulating resin sheet. The electroconductive particle in is part protruded from the reference plane (P1) is covered with a layer formed of the same resin as in the insulating resin sheet.

摘要翻译： 本发明提供一种包含导电颗粒和绝缘树脂片的导电颗粒放置片。 绝缘树脂片的厚度小于导电颗粒的平均粒径。 导电颗粒在绝缘树脂片的至少一侧上从参考平面（P1）突出。 导电颗粒从参考平面（P1）突出的部分被由与绝缘树脂片中相同的树脂形成的层覆盖。