公开(公告)号：US20230323134A1

公开(公告)日：2023-10-12

申请号：US18297001

申请日：2023-04-07

Applicant: eChem Solutions Corp.

Inventor： Hsiao-Chi Chiu ,  Jui-Yu Hsu

IPC: C09D4/06 ,  C09D133/10 ,  C09D7/48 ,  C09D7/63 ,  C09D7/45

CPC classification number: C09D4/06 ,  C09D133/10 ,  C09D7/48 ,  C09D7/63 ,  C09D7/45

Abstract: A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), an antioxidant (C), a photoinitiator (D) and a solvent (E). The weight average molecular weight of the alkali-soluble resin (A) is 5,000 to 40,000. The polymerizable monomer (B) includes an ethylenically unsaturated monomer (B1), an epoxy monomer (B2) or the combination thereof. The alkali-soluble resin (A) includes at least one of a structural unit represented by following Formula (A-1) to Formula (A-4).




In Formula (A-1) to Formula (A-4), the definition of R1 to R3, m, n and * are the same as defined in the detailed description.

公开(公告)号：US20230324793A1

公开(公告)日：2023-10-12

申请号：US18297004

申请日：2023-04-07

Applicant: eChem Solutions Corp.

Inventor： Hsiao-Chi Chiu ,  Jui-Yu Hsu

IPC: G03F7/029

CPC classification number: G03F7/029 ,  G03F7/0048

Abstract: A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), a thermal acid generator (D), a photoinitiator (E) and a solvent (F). The weight average molecular weight of the alkali-soluble resin (A) is 5,000-40,000. The polymerizable monomer (B) includes an epoxy monomer (B1), ethylenically unsaturated monomer (B2) or the combination thereof. The thermal acid generator (D) includes hexafluoroonium salt. The epoxy monomer (B1) includes a compound represented by following Formula (B-1).




In Formula (B-1), the definition of X1 to X3 and Z4 to Z6 are the same as defined in the detailed description.

公开(公告)号：US20230099041A1

公开(公告)日：2023-03-30

申请号：US17938944

申请日：2022-09-07

Applicant: eChem Solutions Corp.

Inventor： Jui-Yu Hsu ,  Chia-Hao Lou ,  Chen-Wen Chiu

IPC: G03F7/075 ,  G03F7/00

Abstract: A photosensitive resin composition, an optical film and a method of producing the same are provided. The photosensitive resin composition includes a thiol compound (A) having two or more groups represented by formula (I-a), a polyether-modified polysiloxane (B), an ethylenically unsaturated group-containing compound (C) having one or two aromatic rings, a bisphenol fluorene oligomer (D) having one or two (meth)acryloyl groups, and a photoinitiator (E).

公开(公告)号：US20200225581A1

公开(公告)日：2020-07-16

申请号：US16741682

申请日：2020-01-13

Applicant: eChem Solutions Corp.

Inventor： Jui-Yu Hsu ,  Chia-Hao Lou ,  Chen-Wen Chiu

IPC: G03F7/038 ,  G03F7/16 ,  G03F7/004 ,  C08F20/30 ,  C08F20/32 ,  G02B1/04

Abstract: A photosensitive resin composition, an optical film, and a method of producing an optical film are provided. The photosensitive resin composition includes an ethylenically unsaturated group-containing compound (A) having one or two aromatic rings; a bisphenol fluorene oligomer (B) having one or two (meth)acryloyl groups; and a photoinitiator (C), wherein the weight ratio of the ethylenically unsaturated group-containing compound (A) to the bisphenol fluorene oligomer (B) is from 0.50 to 0.95.