公开(公告)号：US20230295366A1

公开(公告)日：2023-09-21

申请号：US18181581

申请日：2023-03-10

Applicant: eChem Solutions Corp.

Inventor： Wei-Chung Liang ,  Kuo-Chu Yeh

IPC: C08F283/04 ,  C08G73/10 ,  C08G73/12 ,  C08F220/20 ,  C08F222/10 ,  C08J3/28

CPC classification number: C08F283/04 ,  C08G73/1007 ,  C08G73/1078 ,  C08G73/12 ,  C08F220/20 ,  C08F222/102 ,  C08J3/28 ,  C08J2379/08

Abstract: A polyimide precursor, a preparation method thereof, a photosensitive resin composition and a cured product are provided. The polyimide precursor is obtained from a tetracarboxylic dianhydride (A), a diamine (B), and a hydroxyl-containing alkyl (meth)acrylate (C) through ring-opening substitution, and polymerization. The polyimide precursor does not include fluorine. The tetracarboxylic dianhydride (A) and the diamine (B) form a main chain. The hydroxyl-containing alkyl (meth)acrylate (C) is grafted to the main chain to form a branch. A molar ratio of the tetracarboxylic dianhydride (A) to the diamine (B) if from 1:0.95 to 1:1.10.