专利检索 ap:("iCare Diagnostics International Co. Ltd.") AND inv:"BI-SHENG JANG" 第 1 页

1.

发明申请
MULTILAYERED FLEXIBLE PRINTED CIRCUIT, METHOD FOR MANUFACTURING THE SAME, AND APPLICATION THEREOF 有权

公开(公告)号：US20220418087A1

公开(公告)日：2022-12-29

申请号：US17566189

申请日：2021-12-30

申请人： iCare Diagnostics International Co. Ltd.

发明人： KAI YANG , CHUN-YU LIN , BI-SHENG JANG , SHIH-HSUN MA , YU-MIN WANG , BEEN-YANG LIAW , LIEN-HSIANG PAN , SHIN-SHIAN LIOU , CHIEN-YU GU , CHUNG-JEN HSIEH

IPC分类号： H05K1/02 , H05K1/11 , H05K3/12

摘要： A method for manufacturing a bending-tolerant multilayered flexible circuit board (FPC) suitable for use in a disposable biosensor chip includes manufacturing and bending a single-sided FPC. The single-sided FPC includes a base layer, a wiring layer, and through holes. The wiring layer includes first and second wiring areas. A first bending area is formed between each first wiring area and the corresponding second wiring area, the through holes forming an easy bending line. The second wiring area is bent relative to the first wiring area along the bending line to obtain the multilayered FPC.