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1.
公开(公告)号:US20220418087A1
公开(公告)日:2022-12-29
申请号:US17566189
申请日:2021-12-30
发明人: KAI YANG , CHUN-YU LIN , BI-SHENG JANG , SHIH-HSUN MA , YU-MIN WANG , BEEN-YANG LIAW , LIEN-HSIANG PAN , SHIN-SHIAN LIOU , CHIEN-YU GU , CHUNG-JEN HSIEH
摘要: A method for manufacturing a bending-tolerant multilayered flexible circuit board (FPC) suitable for use in a disposable biosensor chip includes manufacturing and bending a single-sided FPC. The single-sided FPC includes a base layer, a wiring layer, and through holes. The wiring layer includes first and second wiring areas. A first bending area is formed between each first wiring area and the corresponding second wiring area, the through holes forming an easy bending line. The second wiring area is bent relative to the first wiring area along the bending line to obtain the multilayered FPC.
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2.
公开(公告)号:US20220410605A1
公开(公告)日:2022-12-29
申请号:US17844913
申请日:2022-06-21
发明人: KAI YANG , CHIEN-YU GU , YU-MIN WANG
摘要: A method for manufacturing a flex-tolerant three-dimensional printed antenna suitable for use in an electronic device provides a three-dimensional printed antenna with base layer, radiation layer, through holes, and feeder. The radiation layer includes a first radiation region, at least one second radiation region, and a feed end. A region between the first and second radiation regions is defined as a bent region. The radiation layer is formed by a screen-printing plate by a planar printing process. The through holes on the bent region form a line for bending. The feeder is electrically connected to the feed end. The second radiation region is canted from the bending line with respect to the first radiation region to form the three-dimensional printed antenna. The three-dimensional printed antenna and an electronic device are also disclosed.
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