公开(公告)号：US20240014486A1

公开(公告)日：2024-01-11

申请号：US18220087

申请日：2023-07-10

Applicant: tesa SE

Inventor： Magdalena SOMMER ,  Katja MEYER ,  Thomas NIEMEYER ,  Kenny KLOBEDANZ ,  Jennifer KIPKE

IPC: H01M50/184 ,  F16J15/14 ,  H01M50/342 ,  B32B27/06 ,  B32B7/12

CPC classification number: H01M50/184 ,  F16J15/14 ,  H01M50/3425 ,  B32B27/06 ,  B32B7/12 ,  B32B2581/00

Abstract: Methods may seal or seal a continuous clearance in a substrate and comprise a) producing or providing a bonding element comprising: i) an adhesive layer comprising an adhesive, ii) a carrier layer disposed on the adhesive layer and comprising a first carrier ply, and b) adhering the bonding element by means of the adhesive layer to the substrate, so that the bonding element completely covers the continuous clearance and the continuous clearance is fluid-tightly sealed by the bonding element. The bonding element comprises a pressure opening region which is surrounded at least sectionally by a weakening region formed in the carrier layer, the mean thickness of the carrier layer in the weakening region being lower than the mean thickness of the carrier layer in the pressure opening region.