公开(公告)号：US20170173858A1

公开(公告)日：2017-06-22

申请号：US15363528

申请日：2016-11-29

申请人： TESA SE

发明人： Jannik SELLIN ,  Thomas NIEMEYER ,  Esther VON POSSEL

IPC分类号： B29C65/48 ,  B62D1/06 ,  B60R13/02 ,  B29C65/56 ,  B29C65/02

摘要： Method for bonding a sheetlike cover material to a shaped article, using an adhesive film comprising at least one layer of a heat-activatedly bondable adhesive, where the adhesive film is disposed, over the full area or a partial area, between the cover material and the shaped article, the heat-activatedly bondable adhesive as yet not adhering to the shaped article, wherein the cover material is pulled onto the shaped article under tension, so that the layer of the heat-activatedly bondable adhesive contacts the shaped article, and the activation of the heat-activatedly bondable adhesive is brought about by means of the pressure resulting exclusively from the tension, and optionally of heat introduced by means of external energy supply, whereby the heat-activatedly bondable adhesive adheres to the shaped article and a durable connection of the cover material to the shaped article is produced.

公开(公告)号：US20240014486A1

公开(公告)日：2024-01-11

申请号：US18220087

申请日：2023-07-10

申请人： tesa SE

发明人： Magdalena SOMMER ,  Katja MEYER ,  Thomas NIEMEYER ,  Kenny KLOBEDANZ ,  Jennifer KIPKE

IPC分类号： H01M50/184 ,  F16J15/14 ,  H01M50/342 ,  B32B27/06 ,  B32B7/12

CPC分类号： H01M50/184 ,  F16J15/14 ,  H01M50/3425 ,  B32B27/06 ,  B32B7/12 ,  B32B2581/00

摘要： Methods may seal or seal a continuous clearance in a substrate and comprise a) producing or providing a bonding element comprising: i) an adhesive layer comprising an adhesive, ii) a carrier layer disposed on the adhesive layer and comprising a first carrier ply, and b) adhering the bonding element by means of the adhesive layer to the substrate, so that the bonding element completely covers the continuous clearance and the continuous clearance is fluid-tightly sealed by the bonding element. The bonding element comprises a pressure opening region which is surrounded at least sectionally by a weakening region formed in the carrier layer, the mean thickness of the carrier layer in the weakening region being lower than the mean thickness of the carrier layer in the pressure opening region.