Fingerprint identification unit and device
    1.
    发明授权
    Fingerprint identification unit and device 有权
    指纹识别单元和设备

    公开(公告)号:US09547787B2

    公开(公告)日:2017-01-17

    申请号:US14555723

    申请日:2014-11-28

    发明人: Juan Wang

    IPC分类号: G06K9/00

    CPC分类号: G06K9/0002

    摘要: The present disclosure provides a fingerprint identification unit. The fingerprint identification unit includes a substrate, a reception layer, a first electrode layer, a transmission layer, a second electrode layer, and a third electrode layer. The reception layer is positioned at one side of the substrate. The first electrode layer is formed on the reception layer. The transmission layer is positioned at another side of the substrate opposite to the reception layer. The second electrode layer and the third electrode layer are formed on two opposite sides of the transmission layer respectively. The reception layer and the transmission layer are made of piezoelectric materials. At least one of the first electrode layer, the second electrode layer, and the third electrode layer is a transparent conductive layer.

    摘要翻译: 本公开提供了一种指纹识别单元。 指纹识别单元包括基板,接收层,第一电极层,透射层,第二电极层和第三电极层。 接收层位于基板的一侧。 第一电极层形成在接收层上。 透射层位于与接收层相对的基板的另一侧。 第二电极层和第三电极层分别形成在透射层的两个相对侧上。 接收层和透射层由压电材料制成。 第一电极层,第二电极层和第三电极层中的至少一个是透明导电层。

    Fingerprint indentification apparatus and manufactureing metheod thereof

    公开(公告)号:US09672402B2

    公开(公告)日:2017-06-06

    申请号:US14555718

    申请日:2014-11-28

    发明人: Juan Wang

    IPC分类号: G06K9/00

    CPC分类号: G06K9/0002

    摘要: A fingerprint identification apparatus includes a fingerprint identification module and a signal transmitting module electrically connected to the fingerprint identification module. The signal transmitting module includes a loading substrate and a first sensing layer with a plurality of first sensing units. The first sensing units are located on the loading substrate in a matrix. Each corner of the first sensing units is a substantially arc shaped.

    Method for manufacturing fingerprint identification modules

    公开(公告)号:US09824255B2

    公开(公告)日:2017-11-21

    申请号:US14836382

    申请日:2015-08-26

    发明人: Juan Wang

    摘要: A method for manufacturing a plurality of fingerprint identification modules simultaneously is provided. A first thin film and a second thin film are formed on a first transfer base and a second transfer base respectively. The first thin film and the second thin film are cut respectively to form a plurality of first thin film units and a plurality of second thin film units. The first transfer base and the second transfer base are adhered on opposite surfaces of a substrate. The first thin film units and the second thin film units are cut respectively to form a plurality of the first piezoelectric layers and a plurality of the second piezoelectric layers. A plurality of first slits and a plurality of second slits are formed on opposite surfaces of the substrate for breaking the mother base into the fingerprint identification modules.