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    ARRAY ARCHITECTURE AND INTERCONNECTION FOR TRANSDUCERS
    1.
    发明公开
    ARRAY ARCHITECTURE AND INTERCONNECTION FOR TRANSDUCERS 审中-公开

    公开(公告)号：US20230201876A1

    公开(公告)日：2023-06-29

    申请号：US17561313

    申请日：2021-12-23

    申请人： FUJIFILM SonoSite, Inc.

    发明人： Wei Li ,  Jimin Zhang

    IPC分类号： B06B1/06 ,  H01L41/338

    CPC分类号： B06B1/0622 ,  B06B1/067 ,  H01L41/338

    摘要： A method of fabricating a transducer includes embedding signal flexes and ground-return flexes inside a backing block. The method includes forming stack configurations with a height in elevation and a width perpendicular to the height. The forming includes: dicing a piezoelectric layer in the elevation into rows (separating the piezoelectric layer into portions); defining a beam pattern for the transducer by aligning the portions on the backing block; and forming gaps in-between each piezoelectric layer portion and each adjacently aligned piezoelectric layer portion. The method includes forming stacks by bonding one or more matching layers to the piezoelectric layer portions by utilizing a conductive surface of a first matching layer of the one or more matching layers. The method also includes forming cavities in the one or more matching layers in elevation, dicing the stacks along an elevation direction into multiple elements, and filling the cavities with a material.

    Transducer, Transducer Array, and Method of Making the Same
    3.
    发明申请
    Transducer, Transducer Array, and Method of Making the Same 审中-公开

    公开(公告)号：US20180117631A1

    公开(公告)日：2018-05-03

    申请号：US15794557

    申请日：2017-10-26

    申请人： CTS Corporation

    发明人： Gerald T. Stranford ,  Marshall Suarez

    IPC分类号： B06B1/06 ,  H01L41/09 ,  H01L41/312

    CPC分类号： B06B1/0603 ,  H01L27/20 ,  H01L41/0474 ,  H01L41/0926 ,  H01L41/0973 ,  H01L41/25 ,  H01L41/312 ,  H01L41/338

    摘要： A transducer comprising a transducer element including a plate with a through-hole and a collar projecting from the plate and defining an interior cavity in communication with the through-hole. A piezoelectric bender includes at least first and second wafer layers stacked together. The bender is coupled to a peripheral end face of the collar. The first and/or second piezoelectric wafer layers bend at a resonant frequency and generate ultrasonic waves that flow through the collar interior cavity and the plate through-hole and create an in-air pressure pattern and acoustic field at a location spaced from the transducer. A plurality of transducers may be made by providing a monolithic transducer element structure including a plurality of the transducer elements formed thereon, coupling either a plurality of benders or a monolithic bender to the plurality of transducer elements, and then cutting the monolithic transducer element structure to define a plurality of individual transducers.

    MOTHER PIEZOELECTRIC ELEMENT, LAMINATED PIEZOELECTRIC ELEMENT, AND MANUFACTURING METHOD FOR LAMINATED PIEZOELECTRIC ELEMENT
    4.
    发明申请
    MOTHER PIEZOELECTRIC ELEMENT, LAMINATED PIEZOELECTRIC ELEMENT, AND MANUFACTURING METHOD FOR LAMINATED PIEZOELECTRIC ELEMENT 审中-公开

    公开(公告)号：US20180013054A1

    公开(公告)日：2018-01-11

    申请号：US15698983

    申请日：2017-09-08

    申请人： Murata Manufacturing Co., Ltd.

    发明人： Kimitoshi Nakamura ,  Hisanobu Nakashima

    IPC分类号： H01L41/047 ,  H01L41/257

    CPC分类号： H01L41/047 ,  H01L41/0471 ,  H01L41/0472 ,  H01L41/257 ,  H01L41/338

    摘要： The structure of a mother piezoelectric element allows a polarization process to be performed on the mother body before the individual piezoelectric elements are cut from the mother piezoelectric element. The mother piezoelectric element includes a plurality of first internal electrodes which are provided on at least one first surface and a plurality of second internal electrodes which are provided on at least one second surface. Each of the first and second internal electrodes is led out to any of first to fourth side surfaces of a mother piezoelectric body. The plurality of first internal electrodes are electrically connected to each other on a first surface and the plurality of second internal electrodes are electrical connected to each other on a second surface. All the first internal electrodes in the mother piezoelectric body are electrically connected to each other, and all the second internal electrodes in the mother piezoelectric body are electrically connected to each other.

    Method for manufacturing fingerprint identification modules
    5.
    发明授权
    Method for manufacturing fingerprint identification modules 有权

    公开(公告)号：US09824255B2

    公开(公告)日：2017-11-21

    申请号：US14836382

    申请日：2015-08-26

    申请人： MiiCs & Partners Inc.

    发明人： Juan Wang

    IPC分类号： H01L41/27 ,  G06K9/00 ,  H01L41/297 ,  H01L41/313 ,  H01L41/338

    CPC分类号： G06K9/0002 ,  H01L41/27 ,  H01L41/313 ,  H01L41/338 ,  Y10T29/42

    摘要： A method for manufacturing a plurality of fingerprint identification modules simultaneously is provided. A first thin film and a second thin film are formed on a first transfer base and a second transfer base respectively. The first thin film and the second thin film are cut respectively to form a plurality of first thin film units and a plurality of second thin film units. The first transfer base and the second transfer base are adhered on opposite surfaces of a substrate. The first thin film units and the second thin film units are cut respectively to form a plurality of the first piezoelectric layers and a plurality of the second piezoelectric layers. A plurality of first slits and a plurality of second slits are formed on opposite surfaces of the substrate for breaking the mother base into the fingerprint identification modules.

    METHOD FOR MANUFACTURING FINGERPRINT IDENTIFICATION MODULES
    6.
    发明申请
    METHOD FOR MANUFACTURING FINGERPRINT IDENTIFICATION MODULES 有权
    制造指纹识别模块的方法

    公开(公告)号：US20160315246A1

    公开(公告)日：2016-10-27

    申请号：US14836382

    申请日：2015-08-26

    申请人： MiiCs & Partners Inc.

    发明人： JUAN WANG

    IPC分类号： H01L41/27 ,  G06K9/00 ,  H01L41/297

    CPC分类号： G06K9/0002 ,  H01L41/27 ,  H01L41/313 ,  H01L41/338 ,  Y10T29/42

    摘要： A method for manufacturing a plurality of fingerprint identification modules simultaneously is provided. A first thin film and a second thin film are formed on a first transfer base and a second transfer base respectively. The first thin film and the second thin film are cut respectively to form a plurality of first thin film units and a plurality of second thin film units. The first transfer base and the second transfer base are adhered on opposite surfaces of a substrate. The first thin film units and the second thin film units are cut respectively to form a plurality of the first piezoelectric layers and a plurality of the second piezoelectric layers. A plurality of first slits and a plurality of second slits are formed on opposite surfaces of the substrate for breaking the mother base into the fingerprint identification modules.

    摘要翻译： 提供了同时制造多个指纹识别模块的方法。 第一薄膜和第二薄膜分别形成在第一转印基底和第二转印基底上。 分别切割第一薄膜和第二薄膜以形成多个第一薄膜单元和多个第二薄膜单元。 第一转印基底和第二转印基底粘附在基底的相对表面上。 分别切割第一薄膜单元和第二薄膜单元以形成多个第一压电层和多个第二压电层。 在基板的相对表面上形成有多个第一狭缝和多个第二狭缝，用于将母基部分解成指纹识别模块。

    Ultrasonic array transducer, associated circuit and methods of making the same
    9.
    发明授权
    Ultrasonic array transducer, associated circuit and methods of making the same 有权
    超声波阵列传感器，相关电路及制作方法

    公开(公告)号：US09257629B2

    公开(公告)日：2016-02-09

    申请号：US13519980

    申请日：2011-07-21

    申请人： Matthew Todd Spigelmyer ,  Derek Ryan Greenaway

    发明人： Matthew Todd Spigelmyer ,  Derek Ryan Greenaway

    IPC分类号： H01L41/047 ,  B06B1/02 ,  H05K1/18 ,  H01L41/29 ,  H01L41/338

    CPC分类号： H01L41/0475 ,  B06B1/0292 ,  H01L41/29 ,  H01L41/338 ,  H05K1/189 ,  H05K2201/10083 ,  Y10T29/42

    摘要： In some embodiments, circuits for ultrasonic transducer element arrays are provided. In some embodiments, a circuit described herein comprises a first layer for receiving a transducer element array, a ground layer comprising at least one ground disposed over the first layer and a plurality of first vias corresponding to transducer elements of the array, the first vias extending through the first layer to the at least one ground and comprising first ends for receiving ground electrodes of the transducer elements and second ends electrically connected to the ground.

    摘要翻译： 在一些实施例中，提供了用于超声换能器元件阵列的电路。 在一些实施例中，本文所述的电路包括用于接收换能器元件阵列的第一层，包括设置在第一层上的至少一个接地层的接地层和对应于阵列的换能器元件的多个第一通孔，第一通孔延伸 通过第一层到至少一个地面，并且包括用于接收换能器元件的接地电极的第一端和电连接到地的第二端。