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公开(公告)号：US20200303289A1
公开(公告)日：2020-09-24
申请号：US16825299
申请日：2020-03-20
发明人： Kaoru Hishiki , Keiichi Otaki , Hidehiko Sasaki , Kotaro Tomeoka
IPC分类号： H01L23/495
摘要： A substrate for mounting a semiconductor element thereon has columnar terminal portions formed by concavities provided on an upper surface of a metal plate made of a copper-based material, and is provided with a roughened silver plating layer having acicular projections, applied, as the outermost plating layer, to top faces of the columnar terminal portions. The roughened silver plating layer has a crystal structure in which the crystal direction occupies a largest proportion among the crystal directions , and . The substrate for mounting a semiconductor element thereon facilitates thin design of semiconductor packages produced by flip-chip mounting, can be manufactured with improved productivity owing to reduction in cost and operation time, achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.
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公开(公告)号：US20200303210A1
公开(公告)日：2020-09-24
申请号：US16825231
申请日：2020-03-20
发明人： Kaoru Hishiki , Keiichi Otaki , Hidehiko Sasaki , Kotaro Tomeoka
摘要： A lead frame includes, as an outermost plating layer, a roughened silver plating layer having acicular projections and covering only top faces on the upper surface side of a lead frame substrate made of a copper-based material. The roughened silver plating layer has a crystal structure in which the crystal direction occupies a largest proportion among the crystal directions , , and . The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.
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公开(公告)号：US10305007B2
公开(公告)日：2019-05-28
申请号：US15661479
申请日：2017-07-27
发明人： Kaoru Hishiki , Kazunori Iitani
摘要： A multi-row LED wiring member includes a first plating layer, a second plating layer and a resin layer, to form individual wiring members arrayed in a matrix. In each wiring member, the first plating layer and the second plating layer constitute a laminated piece to form a pad portion and a laminated piece to form a lead portion. A first surface of the first plating layer is uncovered on a first-surface side of the resin layer. The second plating layer is formed on a part of a second surface of the first plating layer as being uncovered on a second-surface side of the resin layer. The laminated pieces substantially have a T-shape or L-shape as viewed from a lateral side. The first surface of the first plating layer is a surface of an Ag plating layer formed by removal of a metal plate, to maintain a good reflectance without brightener.
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公开(公告)号：US10763202B2
公开(公告)日：2020-09-01
申请号：US16196507
申请日：2018-11-20
发明人： Kaoru Hishiki , Ichinori Iidani
IPC分类号： H05K1/11 , H05K1/18 , H01L23/49 , H01L23/498 , H01L23/50 , H01L21/56 , H01L21/48 , H05K3/10 , H01L23/31 , H01L23/00
摘要： A multi-row wiring member configured of a plurality of wiring members arrayed in a matrix includes a resin layer, a first plating layer forming internal terminals, a plating layer forming wiring portions and a second plating layer forming external terminals. The first plating layer is formed in the resin layer with lower faces thereof uncovered in a bottom surface of the resin layer. The plating layer forming wiring portions is formed on the first plating layer in the resin layer. The second plating layer is formed in the resin layer on partial areas within areas of the plating layer forming wiring portions, with upper faces thereof being uncovered on a top-surface side of the resin layer. On a bottom-surface side of the resin layer, a metal frame is formed at a margin around an aggregate of individual wiring members arrayed in the matrix.
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公开(公告)号：US10763196B1
公开(公告)日：2020-09-01
申请号：US16825038
申请日：2020-03-20
发明人： Kaoru Hishiki , Keiichi Otaki , Hidehiko Sasaki , Kotaro Tomeoka
IPC分类号： H01L23/495 , H01L21/48 , H01L23/00 , H01L21/56 , H01L23/31
摘要： A lead frame includes, as an outermost plating layer, a roughened silver plating layer having acicular projections and covering the entire surface of a lead frame substrate made of a copper-based material. The roughened silver plating layer has a crystal structure in which the crystal direction occupies a largest proportion among the crystal directions , , and . The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.
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公开(公告)号：US10304760B2
公开(公告)日：2019-05-28
申请号：US15891755
申请日：2018-02-08
发明人： Jun Fukuzaki
摘要： A lead frame constitutes a product unit in a multi-row lead frame and has a dam bar and a lead connected together. The dam bar has a first site where connection is made with the lead and a second site adjoining the first site without connection with the lead. A predetermined range in the lead near a connecting portion with the dam bar and the second site in the dam bar have a plate thickness smaller than that of the first site having a same plate thickness as a metal plate as a material from which the dam bar and the lead are made.
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公开(公告)号：US10811346B2
公开(公告)日：2020-10-20
申请号：US16824991
申请日：2020-03-20
发明人： Kaoru Hishiki , Keiichi Otaki , Hidehiko Sasaki , Kotaro Tomeoka
IPC分类号： H01L21/02 , H01L23/495 , H01L21/48 , H01L23/31
摘要： A lead frame includes a lead frame substrate made of a copper-based material, plating layers composed of nickel, palladium and gold layers laminated in this order on top faces and bottom faces of the lead frame substrate, and a roughened silver plating layer having acicular projections, provided as an outermost plating layer and covering faces of the lead frame substrate that form concavities or a through hole between the top faces and the bottom faces of the lead frame substrate. The roughened silver plating layer has a crystal structure in which the crystal direction occupies a largest proportion among the crystal directions , and . The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.
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8.发明申请公开(公告)号：US20200312753A1
公开(公告)日：2020-10-01
申请号：US16833137
申请日：2020-03-27
发明人： Kaoru Hishiki , Keiichi Otaki , Hidehiko Sasaki , Kotaro Tomeoka
IPC分类号： H01L23/495 , H01L23/00 , H05K1/09 , H05K1/11 , H05K1/18
摘要： A device for mounting a semiconductor element includes a metal plate serving as a base, a roughened silver plating layer with acicular projections, formed on at least either of: (a) top faces; and (b) faces that form concavities or through holes between the top faces and bottom faces; of the metal plate, and a reinforcing plating layer covering, as an outermost plating layer, an outer surface of the acicular projections in the roughened silver plating layer. The roughened silver plating layer has a crystal structure in which the crystal direction occupies a largest proportion among the crystal directions , , and . An outer surface of the reinforcing plating layer is shaped to have acicular projections with a surface area ratio of 1.30 or more and 6.00 or less to the corresponding smooth surface, as inheriting the shape of the acicular projections in the roughened silver plating layer.
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公开(公告)号：US20200303287A1
公开(公告)日：2020-09-24
申请号：US16825038
申请日：2020-03-20
发明人： Kaoru Hishiki , Keiichi Otaki , Hidehiko Sasaki , Kotaro Tomeoka
IPC分类号： H01L23/495 , H01L21/48 , H01L23/00 , H01L21/56 , H01L23/31
摘要： A lead frame includes, as an outermost plating layer, a roughened silver plating layer having acicular projections and covering the entire surface of a lead frame substrate made of a copper-based material. The roughened silver plating layer has a crystal structure in which the crystal direction occupies a largest proportion among the crystal directions , , and . The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.
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公开(公告)号：US20200303286A1
公开(公告)日：2020-09-24
申请号：US16824991
申请日：2020-03-20
发明人： Kaoru Hishiki , Keiichi Otaki , Hidehiko Sasaki , Kotaro Tomeoka
IPC分类号： H01L23/495 , H01L23/31 , H01L21/48
摘要： A lead frame includes a lead frame substrate made of a copper-based material, plating layers composed of nickel, palladium and gold layers laminated in this order on top faces and bottom faces of the lead frame substrate, and a roughened silver plating layer having acicular projections, provided as an outermost plating layer and covering faces of the lead frame substrate that form concavities or a through hole between the top faces and the bottom faces of the lead frame substrate. The roughened silver plating layer has a crystal structure in which the crystal direction occupies a largest proportion among the crystal directions , and . The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.
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