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公开(公告)号：US5885507A
公开(公告)日：1999-03-23
申请号：US727540
申请日：1996-10-22
IPC分类号： B29C45/26 , B29C45/02 , B29C45/14 , B29C45/46 , B29C45/53 , B29L31/34 , H01L21/56 , B29C31/08
CPC分类号： B29C45/462 , B29C45/02 , B29C2045/024
摘要： A method for feeding plastic tablets to an installation for encasing articles such as ICs. The tablets (9) are fed horizontally in a direction perpendicular thereto when the divisible mold (2, 3) is open or closed. Feeding of the tablets takes place in a distribution channel (8). In this way, the amount of plastic can be metered more accurately and the diversity in pellet weights and dimensions can be dramatically reduced. A plunger (6) is lowered sufficiently to apply pressure against the tablets in the distribution channel (8), thereby distributing the plastic into the mold cavities (10).
摘要翻译： PCT No.PCT / NL95 / 00177 Sec。 371日期1996年10月22日第 102（e）日期1996年10月22日PCT提交1995年5月23日PCT公布。 公开号WO95 / 32087 日期1995年11月30日一种用于将塑料片供给到用于封装诸如IC的物品的装置的方法。 当可分开的模具（2,3）打开或关闭时，片剂（9）沿与其垂直的方向水平地进给。 片剂的进料在分配通道（8）中进行。 以这种方式，可以更精确地计量塑料的量，并且可以显着降低颗粒重量和尺寸的多样性。 柱塞（6）被充分降下以在分配通道（8）中对片剂施加压力，从而将塑料分配到模腔（10）中。
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公开(公告)号：US2460964A
公开(公告)日：1949-02-08
申请号：US46006442
申请日：1942-09-29
申请人： WESTERN ELECTRIC CO
发明人： ADAIR FRANK M , BRUNNER ANTON J , TREBES BRUNO M A
CPC分类号： B29C45/02 , B29C45/26 , B29C2045/024
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公开(公告)号：US4983110A
公开(公告)日：1991-01-08
申请号：US323497
申请日：1989-03-13
CPC分类号： B29C45/14655 , B29C45/02 , H01L21/565 , H01L24/97 , B29C2045/024 , B29C2045/2712 , H01L2924/181
摘要： A resin encapsulating apparatus for semiconductor devices is characterized by including a rectangular pot constituted by being surrounded with two opposed wall surfaces of short side each having an outwardly projecting curved surface and two opposed wall surfaces of long side which are each substantially in the form of a straight line; a plurality of cavity lines connected respectively through gates to the bottom portion of at least one said long-side wall surface of the pot, the cavity lines each consisting of cavities connected in series; and a plunger to be inserted into the pot.
摘要翻译： 一种用于半导体器件的树脂封装装置的特征在于包括矩形盆，该矩形盆由两个相对的短边的相对的壁表面围绕，每个具有向外突出的弯曲表面和两个相对的长边的相对的壁表面基本上呈 直线; 多个腔体线分别通过浇口连接到所述罐的至少一个所述长边壁表面的底部，每个空腔线由空腔连接成串联连接; 以及插入锅中的柱塞。
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公开(公告)号：US4460537A
公开(公告)日：1984-07-17
申请号：US401575
申请日：1982-07-26
申请人： Preston J. Heinle
发明人： Preston J. Heinle
IPC分类号： B29C43/00 , B29C45/00 , B29C45/02 , B29C45/14 , B29C45/26 , H01L21/56 , H05K13/00 , B29F1/10
CPC分类号： H01L24/97 , B29C45/02 , B29C45/14655 , H01L21/565 , B29C2045/024 , H01L2224/48247 , H01L2924/181
摘要： An improved means and method is provided for encapsulating electronic devices and other objects by transfer molding. The mold cavities are arranged in rows, disposed adjacent to and parallel with slot-shaped encapsulant reservoirs, and coupled to the reservoirs by short feeder channels of uniform length. Preferably, a row of cavities is located in a mirror symmetric fashion on either side of and parallel with each slot-shaped reservoir. A tightly fitting blade moves in each slot-shaped reservoir to compress and liquify the plastic encapsulant charge, injecting it into the mold cavities containing the component to be encapsulated. Plastic utilization can exceed 90%, and better control over molding conditions can be obtained because the plastic material reaches each mold cavity at the same stage of the liquification-solidification cycle. More cavities can be fitted in a given mold area because the usual central material pot and runner-tree are eliminated.
摘要翻译： 提供改进的装置和方法，用于通过传递模塑来封装电子装置和其它物体。 模具腔排列成与狭缝状密封剂储存器相邻并平行设置，并且通过具有均匀长度的短进料通道联接到储存器。 优选地，一排空腔以每个槽形储存器的任一侧并且平行于镜对称的方式定位。 紧密配合的叶片在每个槽形容器中移动以压缩和液化塑料密封剂装料，将其注入包含待包封的部件的模腔中。 塑料利用率可以超过90％，因为在液化凝固循环的同一阶段塑料材料到达每个模具腔体，所以可以获得更好的控制成型条件。 更多的空腔可以安装在给定的模具区域，因为消除了通常的中心材料锅和流道树。
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