公开(公告)号：US06536649B1

公开(公告)日：2003-03-25

申请号：US09627437

申请日：2000-07-28

申请人： Raj N. Master ,  Jonathan D. Halderman

发明人： Raj N. Master ,  Jonathan D. Halderman

IPC分类号： B23R3704

CPC分类号： H01L21/67253

摘要： Residue contaminates semiconductor devices during processing in a furnace. Residue contamination is prevented by removing the residue before it builds up to a point where it can contaminate semiconductor devices. Residue build-up is monitored using a residue build-up monitoring device mounted on the furnace exhaust stack. When residue build-up reaches a predetermined level a signal is generated by the residue build-up monitoring device notifying technicians that furnace cleaning is required.

摘要翻译： 残渣在炉中加工期间污染半导体器件。 通过在残留物积聚到可能污染半导体器件的点之前去除残留物来防止残留污染。 使用安装在炉排气堆上的残渣积聚监测装置来监测残留物积聚。 当残渣累积达到预定水平时，残留物积聚监测装置产生信号，通知技术人员需要进行炉清洗。