公开(公告)号：US06721622B2

公开(公告)日：2004-04-13

申请号：US10244029

申请日：2002-09-16

申请人： Tatsuya Inagaki ,  Toshihiro Yonezu ,  Satoshi Abeta

发明人： Tatsuya Inagaki ,  Toshihiro Yonezu ,  Satoshi Abeta

IPC分类号： B24B4910

CPC分类号： G05B19/408

摘要： A profile data compensating method comprises a step of generating effective profile data by operating a machine tool under a non-load condition in accordance with theoretical profile data, a step of generating first error profile data representing error components of a control system, a step of generating first compensated profile data based upon the first error profile data, a step of generating measured profile data by measuring the shape of the workpiece machined in accordance with the first compensated profile data, a step of generating second error profile data representing error components of a mechanical system, and a step of generating second compensated profile data based upon the first and second error profile data.

摘要翻译： 轮廓数据补偿方法包括通过根据理论轮廓数据在非负载条件下操作机床来产生有效轮廓数据的步骤;产生表示控制系统的误差分量的第一误差轮廓数据的步骤;步骤 基于第一误差轮廓数据生成第一补偿轮廓数据;通过测量根据第一补偿轮廓数据加工的工件的形状来生成测量轮廓数据的步骤;产生表示误差分量的第二误差轮廓数据的步骤 机械系统，以及基于第一和第二误差轮廓数据产生第二补偿轮廓数据的步骤。

公开(公告)号：US06230070B1

公开(公告)日：2001-05-08

申请号：US09038538

申请日：1998-03-11

申请人： Tatsuo Yodoshi

发明人： Tatsuo Yodoshi

IPC分类号： B24B4910

CPC分类号： B23Q3/186 ,  B23Q1/267 ,  B23Q1/34 ,  B23Q17/2291

摘要： An apparatus for adjusting the position of a work mounted on a machine tool. A base is fixed to a work table of the machine tool, and the position of a mounting member is adjusted with respect to the base. The work is mounted on a mounting surface of the mounting member. The positions in the Z-axis direction of central portions of the four sides of the mounting member are adjusted by first driving and fixing members so that a work surface of the work is along an X-Y plane. The position where the mounting member is rotated around the Z-axis is then adjusted by second driving and fixing members arranged in the central portions of the pair of opposite sides of the mounting member so that a plane of the work is parallel to an X-Z plane. Each of the driving and fixing members includes piezoelectric displacement elements for adjusting an amount of displacement in response to an applied voltage so as to fix the mounting member in a state where the amount of displacement is adjusted.

摘要翻译： 一种用于调节安装在机床上的工件的位置的装置。 将基座固定到机床的工作台上，并且相对于基座调整安装构件的位置。 工件安装在安装构件的安装表面上。 通过第一驱动固定部件来调整安装部件的四侧的中心部的Z轴方向的位置，使得工件的工作面沿着X-Y平面。 然后通过设置在安装构件的一对相对侧的中心部分的第二驱动和固定构件来调节安装构件围绕Z轴旋转的位置，使得工件的平面平行于XZ平面 。 每个驱动和固定构件包括压电位移元件，用于响应于施加的电压来调节位移量，以便将安装构件固定在调节位移量的状态。

公开(公告)号：US06764381B2

公开(公告)日：2004-07-20

申请号：US10388508

申请日：2003-03-17

申请人： Norio Kimura ,  Hideji Isobe ,  Kazuo Shimizu ,  Hiroyuki Osawa

发明人： Norio Kimura ,  Hideji Isobe ,  Kazuo Shimizu ,  Hiroyuki Osawa

IPC分类号： B24B4910

CPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/10 ,  H01L21/30625

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.

摘要翻译： 抛光装置用于抛光诸如半导体晶片的基板，并且具有能够连续地检测导电层的厚度的传感器。 抛光装置包括具有抛光表面的抛光台和用于将基板保持并压靠在抛光表面上以抛光基板的表面的顶环。 诸如涡电流传感器的传感器设置在抛光台的抛光表面下方，用于测量在基板表面上形成的导电层的厚度。

公开(公告)号：US06558229B2

公开(公告)日：2003-05-06

申请号：US09760823

申请日：2001-01-17

申请人： Norio Kimura ,  Hideji Isobe ,  Kazuo Shimizu ,  Hiroyuki Osawa

发明人： Norio Kimura ,  Hideji Isobe ,  Kazuo Shimizu ,  Hiroyuki Osawa

IPC分类号： B24B4910

CPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/10 ,  H01L21/30625

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.

摘要翻译： 抛光装置用于抛光诸如半导体晶片的基板，并且具有能够连续地检测导电层的厚度的传感器。 抛光装置包括具有抛光表面的抛光台和用于将基板保持并压靠在抛光表面上以抛光基板的表面的顶环。 诸如涡电流传感器的传感器设置在抛光台的抛光表面下方，用于测量在基板表面上形成的导电层的厚度。