公开(公告)号：US06764381B2

公开(公告)日：2004-07-20

申请号：US10388508

申请日：2003-03-17

申请人： Norio Kimura ,  Hideji Isobe ,  Kazuo Shimizu ,  Hiroyuki Osawa

发明人： Norio Kimura ,  Hideji Isobe ,  Kazuo Shimizu ,  Hiroyuki Osawa

IPC分类号： B24B4910

CPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/10 ,  H01L21/30625

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.

摘要翻译： 抛光装置用于抛光诸如半导体晶片的基板，并且具有能够连续地检测导电层的厚度的传感器。 抛光装置包括具有抛光表面的抛光台和用于将基板保持并压靠在抛光表面上以抛光基板的表面的顶环。 诸如涡电流传感器的传感器设置在抛光台的抛光表面下方，用于测量在基板表面上形成的导电层的厚度。

公开(公告)号：US06558229B2

公开(公告)日：2003-05-06

申请号：US09760823

申请日：2001-01-17

申请人： Norio Kimura ,  Hideji Isobe ,  Kazuo Shimizu ,  Hiroyuki Osawa

发明人： Norio Kimura ,  Hideji Isobe ,  Kazuo Shimizu ,  Hiroyuki Osawa

IPC分类号： B24B4910

CPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/10 ,  H01L21/30625

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.

摘要翻译： 抛光装置用于抛光诸如半导体晶片的基板，并且具有能够连续地检测导电层的厚度的传感器。 抛光装置包括具有抛光表面的抛光台和用于将基板保持并压靠在抛光表面上以抛光基板的表面的顶环。 诸如涡电流传感器的传感器设置在抛光台的抛光表面下方，用于测量在基板表面上形成的导电层的厚度。

公开(公告)号：US06984164B2

公开(公告)日：2006-01-10

申请号：US10864322

申请日：2004-06-10

申请人： Norio Kimura ,  Hideji Isobe ,  Kazuo Shimizu ,  Hiroyuki Osawa

发明人： Norio Kimura ,  Hideji Isobe ,  Kazuo Shimizu ,  Hiroyuki Osawa

IPC分类号： B24B49/10

CPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/10 ,  H01L21/30625

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.