Integral plated resistor and method for the manufacture of printed circuit boards comprising the same
    1.
    发明授权

    公开(公告)号:US07022464B2

    公开(公告)日:2006-04-04

    申请号:US10925589

    申请日:2004-08-25

    IPC分类号: G03F7/00 C22C18/32

    摘要: An integral plated resistor having an improved range of resistance is produced by uniformly dispersing an effective amount of various particles in an electroless nickel phosphorus plating composition so that the particles are codeposited with the electroless nickel phosphorus plating composition. Preferred particles include, polytetrafluoroethylene, silicon carbide, tungsten carbide, and other particles that fully sinter at a temperature of less than about 170° C. The improved nickel phosphorus plated resistors of the invention demonstrate increased stability during manufacturing press cycles and a greater range of resistance values than have previously been achieved.

    摘要翻译: 通过将有效量的各种颗粒均匀分散在无电镀镍磷电镀组合物中,使得颗粒与无电镀镍磷电镀组合物共沉积,从而产生具有改善的电阻范围的整体镀覆电阻。 优选的颗粒包括聚四氟乙烯,碳化硅,碳化钨和在小于约170℃的温度下完全烧结的其它颗粒。本发明的改进的镀镍电阻器在制造压制循环期间表现出增加的稳定性和更大范围的 电阻值比以前已经实现。