Method of forming silicided gate structure
    1.
    发明授权
    Method of forming silicided gate structure 失效
    形成硅化栅结构的方法

    公开(公告)号:US07015126B2

    公开(公告)日:2006-03-21

    申请号:US10859730

    申请日:2004-06-03

    Abstract: A method of forming a silicided gate of a field effect transistor on a substrate having active regions is provided. The method includes the following steps: (a) forming a silicide in at least a first portion of a gate; (b) after step (a), depositing a metal over the active regions and said gate; and (c) annealing to cause the metal to react to form silicide in the active regions, wherein the thickness of said gate silicide is greater than the thickness of said silicide in said active regions.

    Abstract translation: 提供了在具有有源区的基板上形成场效应晶体管的硅化物栅的方法。 该方法包括以下步骤:(a)在栅极的至少第一部分中形成硅化物; (b)在步骤(a)之后,在有源区域和所述栅极上沉积金属; 和(c)退火以引起金属反应以在有源区中形成硅化物,其中所述栅极硅化物的厚度大于所述有源区中所述硅化物的厚度。

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