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公开(公告)号：US06535460B2
公开(公告)日：2003-03-18
申请号：US09935754
申请日：2001-08-23
IPC分类号： H04R1900
CPC分类号： B81B3/0072 , B81B2201/0264 , B81B2203/0127 , H04R19/005 , H04R31/00 , H04R31/006
摘要： An acoustic transducer is disclosed including: a fixed perforated member; a freely movable diaphragm spaced from the perforated member; a support ring in the perforated member maintaining the proper spacing between the diaphragm and the perforated member near the perimeter; means of suspension allowing the diaphragm to rest freely on the support ring and yet mechanically decouples the diaphragm from the perforated member; means of applying an electrical field in the space between the perforated member and the diaphragm; means of detecting the change of electrical capacitance between the perforated member and the diaphragm when the diaphragm moves in response to an incident acoustic sound pressure wave.
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2.发明授权公开(公告)号：US06493288B2
公开(公告)日：2002-12-10
申请号：US09728713
申请日：2000-11-30
IPC分类号： H04R1900
摘要： A wide frequency band micromachined microphone including a plurality of micromachined cells of the type including electrodes carried by a membrane supported above a common electrode with conductive lines interconnecting the electrodes is described. A method of operating a microphone array is also described.
摘要翻译： 一种宽频带微机械麦克风，包括多个微加工单元，其类型包括由支撑在公共电极上的膜承载的电极，导电线与互连电极。 还描述了操作麦克风阵列的方法。
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3.发明授权Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections 有权具有通过晶圆通孔连接的电容微加工超声换能器元件阵列公开(公告)号：US06430109B1
公开(公告)日：2002-08-06
申请号：US09667203
申请日：2000-09-21
IPC分类号： H04R1900
CPC分类号： H01L21/76898 , B06B1/0292 , H01L23/481 , H01L2224/05568 , H01L2224/05573 , H01L2224/131 , H01L2224/16145 , H01L2924/00014 , H01L2924/014 , H01L2224/05599
摘要： There is described a cMUT array with transducer elements which include a plurality of cells with membranes formed on one surface of a wafer. Voltages applied between said spaced electrodes drive said membranes. The voltages applied to said electrodes are applied from the opposite surface of the wafer through the wafer and through vias formed in the wafer.
摘要翻译： 描述了具有换能器元件的cMUT阵列，其包括形成在晶片的一个表面上的膜的多个单元。 施加在所述间隔开的电极之间的电压驱动所述膜。 施加到所述电极的电压从晶片的相对表面通过晶片和通过形成在晶片中的通孔施加。
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4.发明授权Capacitive micromachined ultrasonic transducer arrays with reduced cross-coupling 有权具有减小的交叉耦合的电容式微机械超声换能器阵列公开(公告)号：US06262946B1
公开(公告)日：2001-07-17
申请号：US09408156
申请日：1999-09-29
IPC分类号： H04R1900
CPC分类号： B06B1/0292 , G10K11/002
摘要： There is described a capacitive micromachined ultrasonic transducer array which is configured to minimize the excitation and propagation of plate waves traveling in the substrate and ultrasonic waves propagating at the interface between the array surface and the immersion fluid.
摘要翻译： 描述了一种电容微机械超声换能器阵列，其被配置为最小化在基板中行进的板波的激发和传播以及在阵列表面和浸没流体之间的界面处传播的超声波。
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