公开(公告)号：WO2022271590A1

公开(公告)日：2022-12-29

申请号：PCT/US2022/034166

申请日：2022-06-20

Applicant: DOW SILICONES CORPORATION

Inventor： CHON, Jina

IPC: C08F290/06 ,  C08F220/30 ,  C08F2/50 ,  C08F2/44 ,  C08G77/14

Abstract: A dual curable silicone composition is provided. The composition comprises: (A) an epoxy-functional silicone; (B) at least one radically polymerizable compound having at least one acrylic or methacrylic group per molecule; (C) a photo acid generator and/or a thermal acid generator; and (D) a photo radical polymerization initiator and/or a thermal radical polymerization initiator. The composition generally has excellent curability without being inhibited by air and amine compounds.

公开(公告)号：WO2021127246A1

公开(公告)日：2021-06-24

申请号：PCT/US2020/065712

申请日：2020-12-17

Applicant: DOW SILICONES CORPORATION

Inventor： CHON, Jina

IPC: C08L83/06 ,  C08G77/14 ,  C08K3/013

Abstract: A curable silicone composition is provided. The composition comprises: (A) an epoxy-functional silicone resin having monovalent aromatic hydrocarbon groups; (B) an epoxy-functional silicone having monovalent aromatic hydrocarbon groups; and (C) a cationic photoinitiator. Optionally, the composition further comprises (D) an epoxy-functional silicone free of monovalent aromatic hydrocarbon groups. The composition has excellent curability with UV radiation, and further with heating, generally forms a cured product with excellent transparency and mechanical properties.

公开(公告)号：WO2022072271A1

公开(公告)日：2022-04-07

申请号：PCT/US2021/052167

申请日：2021-09-27

Applicant: DOW SILICONES CORPORATION

Inventor： CHON, Jina

IPC: C08L83/06 ,  C08G77/14

Abstract: A curable silicone composition is provided. The composition comprises: (A) an epoxy-functional silicone resin having monovalent aromatic hydrocarbon groups; (B) an epoxy-functional silicone; and (C) a mixture of cationic photoinitiators comprising: (C-1) an iodonium salt type cationic photoinitiator and (C-2) a sulfonium salt type cationic photoinitiator. The composition has excellent curability with UV radiation, and further with heating, generally forms a cured product with excellent transparency.

公开(公告)号：WO2022186650A1

公开(公告)日：2022-09-09

申请号：PCT/KR2022/003078

申请日：2022-03-04

Applicant: LEE, Gyuyoung ,  DOW SILICONES CORPORATION ,  CHON, Jina

Inventor： LEE, Gyuyoung ,  CHON, Jina

IPC: C08L83/04 ,  C08L83/06 ,  C08G77/14 ,  C08G77/20 ,  C08K5/23 ,  C08K5/00

Abstract: A curable silicone composition is provided. The composition comprises: (A) an epoxy-functional organopolysiloxane resin having monovalent aromatic hydrocarbon groups; (B) an epoxy-functional organosiloxane oligomer; (C) a photoacid generator and/or a thermal acid generator; and (D) a black azo dye. The composition exhibits good to excellent storage stability, and cures to form a cured product exhibiting good to excellent shading property without causing shirinkage and "MURA" defects.

公开(公告)号：WO2022066837A1

公开(公告)日：2022-03-31

申请号：PCT/US2021/051651

申请日：2021-09-23

Applicant: DOW SILICONES CORPORATION

Inventor： CHON, Jina

IPC: C08L83/06 ,  C08G77/26 ,  C08G77/18 ,  C08G77/20 ,  C08G77/00 ,  C09J7/10

Abstract: A curable silicone composition is provided. The composition comprises: (A) an epoxy-functional silicone resin having monovalent aromatic hydrocarbon groups; (B) an epoxy-functional silicone; (C) a cationic photoinitiator; and (D) a silatrane derivative or a carbasilatrane derivative, wherein each derivative has at least one silicon atom-bonded alkoxy group per molecule. The composition has excellent curability with UV radiation, and further with heating, generally forms a cured product with excellent thermal and light resistance, and adhesion properties.

公开(公告)号：WO2019027993A1

公开(公告)日：2019-02-07

申请号：PCT/US2018/044561

申请日：2018-07-31

Applicant: DOW SILICONES CORPORATION

Inventor： CHON, Jina ,  YOOK, Ju Young

IPC: C08K3/36 ,  C08G77/12 ,  C08G77/20 ,  C08L83/06 ,  C08L83/04 ,  C08G77/16 ,  H01L23/29 ,  H01L33/56

Abstract: A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises a constituent (B-1) containing at least 0.5 wt.% of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt.% of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; (C) an adhesion promoter; and (D) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively high hardness.