Abstract:
A memory device for deep neural network, DNN, accelerators, a method of fabricating a memory device for deep neural network, DNN, accelerators, a method of convoluting a kernel [A] with an input feature map [B] in a memory device for a deep neural network, DNN, accelerator, a memory device for a deep neural network, DNN, accelerator, and a deep neural network, DNN, accelerator. The method of fabricating a memory device for deep neural network, DNN, accelerators comprises the steps of forming a first electrode layer comprising a plurality of bit-lines; forming a second electrode layer comprising a plurality of word-lines; and forming an array of memory elements disposed at respective cross-points between the plurality of word-lines and the plurality of bit-lines; wherein at least a portion of the bit-lines are staggered such that a location of a first cross-point between the bit-line and a first word-line is displaced along a direction of the word-lines compared to the cross-point between said bit-line and a second word-line adjacent the first word-line;.or wherein at least a portion of the word-lines are staggered such that a location of a cross-point between the word-line and a first bit-line is displaced along a direction of the bit-lines compared to a cross-point between said word-line and a second bit-line adjacent the first bit-line.
Abstract:
Apparatuses, systems, and methods for ferroelectric memory (FeRAM) cell operation. An FeRAM cell may have different charge regions it can operate across. Some regions, such as dielectric regions, may operate faster, but with reduced signal on a coupled digit line. To improve the performance while maintaining increased speed, two digit lines may be coupled to the same sense amplifier, so that the FeRAM cells coupled to both digit lines contribute signal to the sense amplifier. For example a first digit line in a first deck of the memory and a second digit line in a second deck of the memory may both be coupled to the sense amplifier. In some embodiments, additional digit lines may be used as shields (e.g., by coupling the shield digit lines to a ground voltage) to further improve the signal-to-noise ratio.
Abstract:
A three-dimensional memory including bit line contacts arranged in two portions, a first portion of bit line contacts coupled to the bit lines at positions proximate a first edge of the array of memory cells and a second portion of bit line contacts coupled to the bit lines at positions proximate a second edge of the array of memory cells; and word line contacts arranged in two portions, a first portion of word line contacts coupled to the word lines at positions proximate a third edge of the array of memory cells and a second portion of word line contacts coupled to the word lines at positions proximate a fourth edge of the array of memory cells.
Abstract:
A structure for an integrated circuit is disclosed for storing data. The integrated circuit includes a memory cell array of bit cells configured in a static random access memory (SRAM) architecture. The memory cell array is coupled to wordlines arranged in rows that control operations such as Read and Write operations. To enhance the read sensing margin of the SRAM configuration, the read port of a bit cell may include a wordline that drives two transistors (e.g., a PMOS and an NMOS transistor) to reduce data-dependent current leakage from a read bitline. An additional weak transistor keeper configuration may be used in the integrated circuit to compensate for current leakage from the read bitline. For example, a weak NMOS keeper that includes a sense amplifier, an inverter, and an NMOS connected to supply voltage VDD provides a path between the read bitline and VDD through the weak NMOS keeper.
Abstract:
A memory array with memory cells arranged in rows and columns. Each memory cell includes source and drain regions with a channel region there between, a floating gate disposed over a first channel region portion, and a second gate disposed over a second channel region portion. A plurality of bit lines each extends along one of the columns and is electrically connected to the drain regions of a first group of one or more of the memory cells in the column and is electrically isolated from the drain regions of a second group of one or more of the memory cells in the column. A plurality of source lines each is electrically connected to the source regions memory cells in one of the columns or rows. A plurality of gate lines each is electrically connected to the second gates of memory cells in one of the columns or rows.
Abstract:
There is provided a method for accessing a memory cell of a plurality of memory cells that are part of a memory unit, the memory cells being grouped into a plurality of memory cell groups, wherein each memory cell group is associated with one or more local bit lines with each of the one or more local bit lines being operatively connected to a corresponding global bit line via a passgate comprising a PMOS transistor. The method comprises connecting each of the one or more local bit lines to the corresponding global bit line by decreasing a gate voltage that is applied to a gate of the corresponding PMOS transistor to a value that is sufficient to allow the PMOS transistor to conduct, wherein the value of the gate voltage that is sufficient to allow the PMOS transistor to conduct is either a positive or negative voltage.
Abstract:
A method for an associative memory array includes storing each column of a matrix in an associated column of the associative memory array, where each bit in row j of the matrix is stored in row R-matrix-row-j of the array, storing a vector in each associated column, where a bit j from the vector is stored in an R-vector-bit-j row of the array. The method includes simultaneously activating a vector-matrix pair of rows R- vector-bit-j and R-matrix-row-j to concurrently receive a result of a Boolean function on all associated columns, using the results to calculate a product between the vector- matrix pair of rows, and writing the product to an R-product-j row in the array.
Abstract:
There is provided a multiple data rate memory configured to implement first and second memory accesses within a single cycle of an external clock signal. The memory comprises a plurality of memory cell groups, each memory cell group comprising a plurality of memory cells that are each operatively connected to at least one local bit line, the at least one local bit line of each memory cell group being connected to a local-to-global interface circuit. The local-to- global interface circuit is configured to control the state of at least one first global bit line in dependence upon the state of the at least one local bit line during the first memory access and to control the state of at least one second global bitline in dependence upon the state of the at least one local bit line during the second memory access.