摘要:
In an optoelectronic module, the optoelectronic active components (12, 14) are produced as a sequence of epitaxially grown layers on the top surface of a substrate (1). The waveguide layers located in these components are connected to one another, and/or to outer connection surfaces, by passive waveguides (15) made of a material which differs from all the semiconductor materials of which the active components are made.
摘要:
An optically transmissive material and the production of optically transmissive articles therefrom, in particular a bond between two optically transmissive components including optical fibers and planar devices.
摘要:
An impermeable encapsulation of an optocomponent is fabricated by first arranging waveguides (9) and an optoelectronic component (11) on a base (3), preferably of silicon, and connecting them optically to each other. The optoelectronic component (11) is connected to electric driver circuits (15). Thereafter a silica layer (17) is deposited over a region of the substrate (3), after which it is encapsulated by applying a layer (19) of a curable plastics material. The deposition (19) of silica provides an impermeable inner encapsulation and prevents, when applying the curable plastics material, plastics from penetrating between the inner ends of the waveguides (9) and the optoelectronic component (11), and thus the optical contact is secured therebetween.
摘要:
An optical interconnect is disclosed that couples multiple optical fibers (135) to an array of optoelectronic device. The interconnect includes a multiple optical fiber connector (150) and an optoelectronic board (100). The multiple fiber connector (150) can be mechanically attached to or detached from the board (100).
摘要:
A heterostructure device includes a ridge-waveguide laser (11) monolithically integrated with a ridge-waveguide rear facet monitor [RFM] (12). An integral V-groove etched directly into the device substrate (10) enables passive alignment of an optical fiber (13) to the active region (11-1) of the laser (11). The laser and RFM facets were formed using an in-situ multistep reactive ion etch process.
摘要:
The method proposed is intended to minimize the technical complexity required to integrate optical components into fibre-optic systems. This is done by placing an optical component (29) in a die (10) with positioning elements (13) which ensure that the optical component (29) is correctly aligned, and the optical component (29) is embedded in a curable liquid which, when solid, forms the cover (25).
摘要:
A method is provided for forming an optical waveguide structure (10) upon a substrate (12) in accordance with the steps of: (a) forming a layer of base coat material upon the substrate (12), (b) forming a layer of cladding material (20) having a predetermined refractive index upon the base coat layer, (c) applying a channel waveguide pattern defining structure (10) to the layer of cladding material (20), (d) applying a patterning agent to transfer the pattern of the channel waveguide pattern defining structure (10) to a predetermined depth or depths into the cladding material layer (20) to define a waveguide trench pattern, (e) removing any remaining residue of channel waveguide pattern defining structure(10), (f) forming a thick coat layer (16) of waveguide material having a higher refractive index than the cladding material (20) onto the cladding material (20) and into the waveguide trench pattern, (g) planarizing the waveguide material (20) substantially to the plane of a topmost surface of the cladding material (20) in order to reduce the thickness of the thick coat layer (16), and (h) forming a layer of additional cladding material (26) to encapsulate the waveguide material in the waveguide trench pattern. An out-of-plane mirror (28) can be used to couple two different layers together optically. A lens element can be used for collimating light reflected by the out-of-plane mirror (28).
摘要:
In a semiconductor component with a silicon layer (1), a silicon-containing waveguide (2) and a diode structure connected to external conductive contacts (6, 7), the diode structure is in such an arrangement with the waveguide (2) that it can be affected by electron-hole pairs generated in the waveguide (2) by photons. To construct a semiconductor component with an optical waveguide (2) and an integrated diode structure in which high losses on the optical waveguide (2) are avoided, the waveguide (2) is slightly doped and a germanium layer is a part of the diode structure. The semiconductor component is suitable as an integrated optical component for optical-electric transformation.
摘要:
An integrated fiber optic coupler useful for the optical transmission of data from a light source to a detector (4) located on a semiconductor chip which comprises a semiconductor wafer (1) with a cavity (2) etched into a surface, means within the cavity for converting light into an electrical signal, an electroconductive metal (5) deposited on the surface of the semiconductor wafer (1) around the opening of the cavity (2) forming an electrical connection between the means for converting light into an electrical signal and circuitry etched into the wafer (1) and an optical fiber (6, 7) inserted into the cavity (2) and affixed to the semiconductor wafer (1).
摘要:
Optical assemblies, interconnection substrates and methods of forming optical links are disclosed. In one embodiment, an optical assembly includes a first waveguide substrate, a second waveguide substrate, and an interconnection substrate having a first end face, a second end face, and a laser written waveguide. The first waveguide substrate is coupled to the first end face of the interconnection substrate, and the first waveguide is optically coupled to the laser written waveguide. The laser written waveguide terminates at the second end face of the interconnection substrate. The second waveguide substrate is coupled to the second end face of the interconnection substrate such that the second waveguide is optically coupled to the laser written waveguide at the second end face.