摘要:
The invention relates to a laser diode device, which has a housing (1) with a mounting part (11) and a laser diode chip (2), which is based on a nitride compound semi-conductor material, in the housing (1) on the mounting part (11), wherein the laser diode chip (2) is mounted directly on the mounting part (11) by means of a solder layer (3) and the solder layer (3) has a thickness of greater than or equal to 3 mum.
摘要:
Es wird eine Laserdiodenvorrichtung angegeben, die ein Gehäuse (1) mit einem Montageteil (11) und einen auf einem Nitrid-Verbindungshalbleitermaterial basierenden Laserdiodenchip (2) im Gehäuse (1) auf dem Montageteil (11) aufweist, wobei der Laserdiodenchip (2) mittels einer Lotschicht (3) unmittelbar auf dem Montageteil (11) montiert ist und die Lotschicht (3) eine Dicke von größer oder gleich 3 μm aufweist.
摘要:
Integrated chip (1) for data or telecommunication or optical analysis for one, two or more wavelengths, wherein the chip (1) has a basic structure which is identical, from a carrier and upwards over the entire surface of the chip, wherein waveguides are formed at the upper surface of the chip (1) by way of the basic structure being etched down so that protruding waveguides (2; 4; 5) are formed, and wherein the chip (1) comprises monolithically integrated components. The invention is characterized in that a ditch (7) is etched down along at least one of the sides of one of the waveguides and down to an etch depth that is at least so large so as to achieve a ditch that is optically isolating.
摘要:
Integrated chip (1) for data or telecommunication or optical analysis for concurrent emission over at least one wavelength and receiving over at least one other wavelength, wherein the chip (1) has a basic structure which is identical, from a carrier and upwards over the entire surface of the chip (1), wherein waveguides are formed at the upper surface of the chip by way of the basic structure being etched down so that the protruding waveguides (2; 4; 5) are formed, and wherein the chip (1) comprises monolithically integrated components. The invention is characterized in that the chip (1) comprises a wavelength selective optical coupler (6), a grating based laser (41) attached to the coupler (6), a light detector (51) attached to the coupler (6) and a wavelength specific, grating based filter (52), in that both the laser (41) and the filter (52) are produced from the same monolithic basic structure, whereby the properties of the laser (41) and the filter (52) are altered in corresponding way as function of temperature, and in that the filter (52) is arranged between the laser (41) and the light detector (51) and is also opaque to the wavelengths emitted by the laser (41).
摘要:
A process for fabricating lasers capable of emitting blue light wherein a GaN wafer is etched to form laser waveguides and mirrors using a temperature of over 500 °C and an ion beam in excess of 500 V in CAIBE.
摘要:
The present invention relates to a laser sensor for self-mixing interferometry. The laser sensor comprises at least one semiconductor laser light source emitting laser radiation and at least one photodetector (6) monitoring the laser radiation of the laser light source. The laser light source is a VECSEL having a gain medium (3) arranged in a layer structure (15) on a front side of a first end mirror (4), said first end mirror (4) forming an external cavity with an external second end mirror (5). The proposed laser sensor provides an increased detection range and can be manufactured in a low-cost production process.
摘要:
Simplified laser drivers for closed path digital optical cables and digital optical cables including the simplified laser drivers. The laser driver can include less transistors than conventional laser drivers for optical communication cables. The laser can include a bias source and modulation source, The bias source can have a single constant current bias point for all laser diodes. The modulation current source can have a single temperature coefficient for all laser diodes. The laser driver can exclude, for example, any one of or combination of temperature compensation of the modulation or bias current sources, external programming of the modulation or bias current sources, power control based on output of the laser diode, and/or control based on feedback received from a monitor device or other sensor within the cables.
摘要:
A parallel optics module including singulated dies (114). A first singulated die includes a first semiconductor optical component, and a second die includes a second semiconductor optical component. The first and second dies are mounted to a substrate (112). The first and second dies to be integrated into a parallel optics module.
摘要:
A method of converting an optical wavelength includes providing a wavelength converter assembly with a photodetector and a laser with a common epitaxial structure. The epitaxial structure has areas of differing bandgap. An optical input having a first wavelength at the wavelength converter assembly is absorbed. A first electrical signal is generated from the photodetector in response to the optical input. The first electrical signal is conditioned to produce a conditioned first electrical signal. A second electrical signal is generated from the conditioned first electrical signal. A laser output is generated from a gain medium of the laser at a second wavelength in response to the second electrical signal.