LASER DIODE DEVICE
    1.
    发明申请
    LASER DIODE DEVICE 审中-公开
    二极管器件

    公开(公告)号:WO2013152909A3

    公开(公告)日:2013-12-19

    申请号:PCT/EP2013054890

    申请日:2013-03-11

    IPC分类号: H01S5/022 H01S5/024 H01S5/323

    摘要: The invention relates to a laser diode device, which has a housing (1) with a mounting part (11) and a laser diode chip (2), which is based on a nitride compound semi-conductor material, in the housing (1) on the mounting part (11), wherein the laser diode chip (2) is mounted directly on the mounting part (11) by means of a solder layer (3) and the solder layer (3) has a thickness of greater than or equal to 3 mum.

    摘要翻译: 提供了一种具有(1)具有安装部(11)的壳体的激光二极管器件,(2)在所述安装构件(11),其中,所述激光二极管芯片上的壳体(1)(2)使用基于氮化物的化合物半导体材料的激光二极管芯片上 的焊料层(3)直接在所述安装部分(11)被安装时,与焊料层(3)的厚度为大于或等于3的妈妈。

    LASERDIODENVORRICHTUNG
    2.
    发明申请
    LASERDIODENVORRICHTUNG 审中-公开
    二极管器件

    公开(公告)号:WO2013152909A2

    公开(公告)日:2013-10-17

    申请号:PCT/EP2013/054890

    申请日:2013-03-11

    IPC分类号: H01S5/022

    摘要: Es wird eine Laserdiodenvorrichtung angegeben, die ein Gehäuse (1) mit einem Montageteil (11) und einen auf einem Nitrid-Verbindungshalbleitermaterial basierenden Laserdiodenchip (2) im Gehäuse (1) auf dem Montageteil (11) aufweist, wobei der Laserdiodenchip (2) mittels einer Lotschicht (3) unmittelbar auf dem Montageteil (11) montiert ist und die Lotschicht (3) eine Dicke von größer oder gleich 3 μm aufweist.

    摘要翻译:

    本发明提供一种激光二极管设备,包括一个壳体BEAR使用(1),具有安装部(11)和基于氮化物的化合物半导体材料的激光二极管芯片(2)上在所述壳体BEAR使用(1)上的安装部 (11),其中所述激光二极管芯片(2)通过焊料层(3)直接安装在所述安装部分(11)上,并且所述焊料层(3)具有大于或等于3μm的厚度

    INTEGRATED CHIP COMPRISING A DITCH
    4.
    发明申请
    INTEGRATED CHIP COMPRISING A DITCH 审中-公开
    集成芯片包括一个DITCH

    公开(公告)号:WO2011068459A1

    公开(公告)日:2011-06-09

    申请号:PCT/SE2010/051326

    申请日:2010-12-01

    摘要: Integrated chip (1) for data or telecommunication or optical analysis for one, two or more wavelengths, wherein the chip (1) has a basic structure which is identical, from a carrier and upwards over the entire surface of the chip, wherein waveguides are formed at the upper surface of the chip (1) by way of the basic structure being etched down so that protruding waveguides (2; 4; 5) are formed, and wherein the chip (1) comprises monolithically integrated components. The invention is characterized in that a ditch (7) is etched down along at least one of the sides of one of the waveguides and down to an etch depth that is at least so large so as to achieve a ditch that is optically isolating.

    摘要翻译: 用于一个,两个或更多个波长的数据或电信或光学分析的集成芯片(1),其中芯片(1)具有与载体相同的基本结构,并且在芯片的整个表面上向上,其中波导是 形成在所述芯片(1)的上表面,借助被蚀刻的基本结构,形成突出的波导(2; 4; 5),并且其中所述芯片(1)包括单片集成的部件。 本发明的特征在于,沿着一个波导的至少一个侧面向下蚀刻沟(7),并且至少至少大到蚀刻深度,以便实现光学隔离的沟。

    INTEGRATED CHIP COMPRISING A LASER AND A FILTER
    5.
    发明申请
    INTEGRATED CHIP COMPRISING A LASER AND A FILTER 审中-公开
    集成芯片,包括激光和过滤器

    公开(公告)号:WO2011068458A1

    公开(公告)日:2011-06-09

    申请号:PCT/SE2010/051325

    申请日:2010-12-01

    摘要: Integrated chip (1) for data or telecommunication or optical analysis for concurrent emission over at least one wavelength and receiving over at least one other wavelength, wherein the chip (1) has a basic structure which is identical, from a carrier and upwards over the entire surface of the chip (1), wherein waveguides are formed at the upper surface of the chip by way of the basic structure being etched down so that the protruding waveguides (2; 4; 5) are formed, and wherein the chip (1) comprises monolithically integrated components. The invention is characterized in that the chip (1) comprises a wavelength selective optical coupler (6), a grating based laser (41) attached to the coupler (6), a light detector (51) attached to the coupler (6) and a wavelength specific, grating based filter (52), in that both the laser (41) and the filter (52) are produced from the same monolithic basic structure, whereby the properties of the laser (41) and the filter (52) are altered in corresponding way as function of temperature, and in that the filter (52) is arranged between the laser (41) and the light detector (51) and is also opaque to the wavelengths emitted by the laser (41).

    摘要翻译: 用于数据或电信或光学分析的集成芯片(1),用于在至少一个波长上的并发发射并且在至少一个其它波长上接收,其中所述芯片(1)具有与载波相同的基本结构, 芯片(1)的整个表面,其中波导通过被蚀刻的基本结构形成在芯片的上表面处,使得形成突出的波导(2; 4; 5),并且其中芯片(1) )包括单片集成组件。 本发明的特征在于,芯片(1)包括波长选择性光耦合器(6),附接到耦合器(6)的基于光栅的激光器(41),附接到耦合器(6)的光检测器(51) 波长特定的基于光栅的滤光器(52),其中激光器(41)和滤光器(52)都由相同的单片基础结构产生,由此激光器(41)和滤光片(52)的性质是 以相应的方式作为温度变化,并且滤光器(52)布置在激光器(41)和光检测器(51)之间,并且对于由激光器(41)发射的波长也是不透明的。

    LASER SENSOR FOR SELF-MIXING INTERFEROMETRY WITH INCREASED DETECTION RANGE
    7.
    发明申请
    LASER SENSOR FOR SELF-MIXING INTERFEROMETRY WITH INCREASED DETECTION RANGE 审中-公开
    用于自动混合干涉仪的激光传感器,具有增加的检测范围

    公开(公告)号:WO2008135903A2

    公开(公告)日:2008-11-13

    申请号:PCT/IB2008/051648

    申请日:2008-04-29

    摘要: The present invention relates to a laser sensor for self-mixing interferometry. The laser sensor comprises at least one semiconductor laser light source emitting laser radiation and at least one photodetector (6) monitoring the laser radiation of the laser light source. The laser light source is a VECSEL having a gain medium (3) arranged in a layer structure (15) on a front side of a first end mirror (4), said first end mirror (4) forming an external cavity with an external second end mirror (5). The proposed laser sensor provides an increased detection range and can be manufactured in a low-cost production process.

    摘要翻译: 本发明涉及用于自混合干涉测量的激光传感器。 激光传感器包括发射激光辐射的至少一个半导体激光光源和监测激光光源的激光辐射的至少一个光电探测器(6)。 激光光源是具有在第一端镜(4)的前侧上布置成层状结构(15)的增益介质(3)的VECSEL,所述第一端镜(4)形成外部空腔 端镜(5)。 所提出的激光传感器提供了增加的检测范围,并且可以以低成本的生产过程制造。

    LASER DRIVERS FOR CLOSED PATH OPTICAL CABLES
    8.
    发明申请
    LASER DRIVERS FOR CLOSED PATH OPTICAL CABLES 审中-公开
    激光驱动器关闭路径光纤

    公开(公告)号:WO2007035521A2

    公开(公告)日:2007-03-29

    申请号:PCT/US2006/036093

    申请日:2006-09-15

    IPC分类号: H04J14/08

    摘要: Simplified laser drivers for closed path digital optical cables and digital optical cables including the simplified laser drivers. The laser driver can include less transistors than conventional laser drivers for optical communication cables. The laser can include a bias source and modulation source, The bias source can have a single constant current bias point for all laser diodes. The modulation current source can have a single temperature coefficient for all laser diodes. The laser driver can exclude, for example, any one of or combination of temperature compensation of the modulation or bias current sources, external programming of the modulation or bias current sources, power control based on output of the laser diode, and/or control based on feedback received from a monitor device or other sensor within the cables.

    摘要翻译: 用于闭路数字光缆和数字光缆的简化激光驱动器,包括简化的激光驱动器。 激光驱动器可以包括比用于光通信电缆的常规激光驱动器更少的晶体管。 激光器可以包括偏置源和调制源。偏置源可以为所有激光二极管提供单个恒定电流偏置点。 调制电流源可以具有所有激光二极管的单一温度系数。 激光驱动器可以例如排除调制或偏置电流源的温度补偿中的任何一种或组合,调制或偏置电流源的外部编程,基于激光二极管的输出的功率控制和/或基于 在来自监视器装置或电缆内的其他传感器的反馈。

    SINGULATED DIES IN A PARALLEL OPTICS MODULE
    9.
    发明申请
    SINGULATED DIES IN A PARALLEL OPTICS MODULE 审中-公开
    并联光模块中的单晶

    公开(公告)号:WO2006031412A1

    公开(公告)日:2006-03-23

    申请号:PCT/US2005/030413

    申请日:2005-08-26

    发明人: CREWS, Darren

    IPC分类号: H04B10/155

    摘要: A parallel optics module including singulated dies (114). A first singulated die includes a first semiconductor optical component, and a second die includes a second semiconductor optical component. The first and second dies are mounted to a substrate (112). The first and second dies to be integrated into a parallel optics module.

    摘要翻译: 一种并行光学模块,包括单个模具(114)。 第一分割裸片包括第一半导体光学部件,第二裸片包括第二半导体光学部件。 第一和第二模具安装到基板(112)上。 第一和第二模具被集成到并行光学模块中。