BACKING PAD FOR MACHINING OPERATIONS
    11.
    发明申请
    BACKING PAD FOR MACHINING OPERATIONS 审中-公开
    用于加工操作的支撑垫

    公开(公告)号:WO1995006544A1

    公开(公告)日:1995-03-09

    申请号:PCT/US1994009387

    申请日:1994-08-22

    CPC classification number: B24B37/30 B24B37/245

    Abstract: Backing pads (11) adapted for attachment to a pressure plate (14) for machining workpieces with the outer exposed surfaces of the pad having been abraded to eliminate surface irregularities and to achieve a desired flatness on the surface of the pad.

    Abstract translation: 衬垫(11)适于附接到用于加工工件的压板(14),其中衬垫的外部暴露表面被磨损以消除表面凹凸并且在衬垫表面上实现期望的平坦度。

    METHODS AND APPARATUS FOR MEASURING AND DISPENSING PROCESSING SOLUTIONS TO A CMP MACHINE
    12.
    发明申请
    METHODS AND APPARATUS FOR MEASURING AND DISPENSING PROCESSING SOLUTIONS TO A CMP MACHINE 审中-公开
    用于测量和分配处理解决方案到CMP机器的方法和装置

    公开(公告)号:WO1998014305A1

    公开(公告)日:1998-04-09

    申请号:PCT/US1997017825

    申请日:1997-10-01

    Abstract: Methods and apparatus for measuring and controlling the flow rates of processing solutions to a CMP machine during the polishing and planarization process. The apparatus comprises a processing solution source, a processing solution dispensing system for applying the solution to the CMP machine, a mechanism for transferring the processing solution from the solution source to the dispensing system, and a metering or sensing system for accurately measuring the amount of processing solution actually dispensed to the CMP machine. Preferably, the metering system comprises a coriolis mass flow meter and a controller for controlling its operation. The metering system may interface with the CMP machine controller in a feed-back loop configuration so that the actual flow rates of the solutions may be controlled in real time.

    Abstract translation: 用于在抛光和平坦化处理期间测量和控制CMP机器的处理溶液的流速的方法和装置。 该设备包括处理溶液源,用于将溶液施加到CMP机器的处理溶液分配系统,用于将处理溶液从溶液源转移到分配系统的机构,以及用于精确测量处理溶液的量的计量或感测系统 处理液实际分配给CMP机器。 优选地,计量系统包括科里奥利质量流量计和用于控制其操作的控制器。 计量系统可以以反馈回路配置与CMP机器控制器接口,以便实时控制溶液的实际流速。

    ADJUSTABLE WAFER CASSETTE STAND
    13.
    发明申请
    ADJUSTABLE WAFER CASSETTE STAND 审中-公开
    可调节水晶框架

    公开(公告)号:WO1998000855A1

    公开(公告)日:1998-01-08

    申请号:PCT/US1997010577

    申请日:1997-06-17

    CPC classification number: H01L21/67775 Y10S269/903 Y10S414/137

    Abstract: The present invention relates generally to a wafer cassette holding mechanism for use in processing wafers. The cassette holding mechanism has adjustable alignment posts to facilitate the cassette placement and an adjustment guide to guide placement of the cassette on the holding mechanism so that the holding mechanism may receive and securely hold in place a variety of different sizes and brands of cassettes.

    Abstract translation: 本发明一般涉及用于处理晶片的晶片盒保持机构。 盒子保持机构具有可调整的对准柱,以便于盒子放置和调节引导件,以引导将盒子放置在保持机构上,使得保持机构可以接收并牢固地保持各种不同尺寸和品牌的盒子。

    ABRASIVE FOAM GRINDING COMPOSITION
    14.
    发明申请
    ABRASIVE FOAM GRINDING COMPOSITION 审中-公开
    磨料泡沫磨料组合物

    公开(公告)号:WO1997043091A1

    公开(公告)日:1997-11-20

    申请号:PCT/US1997008652

    申请日:1997-05-15

    CPC classification number: B24D18/00 B24B37/245 B24D3/32

    Abstract: The present invention relates generally to abrasive stone pads for use in processing workpiece surfaces. The abrasive stones generally are produced by combining a phenolic resin mixture with a diluent and then injecting microballoon structures into the resin/diluent mixture to create a porous solution. The diluent is initially ball-milled with an abrasive in a tumbler to eliminate the agglomerates and is then added to a resin monomer. A suitable catalyst is added to the mixture to create a chemical reaction, further increasing the porocity of the substance. The mixture is poured into molds and through a filter of frit plate to remove excess resin and diluent. Finally, the mixture is cured, creating abrasive stones having a uniform surface and bulk structure with a uniform hardness, suitable for workpiece grinding.

    Abstract translation: 本发明一般涉及用于加工工件表面的磨料石垫。 研磨石通常通过将酚醛树脂混合物与稀释剂组合,然后将微球结构注入树脂/稀释剂混合物中以产生多孔溶液来制备。 稀释剂最初用研磨剂在滚筒中球磨,以除去附聚物,然后加入到树脂单体中。 将合适的催化剂加入到混合物中以产生化学反应,进一步增加物质的孔隙度。 将混合物倒入模具中并通过玻璃料过滤器以除去多余的树脂和稀释剂。 最后,混合物固化,形成具有均匀表面和块状结构的磨料,具有均匀的硬度,适用于工件研磨。

Patent Agency Ranking