公开(公告)号：WO1995006544A1

公开(公告)日：1995-03-09

申请号：PCT/US1994009387

申请日：1994-08-22

Applicant: SPEEDFAM CORPORATION

Inventor： SPEEDFAM CORPORATION ,  CESNA, Joseph, V. ,  KARLSRUD, Chris, E. ,  PRESTON, Spencer

IPC: B24B01/00

CPC classification number: B24B37/30 ,  B24B37/245

Abstract: Backing pads (11) adapted for attachment to a pressure plate (14) for machining workpieces with the outer exposed surfaces of the pad having been abraded to eliminate surface irregularities and to achieve a desired flatness on the surface of the pad.

Abstract translation: 衬垫（11）适于附接到用于加工工件的压板（14），其中衬垫的外部暴露表面被磨损以消除表面凹凸并且在衬垫表面上实现期望的平坦度。

公开(公告)号：WO1996002355A1

公开(公告)日：1996-02-01

申请号：PCT/US1995001694

申请日：1995-02-08

Applicant: SPEEDFAM CORPORATION

Inventor： SPEEDFAM CORPORATION ,  KARLSRUD, Chris, E. ,  VAN WOERKOM, Anthony, G. ,  ODAGIRI, Shigeru ,  NAGAHASHI, Isao ,  PRFSTON, Spencer

IPC: B24B07/22

CPC classification number: B24B37/08 ,  B24B37/345 ,  B24B49/16 ,  B24B51/00 ,  G05B19/41825 ,  G05B2219/37399 ,  G05B2219/45199 ,  G05B2219/45232 ,  G05B2219/49356 ,  G05B2219/49361 ,  G05B2219/50007 ,  G05B2219/50362 ,  G05B2219/50371 ,  G05B2219/50381 ,  G05B2219/50388 ,  H01L21/67745 ,  H01L21/67751 ,  H01L21/6838 ,  Y02P90/087

Abstract: A wafer polishing apparatus (100) includes a wafer polishing assembly (132) having a plurality of wafer carriers (139-143) for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface (134). A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers (139-143) by wafer holding apparatus of an index table (117). Similarly, a plurality of polished wafers are substantially simultaneously unloaded from the plurality of wafer carriers (139-143) into wafer holding apparatus of the index table (117). The wafer carriers (139-143) are individually computer (103) controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

Abstract translation: 晶片抛光装置（100）包括具有多个晶片载体（139-143）的晶片抛光组件（132），用于基本上同时抛光多个晶片抵靠旋转抛光表面（134）。 通过分度台（117）的晶片保持装置将待研磨的多个晶片基本上同时装载到多个晶片载体（139-143）中。 类似地，多个抛光晶片从多个晶片载体（139-143）基本上同时卸载到索引台（117）的晶片保持装置中。 晶片载体（139-143）是单独的计算机（103），用于精确抛光，并且可以通过不同的晶片载体同时满足不同的抛光要求。

公开(公告)号：WO1993025347A1

公开(公告)日：1993-12-23

申请号：PCT/US1993005541

申请日：1993-06-10

Applicant: SPEEDFAM CORPORATION

Inventor： SPEEDFAM CORPORATION ,  KARLSRUD, Chris, E. ,  VAN WOERKOM, Anthony, G. ,  ODAGIRI, Shigeru ,  NAGAHASHI, Isao

IPC: B24B37/04

CPC classification number: H01L21/6838 ,  B24B37/08 ,  B24B37/345 ,  B24B49/16 ,  B24B51/00 ,  G05B19/41825 ,  G05B2219/37399 ,  G05B2219/45026 ,  G05B2219/45199 ,  G05B2219/45232 ,  G05B2219/49356 ,  G05B2219/49361 ,  G05B2219/50007 ,  G05B2219/50362 ,  G05B2219/50371 ,  G05B2219/50381 ,  G05B2219/50388 ,  H01L21/67745 ,  H01L21/67751 ,  Y02P90/087

Abstract: A wafer polishing apparatus (100) includes a wafer polishing assembly (132) having a plurality of wafer carriers (139-143) for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface (134). A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers (139-143) by wafer holding apparatus of an index table (117). Similarly, a plurality of polished wafers are substantially simultaneously unloaded from the plurality of wafer carriers (139-143) into wafer holding apparatus of the index table (117). The wafer carriers (139-143) are individually computer (103) controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

Abstract translation: 晶片抛光装置（100）包括具有多个晶片载体（139-143）的晶片抛光组件（132），用于基本上同时抛光多个晶片抵靠旋转抛光表面（134）。 通过分度台（117）的晶片保持装置将待研磨的多个晶片基本上同时装载到多个晶片载体（139-143）中。 类似地，多个抛光晶片从多个晶片载体（139-143）基本上同时卸载到索引台（117）的晶片保持装置中。 晶片载体（139-143）是单独的计算机（103），用于精确抛光，并且可以通过不同的晶片载体同时满足不同的抛光要求。