公开(公告)号：WO2012116482A1

公开(公告)日：2012-09-07

申请号：PCT/CN2011/071368

申请日：2011-02-28

Applicant: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD. ,  RAI, Pradeep Kumar ,  BOCK, Kl ,  WANG, Li ,  HUANG, Jinxiang ,  TAI, En Yong ,  WANG, Jianhua ,  ONG, Kh

Inventor： RAI, Pradeep Kumar ,  BOCK, Kl ,  WANG, Li ,  HUANG, Jinxiang ,  TAI, En Yong ,  WANG, Jianhua ,  ONG, Kh

IPC: H01L21/68 ,  H01L21/67

CPC classification number: H01L21/6836 ,  H01L24/73 ,  H01L24/75 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/181 ,  Y10T29/53191 ,  Y10T29/53283 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A system is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The system includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.

Abstract translation: 公开了一种用于在半导体晶片切割工艺期间将半导体晶粒与胶带分离的模块，该芯片被固定到其上。 该系统包括用于将真空尖端定位在待除去的半导体管芯上的拾取臂。 真空尖端包括用于夹持半导体晶片的非均匀阵列的真空孔。