SYSTEM AND METHOD TO CONTROL PVD DEPOSITION UNIFORMITY

    公开(公告)号:WO2020214908A1

    公开(公告)日:2020-10-22

    申请号:PCT/US2020/028668

    申请日:2020-04-17

    Abstract: A physical vapor deposition chamber comprising a tilting substrate support is described. Methods of processing a substrate are also provided comprising tilting at least one of the substrate and the target to improve the uniformity of the layer on the substrate from the center of the substrate to the edge of the substrate. Process controllers are also described which comprise one or more process configurations causing the physical deposition chamber to perform the operations of rotating a substrate support within the physical deposition chamber and tilting the substrate support at a plurality of angles with respect to a horizontal axis.

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