Abstract:
Thickness measurement apparatus for measuring layer thicknesses on patterned areas of a semiconductor wafer, comprises: a spectrum analyzer for obtaining reflection data taken from a patterned area and obtaining therefrom a frequency spectrum, a peak detector for searching the spectrum to find peak frequencies within said spectrum, the search being restricted to regions corresponding to peak frequencies found in an earlier learning stage, a frequency filter (56), associated with the peak detector, for filtering the spectrum about said peak frequencies, and a maximum likelihood fitter (60) for using parameters obtained in the learning stage to carry out maximum likelihood fitting of said filtered spectrum to obtain the desired layer thicknesses. By carrying out maximum likelihood fitting (60) using parameters obtained beforehand in a high resolution non-real time learning stage, it is possible to provide high resolution results in real time.
Abstract:
An optical monitoring system for monitoring thin film deposition on a substrate includes a support bridge that is attached on an inside of a deposition chamber. The system further includes a fiber optic collimator having an optical fiber for incoming light, and another fiber optic collimator having an optical fiber for transmitted or reflected light from the substrate. The system further includes a shutter that is closed when a desired thin film thickness is deposited on the substrate.
Abstract:
Calibration techniques are disclosed for determining the rigid-body coordinate transformation that will precisely align the coordinate frame of a laser scanner with the coordinate frames of several different motion axes. The theory and use of at least these concepts are introduced by examining how these concepts aid the construction and use of a non-contact laser scanning system.
Abstract:
A system for measuring drill cuttings may comprise a conveyor belt disposed below a shaker, wherein the shaker disposes the drill cuttings on to the conveyor belt, and an imaging system connected to the conveyor belt by a frame, wherein the frame positions the imaging system to form a field of view on the conveyor belt with the imaging system. The system may further include an information handling system configured to operate the shaker and the conveyor belt. A method for identifying a size of drill cuttings may comprise dropping drill cuttings on a conveyor belt from a shaker, operating the conveyor belt to move the drill cuttings through a field of view, viewing the drill cuttings in the field of view with an imaging system, and sizing the drill cuttings based at least in part on one or more calibration blocks attached to the conveyor belt.
Abstract:
A system is described for inspecting a container having a top surface using light reflections and positional data. The system comprises a radiation source arranged such that the light beam projects radiation onto the top surface, wherein the radiation radiates along the outer edge of the container; a sensor, wherein the radiation is collected by the sensor reflected from the container using positional data, wherein the positional data is used to create a reference plane of the top of the top surface; and a processor operatively connected to the sensor, the processor integrates the positional data to detect defects in the container and creates a reference plane of a top surface of the container, wherein sensor captures the positional data of the container as the container moves on the conveyor; and the positional data is integrated using software to produce a 3D topographical map of the container.