OXYFUNCTIONALIZATION OF POLYOLEFINS
    21.
    发明申请
    OXYFUNCTIONALIZATION OF POLYOLEFINS 审中-公开
    聚烯烃的氧化功能

    公开(公告)号:WO2004099266A2

    公开(公告)日:2004-11-18

    申请号:PCT/US2004012715

    申请日:2004-04-26

    CPC classification number: C08C19/02 C08F8/06 C08F210/16

    Abstract: The present invention is a method for oxyfunctionalizing, that is, introducing oxygen functionality to, a polyolefin such as polypropylene and poly(ethylene-alt-propylene). The polyolefin is contacted with an oxygen source such as a persulfate and catalytic amounts of a metal porphyrin complex under mild conditions to yield an oxyfunctionalized polymer that has a polydispersity that is very similar to that of the starting polymer.

    Abstract translation: 本发明是一种氧化官能化方法,即将聚氧乙烯(聚丙烯)和聚(亚乙基 - 高级 - 丙烯)等聚烯烃引入氧官能度。 聚烯烃在温和条件下与氧源如过硫酸盐和催化量的金属卟啉络合物接触,得到具有与起始聚合物非常相似的多分散性的氧化官能化聚合物。

    HYDROGENATION OF UNSATURATED POLYMERS USING DIVALENT NON-AROMATIC ANIONIC DIENYL-CONTAINING GROUP IV METAL CATALYSTS
    22.
    发明申请
    HYDROGENATION OF UNSATURATED POLYMERS USING DIVALENT NON-AROMATIC ANIONIC DIENYL-CONTAINING GROUP IV METAL CATALYSTS 审中-公开
    使用非芳族非阳离子型含二烯基的IV族金属催化剂对不饱和聚合物的氢化

    公开(公告)号:WO1996018660A1

    公开(公告)日:1996-06-20

    申请号:PCT/US1995016005

    申请日:1995-12-11

    CPC classification number: C08C19/02 C08F8/04

    Abstract: Organic compounds are hydrogenated in the presence of certain mono- or bis(pentadienyl) divalent Group IV metal complexes. These titanium complexes are effective hydrogenation catalysts for polymers containing ethylenic unsaturation. They further provide for selective hydrogenation of ethylenic unsaturation sites in the presence of aromatic groups.

    Abstract translation: 有机化合物在某些单或双(戊二烯基)二价IV族金属络合物存在下氢化。 这些钛络合物是含有烯属不饱和键的聚合物的有效氢化催化剂。 它们进一步提供了在芳族基团存在下烯键式不饱和位点的选择性氢化。

    SYSTEMS AND METHODS FOR INCREASING STIMULATION DOSE
    23.
    发明申请
    SYSTEMS AND METHODS FOR INCREASING STIMULATION DOSE 审中-公开
    用于增加刺激剂量的系统和方法

    公开(公告)号:WO2012078413A1

    公开(公告)日:2012-06-14

    申请号:PCT/US2011/062451

    申请日:2011-11-29

    Abstract: A system embodiment comprises a neural stimulator and a controller. The neural stimulator is configured to deliver neural stimulation therapy to the patient. The controller is configured to perform a programmed routine to intermittently and incrementally increase a dose of the neural stimulation therapy to increase the dose by a plurality of dose increments over time, deliver the neural stimulation using the increased dose after each of the plurality of dose increments, monitor for a patient-controlled request to reduce the dose, and respond to the patient-controlled request by reducing the dose by at least one of the plurality of dose increments.

    Abstract translation: 系统实施例包括神经刺激器和控制器。 神经刺激器配置为向患者传递神经刺激疗法。 控制器被配置为执行编程程序以间歇地和递增地增加神经刺激治疗的剂量,以随着时间推移多个剂量增量来增加剂量,在多个剂量增量中的每一个之后使用增加的剂量递送神经刺激 监测患者控制的请求以减少剂量,并且通过以多个剂量增量中的至少一个减小剂量来响应患者控制的请求。

    CREASABLE, PRINTABLE ENVELOPE STOCK
    24.
    发明申请

    公开(公告)号:WO2008020959A3

    公开(公告)日:2008-02-21

    申请号:PCT/US2007/016561

    申请日:2007-07-23

    Abstract: The invention includes an envelope stock composition comprising at least one spunbond nonwoven web and at least one microporous film. The invention also includes a process of preparing a envelope stock of at least one spunbond nonwoven web and at least one microporous film comprising (a) supplying spunbond nonwoven web, (b) and applying either (b1) at least one polymer coating containing at least about 10 weight percent filler in at least the outermost layer or a polyolefin film containing at least about 10 weight percent filler or (b2) at least one microporous film; and, (c) in the case of (b1 ), activating each coating or film to render it microporous. Additionally, the invention includes a process of making an envelope comprising steps of (a) folding envelope stock comprising at least one spunbond nonwoven web and at least one microporous film such that there is at least one area of overlap having at least two overlapping portions, (b) applying adhesive to at least one overlapping portion and (c) contacting the overlapping portions such that at least one seam is formed The invention also includes an article comprising an envelope stock comprising at least one spunbond nonwoven web and at least one microporous film.

    AMPHIPHILIC BLOCK COPOLYMER-TOUGHENED EPOXY RESINS
    25.
    发明申请
    AMPHIPHILIC BLOCK COPOLYMER-TOUGHENED EPOXY RESINS 审中-公开
    聚合嵌段共聚物环氧树脂

    公开(公告)号:WO2006052729A8

    公开(公告)日:2007-12-13

    申请号:PCT/US2005039965

    申请日:2005-11-02

    CPC classification number: C08L63/00 C08L71/02 C08L2666/02 C08L2666/22

    Abstract: A curable epoxy resin composition including (a) a thermosettable epoxy resin; and (b) an amphiphilic block copolymer containing at least one epoxy resin miscible block segment and at least one epoxy resin immiscible block segment; wherein the immiscible block segment comprises at least one polyether structure provided that the polyether structure of said immiscible block segment contains at least one or more alkylene oxide monomer units having at least four carbon atoms, such that when the epoxy resin composition is cured, the toughness of the resulting cured epoxy resin composition is increased. The amphiphilic block copolymer is preferably an all polyether block copolymer such as a PEO-PBO diblock copolymer or a PEO-PBO-PEO triblock copolymer.

    Abstract translation: 一种可固化环氧树脂组合物,其包含(a)可热固化环氧树脂; 和(b)含有至少一种环氧树脂混溶性嵌段和至少一种环氧树脂不混溶嵌段的两亲性嵌段共聚物; 其中所述不混溶性嵌段部分包含至少一种聚醚结构,条件是所述不混溶嵌段的聚醚结构含有至少一个或多个具有至少四个碳原子的环氧烷单体单元,使得当环氧树脂组合物固化时,韧性 得到的固化环氧树脂组合物增加。 两亲性嵌段共聚物优选为全聚醚嵌段共聚物,例如PEO-PBO二嵌段共聚物或PEO-PBO-PEO三嵌段共聚物。

    SACRIFICIAL STYRENE BENZOCYCLOBUTENE COPOLYMERS FOR MAKING AIR GAP SEMICONDUCTOR DEVICES
    28.
    发明申请
    SACRIFICIAL STYRENE BENZOCYCLOBUTENE COPOLYMERS FOR MAKING AIR GAP SEMICONDUCTOR DEVICES 审中-公开
    用于制造空气隙半导体器件的亲水苯乙烯双酚共聚物

    公开(公告)号:WO2004072133A1

    公开(公告)日:2004-08-26

    申请号:PCT/US2004/002658

    申请日:2004-01-30

    Abstract: A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is a copolymer of styrene or styrene derivative (such as alpha methyl styrene) and vinylbenzocyclobutene or a vinylbenzocyclobutene derivative. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is a copolymer of styrene or styrene derivative and vinylbenzocyclobutene or a vinylbenzocyclobutene derivative.

    Abstract translation: 一种通过以下步骤在半导体结构内形成气隙的方法:(a)使用牺牲聚合物占据半导体结构中的空间; 并且(b)加热半导体结构以分解在半导体结构内留下空隙的牺牲聚合物,其中步骤(a)的牺牲聚合物是苯乙烯或苯乙烯衍生物(例如α-甲基苯乙烯)和乙烯基苯并环丁烯或 乙烯基苯并环丁烯衍生物。 另外,具有位于导体线之间的牺牲聚合物的半导体结构,其中牺牲聚合物是苯乙烯或苯乙烯衍生物与乙烯基苯并环丁烯或乙烯基苯并环丁烯衍生物的共聚物。

    CYCLIC BLOCK COPOLYMER COMPOSITION AND THIN WALL GUIDE PLATE MADE THEREOF
    30.
    发明申请
    CYCLIC BLOCK COPOLYMER COMPOSITION AND THIN WALL GUIDE PLATE MADE THEREOF 审中-公开
    周期性嵌段共聚物组合物和薄壁导板

    公开(公告)号:WO2010096106A1

    公开(公告)日:2010-08-26

    申请号:PCT/US2009/061801

    申请日:2009-10-23

    CPC classification number: C08F297/04 C08L53/025 G02B1/045 G02B6/0011

    Abstract: A cyclic block copolymer composition that comprises a cyclic block copolymer resin with a pre-hydrogenation polymerized vinyl aromatic monomer content within a range of from 75 wt% to 90 wt%, based upon total pre-hydrogenation vinyl aromatic-conjugated diene block copolymer weight, a Mw within a range of from 30,000 g/M to 125,000 g/M, a shear viscosity at a shear rate of 1000 sec -1 and a temperature of 280 °C of less than 50 pascal seconds (Pa-s), an unnotched Izod toughness (ASTM D256)) at room temperature ≥ 1.8 foot-pounds per inch (315.2 newtons per meter), and a tensile modulus (ASTM D638) ≥ 280,000 psi (1930.5 MPa) yields a variety of articles of manufacture, especially a thin wall light guide panel that has a diagonal measure ≥ 13.3 inches (33.8 cm).

    Abstract translation: 一种环状嵌段共聚物组合物,其包含基于总预加氢乙烯基芳族 - 共轭二烯嵌段共聚物总重量的75重量%至90重量%的预氢化聚合乙烯基芳族单体含量的环状嵌段共聚物树脂, 在30,000g / M至125,000g / M的范围内的Mw,剪切速率为1000sec -1的剪切粘度和280℃的温度低于50帕斯卡秒(Pa-s),无缺口的 Izod韧性(ASTM D256))在室温下= 1.8英尺磅/英寸(315.2牛顿每米),拉伸模量(ASTM D638)= 280,000psi(1930.5MPa)产生各种制品,特别是薄 墙壁导光板,对角线测量= 13.3英寸(33.8厘米)。

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