公开(公告)号：WO2012142068A2

公开(公告)日：2012-10-18

申请号：PCT/US2012/032980

申请日：2012-04-11

Applicant: MOLEX INCORPORATED ,  ACHAMMER, Daniel G. ,  MCGOWAN, Daniel B. ,  ZADEREJ, Victor

Inventor： ACHAMMER, Daniel G. ,  MCGOWAN, Daniel B. ,  ZADEREJ, Victor

IPC: F21V29/00 ,  F21V17/00

CPC classification number: F28F3/02 ,  F21K9/00 ,  F21K9/233 ,  F21K9/60 ,  F21V29/70 ,  F21V29/713 ,  F21V29/74 ,  F21V29/773 ,  F21V29/83 ,  F21Y2115/10

Abstract: An LED array is thermally coupled to a heat spreader and a heat sink. The heat sink has a base and a plurality of fins extending from the base. Each fin includes a lower portion which extends outwardly from the base and downwardly from the heat spreader, and an upper portion that extends upwardly from the base and is offset from the lower portion so as to form a junction. An aperture may be provided through each junction to allow air to pass therethrough. The heat spreader may also have fins.

Abstract translation: LED阵列热耦合到散热器和散热器。 散热器具有从基座延伸的基部和多个翅片。 每个翅片包括从基座向外延伸并从散热器向下延伸的下部，以及从基部向上延伸并从下部偏移以形成接合部的上部。 可以通过每个结点设置孔，以允许空气通过。 散热器也可以具有翅片。

公开(公告)号：WO2011037655A1

公开(公告)日：2011-03-31

申请号：PCT/US2010/035182

申请日：2010-05-18

Applicant: MOLEX INCORPORATED ,  ZADEREJ, Victor ,  MCGOWAN, Daniel, B. ,  NGUYEN, Dan ,  GRZEGORZEWSKA, Barbara ,  PICINI, Michael

Inventor： ZADEREJ, Victor ,  MCGOWAN, Daniel, B. ,  NGUYEN, Dan ,  GRZEGORZEWSKA, Barbara ,  PICINI, Michael

IPC: F21V17/10 ,  F21V15/00 ,  F21V19/00 ,  F21V21/00 ,  F21V29/00 ,  H01L33/00

CPC classification number: F21V23/06 ,  F21K9/00 ,  F21K9/20 ,  F21S2/005 ,  F21S4/00 ,  F21V17/14 ,  F21V17/162 ,  F21V17/164 ,  F21V19/001 ,  F21V21/00 ,  F21V29/004 ,  F21V29/773 ,  F21V29/85 ,  F21Y2115/10

Abstract: A light module system includes a receptacle, which may be mounted on a support surface, such as a heat sink, and further includes a cover and an LED assembly rotateably coupled to the cover. The LED assembly seats within the receptacle which causes terminals of the LED assembly to align with contacts on the receptacle. One of the cover and the receptacle has a plurality of ramps and the other has a plurality of shoulders. The cover can be rotated relative to the receptacle to cause the shoulders to slide relative to the ramps so as to direct the LED assembly into the receptacle. When the LED assembly is attached to the receptacle, the terminals on the LED assembly mate with the contacts on the receptacle.

Abstract translation: 光模块系统包括可以安装在诸如散热器的支撑表面上的插座，并且还包括可旋转地联接到盖的盖和LED组件。 LED组件位于插座内，使LED组件的端子与插座上的触点对准。 盖和插座中的一个具有多个斜面，另一个具有多个肩部。 盖可以相对于插座转动，以使肩部相对于斜面滑动，以便将LED组件引导到插座中。 当LED组件连接到插座时，LED组件上的端子与插座上的触点配合。

公开(公告)号：WO2010107781A2

公开(公告)日：2010-09-23

申请号：PCT/US2010/027463

申请日：2010-03-16

Applicant: MOLEX INCORPORATED ,  ZADEREJ, Victor ,  MCGOWAN, Daniel B. ,  PICINI, Michael C.

Inventor： ZADEREJ, Victor ,  MCGOWAN, Daniel B. ,  PICINI, Michael C.

IPC: F21V9/00

CPC classification number: F21V29/71 ,  F21K9/00 ,  F21K9/23 ,  F21V13/04 ,  F21V17/005 ,  F21V29/505 ,  F21V29/70 ,  F21V29/713 ,  F21V29/717 ,  F21V29/74 ,  F21V29/77 ,  F21V29/773 ,  F21V29/80 ,  F21V29/83 ,  F21V29/85 ,  F21V29/87 ,  F21V29/89 ,  F21Y2101/02 ,  F21Y2115/10 ,  Y10S362/80

Abstract: An LED array is mounted on a base that is thermally coupled to a heat spreader. At least one aperture is provided between the support area and an edge of the heat spreader. The heat spreader may be coupled to a thermal pad which has sufficient thermal conductivity and is sufficiently thin to allow the thermal resistivity between the heat spreader and a corresponding heat sink to be below a predetermined value.

Abstract translation: LED阵列安装在热耦合到散热器的基座上。 在支撑区域和散热器的边缘之间提供至少一个孔。 散热器可以耦合到热垫，其具有足够的导热性并且足够薄以允许散热器和相应的散热器之间的热阻率低于预定值。

公开(公告)号：WO2006055698A1

公开(公告)日：2006-05-26

申请号：PCT/US2005/041655

申请日：2005-11-17

Applicant: MOLEX INCORPORATED ,  ZADEREJ, Victor ,  RAMEY, Samuel, C. ,  BEREK, Dennis ,  KAMARAUSKAS, Michael, R. ,  DAMBACH, Philip, J.

Inventor： ZADEREJ, Victor ,  RAMEY, Samuel, C. ,  BEREK, Dennis ,  KAMARAUSKAS, Michael, R. ,  DAMBACH, Philip, J.

IPC: G01F1/00

CPC classification number: G01F1/00 ,  H01R12/721 ,  H01R13/6683 ,  H01R31/06

Abstract: An assembly (118) is provided for mating a sensor (22) to a connector (24). The assembly includes an interconnect device (20, 120) and a housing (174a-174b). The interconnect device has conductive pathways (40, 154) provided thereon. The sensor is mounted on the interconnect device and is in electrical communication with the conductive pathways. The housing generally surrounds a portion of said interconnect device. The housing is formed of two portions which mate together. At least one flow tube (178) is attached to the housing. A gasket seals the sensor to the housing.

Abstract translation: 提供了用于将传感器（22）配合到连接器（24）的组件（118）。 组件包括互连装置（20,120）和壳体（174a-174b）。 互连装置具有设置在其上的导电通路（40,154）。 传感器安装在互连装置上并与导电通路电连通。 壳体通常围绕所述互连装置的一部分。 外壳由配合在一起的两部分组成。 至少一个流动管（178）附接到壳体。 垫圈将传感器密封到外壳。

公开(公告)号：WO2005067357A1

公开(公告)日：2005-07-21

申请号：PCT/US2004/043094

申请日：2004-12-24

Applicant: MOLEX INCORPORATED

Inventor： BRUNKER, David, L. ,  ZADEREJ, Victor

IPC: H05K3/10

CPC classification number: H01P3/02 ,  H05K1/024 ,  H05K3/107 ,  H05K2201/0187 ,  H05K2201/09036 ,  H05K2201/09236 ,  H05K2201/09981

Abstract: A transmission line for high-frequency differential signals and having a transforming impedance is formed into a substrate. The transmission line is comprised of a slot, the opposing surfaces of which carry a conductive surface capable of carrying electrical signals. The conductive surface on the opposing surfaces is gradually receded along a length of the slot. An equivalent amount of metallization is applied on the substrate's surface and electrically continuous with conductive surfaces on the slot's opposing sidewalls. The metallization on the substrate's surface provide solder lands. Dielectric in the slot prevents solder wicking.

Abstract translation: 用于高频差分信号并具有变换阻抗的传输线被形成为衬底。 传输线包括一个槽，其相对表面承载能承载电信号的导电表面。 相对表面上的导电表面沿着槽的长度逐渐减小。 在衬底的表面上施加等量的金属化，并且与槽的相对侧壁上的导电表面电连接。 衬底表面上的金属化提供焊接区域。 插槽中的介质防止焊锡芯吸。

公开(公告)号：WO2005065000A1

公开(公告)日：2005-07-14

申请号：PCT/US2004/043882

申请日：2004-12-23

Applicant: MOLEX INCORPORATED

Inventor： BRUNKER, David, L. ,  ZADEREJ, Victor

IPC: H05K3/10

CPC classification number: H05K9/0018 ,  H01P3/023 ,  H05K1/0221 ,  H05K1/024 ,  H05K3/107 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09236 ,  H05K2201/09618 ,  H05K2201/09981

Abstract: An electro-magnetically shielded slot-transmission line is formed by metallizing the opposing sides of a slot cut through a dielectric substrate. A ground plane is deposited on the bottom of the substrate. Conductive vias through the substrate and that contact the ground plane are located on both sides of the metallized slot surfaces. Conductive pads on the upper surface and which contact the vias provide additional shielding.

Abstract translation: 通过金属化通过电介质基板切割的槽的相对侧而形成电磁屏蔽槽传输线。 接地平面沉积在基底的底部。 通过基板并接触接地平面的导电孔位于金属化槽表面的两侧。 上表面上的导电焊盘与通孔接触提供额外的屏蔽。

公开(公告)号：WO2004084421A3

公开(公告)日：2004-09-30

申请号：PCT/US2004/007841

申请日：2004-03-15

Applicant: MOLEX INCORPORATED ,  ZADEREJ, Victor ,  BRUNKER, David, L. ,  DAMBACH, Phillip, J.

Inventor： ZADEREJ, Victor ,  BRUNKER, David, L. ,  DAMBACH, Phillip, J.

IPC: H01P3/02

Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.

公开(公告)号：WO2003038950A1

公开(公告)日：2003-05-08

申请号：PCT/US2002/033946

申请日：2002-10-23

Applicant: MOLEX INCORPORATED

Inventor： ZADEREJ, Victor ,  LaMIRAND, Gregory, R. ,  SMITH, Eric, C.

IPC: H01R13/514

CPC classification number: H01R13/514 ,  H01R13/518 ,  H01R13/6599 ,  H05K5/0021

Abstract: A modular system is provided for arranging a plurality of electrical connector assemblies in a stacked array. The system includes at least a pair of electrical connector assemblies stackable one on top of another. Each assembly includes a frame structure having input and output faces, with an interior cavity between the faces. Input and output connectors are respectively mounted at the input and output end faces and project outwardly therefrom. A circuit board is located in the interior cavity and is electrically connected between the input and output connectors. A pair of end flanges project outwardly from at least one of the input and output end faces above and below the respective input or output connector to protect the respective connector. The end flanges have fastening portions to facilitate holding the frame structures and, thereby, the electrical connector assemblies in the stacked array. Electrical connectors also are coupled between the circuit boards of the stacked connector assemblies through the frame structures thereof.

Abstract translation: 提供了用于将多个电连接器组件布置成堆叠阵列的模块化系统。 该系统包括至少一对电连接器组件，其一个可堆叠在另一个之上。 每个组件包括具有输入和输出面的框架结构，在面之间具有内腔。 输入和输出连接器分别安装在输入和输出端面并向外突出。 电路板位于内腔中，电连接在输入和输出连接器之间。 一对端部凸缘从相应的输入或输出连接器上方和下方的输入和输出端面中的至少一个向外突出，以保护相应的连接器。 端部凸缘具有紧固部分，以便于将框架结构以及由此的电连接器组件保持在堆叠阵列中。 电连接器还通过其框架结构连接在堆叠的连接器组件的电路板之间。